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Photosensitive resin composition, photocured pattern formed using the same, and display device

A technology of photosensitive resin and composition, applied in the fields of photosensitive resin composition, photocurable pattern and display device, can solve the problems of reduced pattern durability, undisclosed curing, pattern surface damage, etc., and achieves excellent adhesion, The effect of excellent storage stability

Pending Publication Date: 2022-06-24
DONGWOO FINE CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, low-temperature curing conditions have problems in that the reaction decreases and the durability of the formed pattern decreases
In addition, there is also the problem that the heat resistance is lowered. In particular, it is exposed to the solvent used in the post-process, so that there is a decrease in chemical resistance such as swelling caused by surface penetration and decreased adhesion, and the surface of the pattern Problems such as damage, decrease in adhesion to the underlying substrate, etc.
[0007] Korean Patent Registration No. 10-1464312 discloses a photosensitive resin composition that can be cured at low temperatures, but does not disclose curing at temperatures below 100°C. Therefore, there is a limitation that it can be used on flexible substrates containing polymers or Cannot be used when patterning on a substrate with an organic layer underneath

Method used

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  • Photosensitive resin composition, photocured pattern formed using the same, and display device
  • Photosensitive resin composition, photocured pattern formed using the same, and display device
  • Photosensitive resin composition, photocured pattern formed using the same, and display device

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0125] Synthesis Example 1: Synthesis of Pentaerythritol Tripropylene Glycol (A-1)

[0126] After adding 1.37 mol of pentaerythritol triallyl ether to a round flask, it heated at 40 degreeC. Then, 4.51 mol of acetic acid was added dropwise at a molar ratio to pentaerythritol triallyl ether of 1:3.3, and the mixed liquid was stirred at 40° C. for 4 hours. After adding 560 g of a 20% ammonia aqueous solution to the reactant, the reaction was carried out at 55°C for 15 hours. After separating the organic layer, 490 g of toluene and 350 g of 5% sulfuric acid were added and washed, and then the organic layer was separated and obtained, and 350 g of water was added to the organic layer.

[0127] The organic layer was separated, concentrated and dried, and pentaerythritol tripropylene glycol (478 g, yield 98%) (referred to as PEPT) was synthesized into a colorless and transparent oil. The results of NMR analysis are shown below.

[0128]

[0129] 1H-NMR(400MHz, CDCl3):δ1.35(t,3...

Synthetic example 2

[0130] Synthesis Example 2: Synthesis of Dipentaerythritol Tetrapropanol (A-2)

[0131] Synthesis was carried out in the same manner as in Synthesis Example 1, except that dipentaerythritol tetraethyl ether was used instead of the pentaerythritol triallyl ether in Synthesis Example 1, and thioacetic acid was added dropwise at a molar ratio of 1:4.4.

Synthetic example 3

[0132] Synthesis Example 3: Synthesis of Pentaerythritol Tetrapropanol (A-3)

[0133] Synthesis was carried out in the same manner as in Synthesis Example 1, except that instead of the pentaerythritol triallyl ether of Synthesis Example 1, pentaerythritol triallyl ether was changed to pentaallyl ether and thioacetic acid was added dropwise at a molar ratio of 1:5.5.

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Abstract

The present invention provides a photosensitive resin composition, a photocurable pattern formed using the same, and a display device, the photosensitive resin composition comprising a thiol compound (A) containing an ether bond represented by Chemical Formula 1 or Chemical Formula 2, an alkali-soluble resin (B), a photopolymerizable compound (C), a photopolymerization initiator (D), and a solvent (E), a pattern having excellent moisture resistance, heat resistance, alkali resistance, and chemical resistance and excellent storage stability can be prepared compared to a resin composition containing a thiol compound having an ester bond.

Description

technical field [0001] The present invention relates to a photosensitive resin composition, a photocurable pattern formed using the same, and a display device. Background technique [0002] In the field of displays, photosensitive resin compositions are used to form various photocurable patterns such as photoresists, insulating films, protective films, black matrices, and column spacers. Specifically, the photosensitive resin composition can be selectively exposed and developed through a photolithography process to form a desired pattern. In this process, in order to improve the yield in the process and improve the physical properties of the application object, it is necessary to provide high Sensitive photosensitive resin composition. The photosensitive resin composition can be classified into a thermosetting photosensitive resin composition and a photocurable photosensitive resin composition according to a curing mechanism. [0003] Specifically, the patterning of the ph...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/027G09F9/30
CPCG03F7/027G09F9/30G03F7/004G03F7/028G03F7/066
Inventor 金正植柳振馨李贤普曹升铉
Owner DONGWOO FINE CHEM CO LTD