Fluorine-containing resin prepreg and circuit board using same

Abstract

The invention discloses a fluorine-containing resin prepreg and a circuit substrate using the same. The fluorine-containing resin prepreg comprises the following components in parts by weight: 100 parts of fluorine-containing resin and 20 to 110 parts of inorganic filler, the fluorine-containing resin includes polytetrafluoroethylene (PTFE) at a weight percentage concentration of 10% to 80%, a perfluoroethylene propylene copolymer (FEP) at a weight percentage concentration of 10% to 50%, and a tetrafluoroethylene-perfluoroalkoxy vinyl ether copolymer (PFA) at a weight percentage concentration of 0.1% to 40%. The circuit substrate comprises a fluorine-containing resin substrate and a circuit layer formed on the fluorine-containing resin substrate. The fluororesin prepreg and the circuit substrate using the same disclosed by the invention can improve the gummosis property and the caulking property of the fluororesin prepreg during pressing, so that the fluororesin prepreg is suitable for manufacturing a high-frequency circuit substrate.

Description

technical field [0001] The invention relates to a fluorine resin prepreg and a circuit substrate using the same, in particular to a fluorine resin prepreg suitable for high-frequency transmission and a circuit substrate using the same. Background technique [0002] Generally speaking, high-frequency substrates need to have a small dielectric constant (Dk), low dielectric loss (Df), and high thermal conductivity for applications that require high-frequency transmission. In components, such as: base station antenna, satellite radar, automotive radar, wireless communication antenna or power amplifier. [0003] Currently, most of the high-frequency substrates use fluorine resin due to its low dielectric constant and low dielectric loss. Commonly used fluorine resins usually use polytetrafluoroethylene (PTFE) as a main component. However, PTFE has many processing limitations, making its application still many challenges. For example, polytetrafluoroethylene has a relatively hi...

AI Technical Summary

Problems solved by technology

[0004] Therefore, when using the lamination process to form a multilayer circuit board, it needs to be heated to at least 400°C, which will increase the difficulty of the process

In addition, in the process of making printed circuit boards with high-density circuits, even if heated to high temperatures, polytetrafluoroethylene has low glue flow and gap filling properties, which may cause the circuit layer of the printed circuit board to be mixed with fluorine. porosity between resins

During the subsequent processing or heat treatment of the printed circuit board, the aforementioned pores will further increase the negative impact caused by the difference in thermal expansion coefficient between the circuit layer and the fluororesin, thereby affecting the yield of the printed circuit board

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