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High-thermal-conductivity polyimide film with good film-forming property and preparation method of high-thermal-conductivity polyimide film

A polyimide film, high thermal conductivity technology, used in chemical instruments and methods, heat exchange materials, etc., can solve the problems of difficult to achieve industrial production, poor film formation and mechanical properties, and achieve good mechanical strength, Good film formation and small process changes

Pending Publication Date: 2022-05-13
纳电(广东)材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the polyimide / thermally conductive filler composite thermally conductive film also has problems such as poor film formation and mechanical properties, and it is difficult to realize industrial production.

Method used

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  • High-thermal-conductivity polyimide film with good film-forming property and preparation method of high-thermal-conductivity polyimide film
  • High-thermal-conductivity polyimide film with good film-forming property and preparation method of high-thermal-conductivity polyimide film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A high thermal conductivity polyimide film with good film-forming properties, comprising the following raw materials in parts by weight:

[0027] 65 parts of thermally conductive fillers, 0.8 parts of film-forming auxiliary materials, 75 parts of aromatic dianhydrides, 70 parts of aromatic diamines, and 800 parts of N-methylpyrrolidone;

[0028] Among them, the thermal conductive filler is irregular aluminum nitride with a particle size of 9 μm, and the film-forming auxiliary material is fluorine-containing vinyl resin with a particle size of 1 μm; the aromatic dianhydride is pyromellitic dianhydride (PMDA), and the aromatic diamine is diamino Diphenyl ether (ODA);

[0029] The preparation method of high thermal conductivity polyimide film comprises the steps:

[0030] (1) Disperse 65 parts of thermally conductive fillers and 0.8 parts of film-forming auxiliary materials in 800 parts of N-methylpyrrolidone and sonicate for 1 hour. Stir until ODA is completely dissolve...

Embodiment 2

[0035] A high thermal conductivity polyimide film with good film-forming properties, comprising the following raw materials in parts by weight:

[0036] 45 parts of thermally conductive filler, 0.5 part of film-forming auxiliary material, 55 parts of aromatic dianhydride, 50 parts of aromatic diamine, 600 parts of N,N-dimethylacetamide;

[0037] The thermally conductive fillers include irregular zinc oxide with a particle size of 3 μm accounting for 15%, alumina with a particle size of 1 μm accounting for 30%, and graphene with a particle size of 2 μm for the rest; Vinyl fluoride resin; aromatic dianhydride is pyromellitic dianhydride (PMDA), and aromatic diamine is diaminodiphenyl ether (ODA);

[0038] The preparation method of this thin film comprises the steps:

[0039] (1) Disperse 45 parts of thermally conductive fillers and 0.5 parts of film-forming auxiliary materials in 600 parts of N,N-dimethylacetamide for 1 hour, ultrasonic treatment conditions: 400W, stirring spee...

Embodiment 3

[0044] A high thermal conductivity polyimide film with good film-forming properties, comprising the following raw materials in parts by weight:

[0045] 30 parts of thermally conductive filler, 0.2 part of film-forming auxiliary material, 38 parts of aromatic dianhydride, 35 parts of aromatic diamine, 400 parts of N,N-dimethylformamide; the thermally conductive filler is boron nitride (irregular, granular The diameter is 0.5 μm); the aromatic dianhydride is pyromellitic dianhydride (PMDA), the aromatic diamine is diaminodiphenyl ether (ODA), and the film-forming auxiliary material is fluorine-containing vinyl resin with a particle size of 0.1 μm.

[0046] The preparation method of this thin film comprises the steps:

[0047] (1) Disperse 30 parts of thermally conductive filler and 0.2 part of film-forming auxiliary material in 400 parts of N,N-dimethylformamide and sonicate for 1 hour. The ultrasonic treatment conditions are: 300W, stirring speed 180r / min, and then add 35 part...

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Abstract

The invention discloses a high-thermal-conductivity polyimide film with good film-forming property, which is prepared from the following raw materials in parts by weight: 8 to 75 parts of aromatic diamine monomer, 35 to 70 parts of aromatic dianhydride monomer, 30 to 65 parts of thermal conductive filler, 0.2 to 0.8 part of film-forming auxiliary material and 400 to 800 parts of polar solvent, the preparation method comprises the following steps: reacting an aromatic diamine monomer and an aromatic dianhydride monomer with a heat-conducting filler in a polar solvent to obtain a mixed solution, salivating the mixed solution onto a moving annular steel belt through a salivating die head, and carrying out heating curing and heating imidization to obtain the polyimide film. The polyimide film prepared by the method is high in heat conductivity coefficient and excellent in tensile strength.

Description

technical field [0001] The invention relates to the technical field of thin films, in particular to a high thermal conductivity polyimide thin film with good film-forming properties and a preparation method thereof. Background technique [0002] With the development of advanced electronics and high-frequency communication technology, the power and wiring density of electronic components have increased significantly, and the heat generated per unit volume during operation has increased sharply. The resulting heat accumulation phenomenon will cause signal delay, crosstalk and energy consumption between lines, seriously affecting the performance reliability and service life of the device. Polyimide (PI) film is a new type of high temperature resistant organic polymer film, which has excellent mechanical properties, electrical properties, chemical stability, high radiation resistance, high temperature resistance and low temperature resistance. Among them, polyimide film, known ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08L27/14C08K3/28C08K3/22C08K3/04C08K3/38C08J5/18C09K5/14
CPCC08J5/18C09K5/14C08J2379/08C08J2427/14C08K2201/003C08K2003/282C08K2003/2296C08K2003/2227C08K3/042C08K2003/385
Inventor 朱向忠刘展宏梁先文封力行赖志强李晓军
Owner 纳电(广东)材料科技有限公司