Polyamide composition as well as preparation method and application thereof

Abstract

The polyamide composition is characterized by comprising the following components in parts by weight: 50 parts of polyamide resin, 30-65 parts of reinforcing filler, 1-3 parts of maleic anhydride grafted polyolefin and epoxy resin which is 0.3-1.05 times of the adding amount of the maleic anhydride grafted polyolefin, but the adding amount of the epoxy resin is not higher than 2 parts. Through compounding of maleic anhydride grafted polyolefin and epoxy resin, high surface gloss can be realized under the filling of a large amount of reinforcing filler.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a polyamide composition and a preparation method and application thereof. Background technique [0002] Polyamide resins have excellent mechanical strength, heat resistance, chemical resistance, wear resistance and self-lubrication, and have a low coefficient of friction. They are widely used in electrical and electronic, automotive parts, furniture, building materials and fibers. Become one of the most important engineering plastics. Reinforced polyamide resins have good mechanical properties and are expected to replace metals in many applications, including telecommunications, consumer electronics, household appliances, and casing materials for various motors and mechanical equipment. In these fields, metal-like properties are required that are often only achieved with highly filled, highly reinforced molding materials, especially those reinforced with high glass fib...

AI Technical Summary

Problems solved by technology

[0004] European patent EP0957131B1 describes that the fluidity of the polyamide composition can be improved by adding a polyamide prepolymer, but since the prepolymer has a very high concentration of end groups, there will inevitably be subsequent reactions in the later processing, but instead reduce liquidity

Chinese patent CN1368994A discloses a method of improving high-molecular-weight polyamide compositions by melt-mixing high-molecular-weight polyamides and polyamide oligomers having a higher melting point than high-molecular-weight polyamides at a melt temperature equal to or lower than the melting point Fluidity, but this method is particularly limited, and it can only be effective in some specific resin compositions. In some systems, there will be poor plasticization or non-melting of the oligomer at the processing temperature of the high-molecular-weight matrix resin, for example, In the use of PA66 oligomers to improve the fluidity of high molecular weight PA6 materials

Chinese patent 200710306399 discloses a composition of low-viscosity polyamide reinforced with flat glass fibers. The composition realizes the reinforced composition of glass fiber content, has better flow properties and injection molding surface quality, and has less warpage and better surface quality. Traditional glass fiber reinforced materials have been improved, but the cost is high, which greatly limits the application of this method

Patent CN101193982B discloses that linear or branched polyamide oligomers with a number average molar mass of 800-5000 g / mol can effectively improve the processability and surface quality of high molecular weight polyamide materials, but a separate polyamide oligomer terminal is required base conditioning step, and the material's own strength will also be affected

Patent CN105419315A discloses a high glass fiber content reinforced nylon composition, the nylon material contains 0.05-1% star branching agent, the surface is improved by polyamide branching, and the gloss of the material is not high