Automatic alignment parallel seal welding method for microelectronic packaging in high vacuum state

A technology of microelectronic packaging and parallel sealing and welding, which is used in microstructure devices, manufacturing microstructure devices, decorative arts, etc., to achieve the effects of improving weld quality, saving investment costs, and accurate and automatic alignment.

Pending Publication Date: 2022-03-22
西北电子装备技术研究所
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The invention provides an automatic alignment parallel sealing and welding mechanism for microelectronic packaging in a high vacuum state, which solves how to complete the high-qua

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  • Automatic alignment parallel seal welding method for microelectronic packaging in high vacuum state
  • Automatic alignment parallel seal welding method for microelectronic packaging in high vacuum state
  • Automatic alignment parallel seal welding method for microelectronic packaging in high vacuum state

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[0025] The present invention will be described in detail below with reference to the accompanying drawings:

[0026] A high vacuum state microelectronics automatically parallel sealing mechanism, including high vacuum sealed welding chambers, in high vacuum closed welding chambers 330, front of the gantry 330 in the welding mechanism On the side, horizontally disposable with aligned grab cover transverse guide rail 331, and the actuator mounting slider 332 is disposed on the alignment cap plate lateral guide rail 331, and connected to the grab mechanism mounting slider 332. There is a grabbing nut connecting block 333, and the grab connection block 333 is screwed together by grabing the bit nut 334 and the grab horizontal pair of grabs 335, and the horizontal pair screw 335 is passed. The 90-degree commutator 336 is connected together with the reversing vertical screw, and the other end of the vertical screw is connected to the sealing magnetic fluid and the sealing cavity to be c...

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Abstract

The invention discloses an automatic alignment parallel seal welding method for microelectronic packaging in a high vacuum state, and solves the problem of how to complete high-quality parallel seal welding of a cover plate and a tube shell of a thin-shell device at low cost in a vacuum environment. A floating parallel welding wheel support is arranged, two parallel welding wheels on the support are pressed on parallel welding seams between a cover plate and a tube shell in a floating mode, weights are arranged at the top end of the parallel welding wheel support, and the welding pressure of the parallel welding wheels on the welding seams is adjusted by increasing or reducing the number of the weights. The adjustment of self-adaptive welding pressure in the welding process is realized; a shoulder-pole-shaped semi-square-shaped jacking frame body is arranged between a left parallel welding wheel support and a right parallel welding wheel support, the floating parallel welding wheel supports are lifted and lowered through jacking connection of an eccentric wheel to the semi-square-shaped jacking frame body, a tray conveying driving motor is installed outside a closed cavity, and conveying of trays in the cavity is completed at low cost; and the cover plate and the tube shell can be accurately aligned.

Description

technical field [0001] The invention relates to a microelectronic package device, in particular to a mechanism and a welding method for automatic parallel welding of a thin shell device cover plate and a tube shell in a microelectronic package assembly in a high vacuum chamber. Background technique [0002] Microelectronic packaging and assembly (MEMS devices), that is, using film technology and micro-processing technology to arrange, paste, fix and connect chips and other elements on the frame or substrate, lead out the connection terminals, and potting and fixing them through plastic insulating media. Then, according to the electrical schematic diagram or logic diagram, using microelectronic technology and high-density assembly technology, microelectronic devices and micro-miniature components are assembled into applicable and producible electronic components, components or a technical process of a system; currently, vacuum packaging The equipment is changing from a single...

Claims

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Application Information

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IPC IPC(8): B81C1/00
CPCB81C1/00269Y02P70/50
Inventor 李少飞吕麒鹏王成君杨晓东武春晖陈洪
Owner 西北电子装备技术研究所
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