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Environment-friendly high-Tg low-dielectric copper-clad plate and preparation process thereof

A preparation process and low-dielectric technology, applied in electrophoretic plating, electrolytic coatings, coatings, etc., can solve the problems of low glass transition temperature, poor heat resistance, and increased dielectric loss of copper clad laminates, and improve the electrical conductivity. performance, improve flame retardant performance, reduce the effect of dielectric loss

Active Publication Date: 2022-04-22
NANTONG RODA ELECTRON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing copper clad laminates on the market mostly use epoxy resin and amine curing system, resulting in many defects such as increased dielectric loss, poor heat resistance, and low glass transition temperature of copper clad laminates.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] A preparation process of an environment-friendly high Tg low dielectric copper clad laminate, comprising the following steps:

[0032] (1) Preparation of microsphere filler: Weigh the following raw materials in parts by weight, SiO 2 for 70 copies, B 2 o 3 The content is 20 parts, Na 2 O is 3 parts, K 2 O is 0.5 part, BaO is 0.5 part; mix each component evenly and add it into the melting furnace, the temperature in the melting furnace is controlled at 1450 ° C, until it is completely melted, quenched, crushed and classified, and the filler with a particle size of 1-10 μm is obtained Particles, the filler particles are transported to the spheroidizing furnace, spheroidized for 1 hour at a temperature of 1320 ° C, and cooled rapidly to obtain microsphere fillers;

[0033] (2) Preparation of electrophoretic fluid: the microsphere filler prepared by step (1) is dissolved in a mixed acid solution of sulfuric acid and nitric acid with a mass ratio of 3:1, activated for 2h...

Embodiment 2

[0043] A preparation process of an environment-friendly high Tg low dielectric copper clad laminate, comprising the following steps:

[0044] (1) Preparation of microsphere filler: Weigh the following raw materials in parts by weight, SiO 2 for 72 copies, B 2 o 3 The content is 20 parts, Na 2 O is 5 parts, K 2 O is 1 part, BaO is 0.7 part; mix each component evenly and add it into the melting furnace, the temperature in the melting furnace is controlled at 1470 ° C, until it is completely melted, quenched, crushed and classified, and the filler with a particle size of 1-10 μm is obtained Particles, transport the filler particles to a spheroidizing furnace, spheroidize for 2 hours at a temperature of 1350°C, and cool rapidly to obtain microsphere fillers;

[0045] (2) Preparation of electrophoretic solution: the microsphere filler prepared in step (1) is dissolved in a mixed acid solution of sulfuric acid and nitric acid with a mass ratio of 3:1, activated for 2.5h, filtere...

Embodiment 3

[0055] A preparation process of an environment-friendly high Tg low dielectric copper clad laminate, comprising the following steps:

[0056] (1) Preparation of microsphere filler: Weigh the following raw materials in parts by weight, SiO 2 for 72 copies, B 2 o 3 The content is 23 parts, Na 2 O is 6 parts, K 2 O is 2 parts, BaO is 1 part; mix all components evenly and add to the melting furnace, the temperature in the melting furnace is controlled at 1500°C, until it is completely melted, quenched, crushed and classified to obtain fillers with a particle size of 1-10 μm Particles, transport the filler particles to a spheroidizing furnace, spheroidize for 2 hours at a temperature of 1350°C, and cool rapidly to obtain microsphere fillers;

[0057] (2) Preparation of electrophoretic fluid: the microsphere filler prepared by step (1) is dissolved in a mixed acid solution of sulfuric acid and nitric acid with a mass ratio of 3:1, activated for 3h, filtered, and washed with sodi...

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PUM

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Abstract

The invention discloses an environment-friendly high-Tg low-dielectric copper-clad plate and a preparation process thereof. The preparation process of the copper-clad plate comprises the following steps: 1, weighing SiO2, B2O3 and Na2O according to a certain proportion, mixing, melting, quenching, crushing, grading and spheroidizing to obtain a microsphere filler with the particle size of 1-10 microns; 2, after the microsphere filler is activated by a mixed acid solution and sensitized by a mixed solution of SnCl2, PdCl2 and HCl, the microsphere filler, sodium carboxymethyl cellulose and polyvinyl alcohol are prepared into an electrophoresis solution; and 3, depositing the microsphere filler on the surface of the copper foil through an electrophoresis method. 4, the copper foil obtained after electrophoresis is attached to the bisphenol A epoxy resin prepreg, and the copper-clad plate finished product is obtained through hot pressing treatment. The copper-clad plate prepared by the invention has the advantages of environmental protection, low dielectric loss and high Tg, and can be widely applied to the industrial fields of computers, 5G communication, telecommunication instruments, household appliances and the like.

Description

technical field [0001] The invention relates to the technical field of copper-clad laminate preparation, in particular to an environment-friendly high-Tg low-dielectric copper-clad laminate and a preparation process thereof. Background technique [0002] The full name of the copper clad laminate material is the copper clad laminate material, which is also called the base material, which is made of resin, reinforcing material and copper foil by hot pressing. After a series of processes such as etching, drilling, and grinding, copper clad laminates are used to make printed circuit boards. At present, copper clad laminates can be widely used in industries such as computers, 5G communications, telecommunication instruments, and household appliances, and are closely related to people's lives. . With the rapid development of the electronic information industry, the performance requirements for copper clad laminates are getting higher and higher, and more and more multi-faceted. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D13/12C25D13/22C25D13/02
CPCC25D13/12C25D13/22C25D13/02
Inventor 包晓剑顾鑫
Owner NANTONG RODA ELECTRON