Organic silicon adhesive for packaging LED (light-emitting diode) chip

A technology of LED chips and silicone adhesives, applied in the direction of adhesives, non-polymer adhesive additives, adhesive additives, etc., to achieve the effect of excellent hardness

Pending Publication Date: 2022-04-05
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention aims at the deficiencies in the existing ultraviolet LED packaging glue, and provides an organic silica gel adhesive for LED chip packaging

Method used

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  • Organic silicon adhesive for packaging LED (light-emitting diode) chip
  • Organic silicon adhesive for packaging LED (light-emitting diode) chip
  • Organic silicon adhesive for packaging LED (light-emitting diode) chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Methylphenyl vinyl silicone resin 800g (j+k+l=20; Wherein: j=5, k=5, l=10), platinum catalyst chloroplatinic acid alcohol solution (platinum content is 3000ppm) 1g, ring Oxygen-modified binder 50g Structural formula one, methylphenyl hydrogen-containing silicone resin 60ga=2, b=6, c=6, epoxy acrylic acid modified hydrogen-containing silicone oil 30g (n=10, m=10), inhibition Agent ethynyl cyclopentanol 1g.

Embodiment 2

[0025] Methylphenyl vinyl silicone resin 950g (j+k+l=14; Wherein: j=1, k=1, l=12), platinum catalyst agent platinum-vinylsiloxane complex (platinum content 3000ppm) 3g, epoxy modified adhesive 150g structural formula 2, component B includes 70g of methyl phenyl hydrogen-containing silicone resin (a=2, b=3, c=6), epoxy acrylic acid modified hydrogen-containing Silicone oil 40g (n=20, m=20), inhibitor tetramethyltetravinylcyclotetrasiloxane 2g.

Embodiment 3

[0027] Methylphenyl vinyl silicone resin 900g (j+k+l=18; wherein: j=4, k=4, l=10), catalyst platinum olefin complex (platinum content is 3000ppm) 2g, epoxy modified 100g structural formula 1, component B includes 70g of methylphenyl hydrogen-containing silicone resin (a=2, b=6, c=6), 35g of epoxy acrylic modified hydrogen-containing silicone oil (n=10, m =20), inhibitor ethynyl cyclohexanol 1.5g.

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Abstract

The invention relates to an organic silicon adhesive used for LED chip packaging, the organic silicon adhesive comprises a component A and a component B. The component A comprises 80-95 parts by weight of methyl phenyl vinyl silicone resin, 0.1-0.3 part by weight of a platinum catalyst and 5-15 parts by weight of an epoxy modified binder, and the component B comprises 60-70 parts by weight of methyl phenyl hydrogen-containing silicone resin, 30-40 parts by weight of epoxy acrylic acid modified hydrogen-containing silicone oil and 1-2 parts by weight of an inhibitor. The high-temperature-resistant retention rate of the packaging adhesive provided by the invention can be kept at 90% or above, the double 85 aging of the packaging adhesive is 14-15% higher than that of common glue, the packaging adhesive can better resist double 85, and the packaging adhesive can meet the international lighting standard when the luminous decay is reduced by 5% or below in the luminous decay test 1000H.

Description

technical field [0001] The invention relates to a silicone adhesive used for LED chip packaging, belonging to the technical field of adhesives. Background technique [0002] Semiconductor lighting based on LED technology has the characteristics of high efficiency, energy saving, environmental protection, long life, and easy maintenance, and is known as a new light source in the 21st century. However, with the development of high-power LED devices, new requirements are put forward for the refractive index and reliability of packaging materials. [0003] At present, the refractive index of domestic high-refractive index LED packaging silica gel can reach between 1.50-1.55. Due to the characteristics of the material itself, there are still many problems; one is that the base material of the LED bracket is constantly changing. Various coupling agents that currently exist in the market have been added to it, but it still cannot fully meet the increasing requirements of the marke...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J183/05C09J11/06
Inventor 徐庆锟王建斌徐友志陈田安
Owner YANTAI DARBOND TECH
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