Method for manufacturing chemical mechanical polishing dresser

Abstract

The invention discloses a method for manufacturing a chemical mechanical polishing finisher, and belongs to the technical field of laser finish machining. A platform of the machining system comprises a purple picosecond laser, a laser light path, a three-dimensional scanning galvanometer and a three-axis numerical control platform, a laser beam is output from the purple picosecond laser and enters the three-dimensional scanning galvanometer through the laser light path, the three-dimensional scanning galvanometer controls laser to conduct rapid scanning machining on a ceramic matrix on the three-axis numerical control platform in the three-dimensional direction, and the three-dimensional scanning galvanometer conducts three-dimensional machining on the ceramic matrix on the three-axis numerical control platform. And then a diamond film with the uniform thickness is deposited on the surface of the base body through hot filament chemical vapor deposition, and the chemical mechanical polishing trimmer is manufactured. According to the manufacturing method, precision machining of microstructures of different structures, sizes and intervals is achieved, the problems that the size and shape of a diamond abrasive of a traditional trimmer are weak, and the diamond holding force is weak are solved, then the trimming quality and efficiency of a polishing pad are guaranteed, and the polishing quality of chemical mechanical polishing of wafers is improved.

Description

technical field [0001] The invention belongs to the technical field of laser precision machining, and in particular relates to a method for manufacturing a chemical mechanical polishing trimmer. Background technique [0002] The ultra-planar processing of wafers is the basis for realizing the precision manufacturing of semiconductor chips, and the chemical mechanical polishing (CMP) process is an indispensable technology for realizing ultra-planar processing of wafers. The CMP process relies on the combination of chemical action and mechanical action to polish the surface of the wafer through the polishing pad and polishing liquid. However, during the polishing process, the polishing pad will age due to elastic fatigue, which will reduce the surface roughness. The debris and impurities will block the pores of the polishing pad, glaze the surface of the polishing pad, and lose the polishing function. It is necessary to use a chemical mechanical polishing conditioner to dress ...

AI Technical Summary

Problems solved by technology

[0005] In view of the deficiencies in the above-mentioned background technology, the present invention proposes a method for manufacturing a chemical mechanical polishing trimmer, which uses laser precision machining technology to process the pyramid microstructure array on the substrate, which can effectively solve the problem of difficult processing and processing of the three-dimensional microstructure on the surface of the ceramic substrate. The problem of low efficiency and serious wear of the grinding wheel can realize precision machining of microstructures with different structures, sizes, and spacings, and solve the problems of non-uniform size, shape, orientation, and exposed height of diamond abrasives in traditional dressers, as well as weak diamond holding power. Ensure the trimming quality and efficiency of the polishing pad and improve the CMP polishing quality of the wafer

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