Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Fluorine-containing resin prepreg and circuit board using same

A fluororesin and circuit substrate technology, applied in circuit substrate materials, applications, printed circuits, etc., can solve the problem of increasing process difficulty, low polytetrafluoroethylene fluidity and seam filling, increasing circuit layers and fluororesin Negative effects and other problems, to achieve the effect of high flow glue and seam filling, low pressure sealing temperature

Pending Publication Date: 2022-05-13
NANYA PLASTICS CORP
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Therefore, when using the lamination process to form a multilayer circuit board, it needs to be heated to at least 400°C, which will increase the difficulty of the process
In addition, in the process of making printed circuit boards with high-density circuits, even if heated to high temperatures, polytetrafluoroethylene has low glue flow and gap filling properties, which may cause the circuit layer of the printed circuit board to be mixed with fluorine. porosity between resins
During the subsequent processing or heat treatment of the printed circuit board, the aforementioned pores will further increase the negative impact caused by the difference in thermal expansion coefficient between the circuit layer and the fluororesin, thereby affecting the yield of the printed circuit board

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Fluorine-containing resin prepreg and circuit board using same
  • Fluorine-containing resin prepreg and circuit board using same
  • Fluorine-containing resin prepreg and circuit board using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] The following is a specific example to illustrate the implementation of the "fluororesin prepreg and circuit substrate using it" disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification . The present invention can be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple illustration, and are not drawn according to the actual size, which is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention. It shoul...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a fluorine-containing resin prepreg and a circuit substrate using the same. The fluorine-containing resin prepreg comprises the following components in parts by weight: 100 parts of fluorine-containing resin and 20 to 110 parts of inorganic filler, the fluorine-containing resin includes polytetrafluoroethylene (PTFE) at a weight percentage concentration of 10% to 80%, a perfluoroethylene propylene copolymer (FEP) at a weight percentage concentration of 10% to 50%, and a tetrafluoroethylene-perfluoroalkoxy vinyl ether copolymer (PFA) at a weight percentage concentration of 0.1% to 40%. The circuit substrate comprises a fluorine-containing resin substrate and a circuit layer formed on the fluorine-containing resin substrate. The fluororesin prepreg and the circuit substrate using the same disclosed by the invention can improve the gummosis property and the caulking property of the fluororesin prepreg during pressing, so that the fluororesin prepreg is suitable for manufacturing a high-frequency circuit substrate.

Description

technical field [0001] The invention relates to a fluorine resin prepreg and a circuit substrate using the same, in particular to a fluorine resin prepreg suitable for high-frequency transmission and a circuit substrate using the same. Background technique [0002] Generally speaking, high-frequency substrates need to have a small dielectric constant (Dk), low dielectric loss (Df), and high thermal conductivity for applications that require high-frequency transmission. In components, such as: base station antenna, satellite radar, automotive radar, wireless communication antenna or power amplifier. [0003] Currently, most of the high-frequency substrates use fluorine resin due to its low dielectric constant and low dielectric loss. Commonly used fluorine resins usually use polytetrafluoroethylene (PTFE) as a main component. However, PTFE has many processing limitations, making its application still many challenges. For example, polytetrafluoroethylene has a relatively hi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08L27/18C08L23/08C08K3/36C08K3/22C08K7/14C08J5/24H05K1/03
CPCC08J5/24H05K1/0366H05K1/0353C08J2327/18C08J2427/18C08J2423/08C08K3/36C08K2003/2241C08K7/14H05K2201/015H05K1/034H05K2201/0281H05K2201/029H05K2201/0293B32B27/20B32B27/12B32B27/322B32B2250/03B32B2250/40B32B2457/08B32B2264/107B32B2264/101B32B2264/104B32B2264/301H05K2201/0275B32B2250/24
Inventor 廖德超陈豪昇张智凯张宏毅
Owner NANYA PLASTICS CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com