Preparation method of nickel-plated graphene-reinforced silver-based electrical contact material
A technology of electric contact material and nickel-plated graphite, which is applied in the directions of contacts, circuits, electric switches, etc., can solve the problems that are difficult to meet environmental protection requirements, and achieve the effects of easy control of the deposition process, improvement of interface bonding, and avoidance of aggregation
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Embodiment 1
[0022] (1) Nickel-plated graphene is prepared by depositing metallic nickel on the surface of graphene (the number of layers is 1-10 layers) by DC magnetron sputtering. The nickel target with a purity of 99.99% was polished with fine sandpaper before installation to remove the surface oxide film, then cleaned with acetone, dried, and pre-sputtered for 5 minutes before DC magnetron sputtering deposition. The graphene is separated to remove metal oxides and other impurities on the surface of the target material, so as to ensure the purity of the subsequent nickel film deposited on the surface of the graphene. The sputtering parameters are as follows: the degree of vacuum reaches 0.1*10 -3 When Pa, argon gas with a purity of 99.99% was introduced, the vacuum chamber pressure was 0.8Pa, the sputtering power was 120W, and the deposition time was 5min.
[0023] (2) An alloy with a weight content of 5.0% nickel and 95.0% silver was prepared into 200 mesh AgNi5 powder by ultrasonic a...
Embodiment 2
[0028] (1) Nickel-plated graphene is prepared by depositing metallic nickel on the surface of graphene (the number of layers is 1-10 layers) by DC magnetron sputtering. The silver target with a purity of 99.99% was polished with fine sandpaper before installation to remove the surface oxide film, then washed with acetone, dried, and pre-sputtered for 5 minutes before DC magnetron sputtering deposition. The graphene is separated to remove metal oxides and other impurities on the surface of the target material, so as to ensure the purity of the subsequent nickel film deposited on the surface of the graphene. The sputtering parameters are as follows: the degree of vacuum reaches 1.0*10 -3 When Pa, argon gas with a purity of 99.99% was introduced, the vacuum chamber pressure was 1.2Pa, the sputtering power was 80W, and the deposition time was 20min.
[0029] (2) A 300-mesh AgNi20 powder was prepared from a silver alloy with a weight content of 20.0% nickel and 80.0% by centrifuga...
Embodiment 3
[0034] (1) Nickel-plated graphene is prepared by depositing metallic nickel on the surface of graphene (the number of layers is 1-10 layers) by DC magnetron sputtering. The silver target with a purity of 99.99% was polished with fine sandpaper before installation to remove the surface oxide film, then washed with acetone, dried, and pre-sputtered for 5 minutes before DC magnetron sputtering deposition. The graphene is separated to remove metal oxides and other impurities on the surface of the target material, so as to ensure the purity of the subsequent nickel film deposited on the surface of the graphene. The sputtering parameters are as follows: the degree of vacuum reaches 0.3*10 -3 When Pa, argon gas with a purity of 99.99% was introduced, the vacuum chamber pressure was 1.0Pa, the sputtering power was 110W, and the deposition time was 5min.
[0035] (2) A 300-mesh AgNi10 powder was prepared from a silver alloy with a weight content of 10.0% nickel and 90.0% by gas atomiz...
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