Micro-scale flow heat exchange high-precision integration test method based on MEMS technology

Abstract

The invention discloses a micro-scale flow heat exchange high-precision integration test method based on an MEMS (micro-electromechanical system) process. The method comprises the following steps: processing an experiment piece based on the MEMS process; integrating the test system; according to the invention, in-situ extraction measurement of a pressure measuring point is completed through glass laser drilling and a plasma etching technology of a silicon wafer, so that local pressure loss is avoided; the temperature at the current thin film thermal resistor is measured through the resistance change by utilizing the temperature coefficient characteristic of the metal resistor, and the thin film thermal resistor is arranged above the heating film and is closer to the wall surface of the channel, so that the obtained temperature data is more accurate; through a multi-layer wafer bonding technology, a glass sheet with a pressure measuring hole, an upper silicon wafer with a micro-channel and a temperature measuring thermal resistor and a lower silicon wafer with a heating film are subjected to multi-wafer sequential bonding respectively, so that the sealing performance of the micro-channel and accurate alignment bonding of the silicon surface with a metal film are ensured; in combination with integration of a test system, integrated design of pressure measurement, temperature measurement, heating and visualization is finally realized.

Description

technical field [0001] The present invention relates to a test method, in particular, to a high-precision integrated test method of micro-scale flow heat transfer based on MEMS technology. Background technique [0002] The advancement of science and technology has brought about the development of integration, miniaturization and compactness of various devices. Micro-electromechanical systems have become an emerging technical field and have shown great advantages. a wide range of applications. Among them, microchannels are the key components of MEMS. In order to meet the requirements of efficient heat transfer, mass transfer and various chemical reactions, many scholars have carried out various effects of microchannels, such as hydraulic diameter, aspect ratio, roughness, A large number of studies have been carried out on surface structure and surface modification, but there are great differences between the results of different studies, and the conclusions of many scholars ...

AI Technical Summary

Problems solved by technology

(2) Pressure loss caused by sudden contraction and expansion of inlet / outlet manifold channels

(3) Local pressure loss caused by inlet / outlet manifold channel bending

The second part is the layout of the experimental boundary. The constant heat flow and constant wall temperature boundary in the experiment is often not directly located on the lower surface of the channel, but has a certain distance from the test channel. The temperature redistribution, longitudinal heat flow and exchange with the surrounding environment caused by this distance Heat and other factors, their combined effect will lead to the problem of uneven heat flow distribution in the boundary of constant heat flow and uneven temperature distribution in the boundary of constant wall temperature

However, the visual measurement of Micro-PIV involves the construction of the optical path and the design of a special experimental platform, which leads to the fact that the Micro-PIV technology is often tested alone, and it is difficult to carry out simultaneous testing with other testing techniques. Consistency, uniformity, and in situ measurement pose certain difficulties

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