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High-thermal-conductivity and insulating phthalonitrile-based composite material as well as preparation method and application of high-thermal-conductivity and insulating phthalonitrile-based composite material

A technology of phthalonitrile-based and phthalonitrile-based microspheres, applied in heat exchange materials, chemical instruments and methods, sustainable manufacturing/processing, etc., can solve difficult large-scale production and high process costs , three-dimensional continuous heat conduction network process complex and other issues, to achieve the effect of low cost, simple and controllable process, good thermal conductivity

Pending Publication Date: 2022-05-27
INST OF CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, most of the methods for manufacturing three-dimensional continuous heat conduction networks are relatively complex in process, high in process cost, and difficult to produce on a large scale, so there is still a long way to go for their industrial application.

Method used

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  • High-thermal-conductivity and insulating phthalonitrile-based composite material as well as preparation method and application of high-thermal-conductivity and insulating phthalonitrile-based composite material
  • High-thermal-conductivity and insulating phthalonitrile-based composite material as well as preparation method and application of high-thermal-conductivity and insulating phthalonitrile-based composite material
  • High-thermal-conductivity and insulating phthalonitrile-based composite material as well as preparation method and application of high-thermal-conductivity and insulating phthalonitrile-based composite material

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0104] The single-layer boron nitride@phthalonitrile-based composite was prepared as follows (boron nitride accounts for about 20% of the volume of the single-layer boron nitride@phthalonitrile-based composite):

[0105] (1) 1 g of phthalonitrile resin (which consists of 0.95 g of phthalonitrile monomer represented by formula (2) and 0.05 g of curing agent 4-amino-(3,4-dicyanophenoxy)benzene g prepared by stirring at 160 ° C for 20 minutes) was dissolved in 50 mL of acetone solution, stirred evenly, then 10 g of phthalonitrile-based microspheres were added to it, and rotary-evaporated until the solvent was completely volatilized to obtain a phthalonitrile resin coating phthalonitrile-based microspheres.

[0106]

[0107] (2) Heat 4.5 g of boron nitride to 160°C, then add the phthalonitrile-based microspheres coated with the above phthalonitrile resin, stir and mix until all the boron nitride is attached to the phthalonitrile The surface of phthalonitrile-based microspheres...

preparation example 2

[0110] The boron nitride-graphite@phthalonitrile-based composite material was prepared according to the following steps (boron nitride and graphite accounted for about 20% of the volume of the boron nitride-graphite@phthalonitrile-based composite material respectively, and the inner layer was graphite , the outer layer is boron nitride):

[0111] (1) 1 g of phthalonitrile resin (which consists of 0.95 g of phthalonitrile monomer represented by formula (2) and 0.05 g of curing agent 4-amino-(3,4-dicyanophenoxy)benzene g prepared by stirring at 160 ° C for 20 minutes) was dissolved in 50 ml of acetone solution, stirred evenly, then 10 g of phthalonitrile-based microspheres were added to it, and rotary-evaporated until the solvent was completely volatilized to obtain a phthalonitrile resin coating phthalonitrile-based microspheres.

[0112]

[0113]

[0114] (2) Heating 6.5g of graphite to 160°C, then adding the above-mentioned phthalonitrile resin-coated phthalonitrile-ba...

preparation example 3

[0118] Boron nitride-alumina-graphite@phthalonitrile-based composites were prepared according to the following steps (boron nitride, alumina, and graphite accounted for approximately 20%, 10%, 10% of the volume, the inner layer is graphite, the middle layer is alumina, and the outer layer is boron nitride):

[0119] (1) 1 g of phthalonitrile resin (which consists of 0.95 g of phthalonitrile monomer represented by formula (3) and 0.05 g of curing agent 4-amino-(3,4-dicyanophenoxy)benzene g prepared by stirring at 160 ° C for 20 minutes) was dissolved in 50 ml of acetone solution, stirred evenly, then 10 g of phthalonitrile-based microspheres were added to it, rotary-evaporated until all the solvent was evaporated, and then pre-cured at 200 ° C for 2h to obtain Phthalonitrile resin-coated phthalonitrile-based microspheres.

[0120]

[0121] (2) 3.5 g of graphite was heated to 160° C., and then the phthalonitrile-based microspheres covered by the above phthalonitrile resin we...

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Abstract

The invention provides a high-thermal-conductivity and insulating phthalonitrile composite material as well as a preparation method and application thereof. The composite material is prepared from a phthalonitrile-based core-shell composite material, the core-shell composite material has a core-shell structure, namely, the core-shell composite material comprises an inner core and at least one heat-conducting filler layer, the inner core is a phthalonitrile-based microsphere, and the heat-conducting filler layer at least partially coats the surface of the inner core. The composite material provided by the invention can show good heat-conducting property under the condition of relatively low content of the heat-conducting filler, effectively overcomes the problem that a heat-conducting network is generated only when the content of the heat-conducting filler is high, and has good insulating property.

Description

technical field [0001] The invention belongs to the field of polymer composite materials, in particular to a high thermal conductivity and insulating phthalonitrile-based composite material and a preparation method and application thereof. Background technique [0002] The fields of electronics, communication, new energy and aerospace are developing rapidly. The trend of high power, high integration, light weight and miniaturization of electronic devices, communication equipment and automatic intelligent equipment is becoming more and more obvious, and the problem of heat dissipation is becoming more and more obvious. Polymer matrix composites are widely used in the field of thermal conductivity due to their high strength, low density, easy molding, chemical resistance, and low cost. However, the low thermal conductivity of polymers makes it difficult to meet application requirements. Adding high thermal conductivity fillers into polymer matrix is ​​an economical and reliab...

Claims

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Application Information

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IPC IPC(8): C08L79/04C08K3/22C08K3/38C08K3/04C09K5/14
CPCC08K3/22C08K3/38C08K3/04C09K5/14C08K2003/2227C08K2003/385C08L79/04Y02P20/10
Inventor 周恒郭颖赵彤刘先渊赵泽华丁江楠刘翔
Owner INST OF CHEM CHINESE ACAD OF SCI
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