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Flexible polyamide membrane

A technology of polyamide film and softness, applied in the field of polyamide film, can solve the problems of polyamide molecular weight decrease, insufficient performance, and shortened chain segment length

Pending Publication Date: 2022-07-08
UNITIKA LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the polymerization temperature is high, the soft segment decomposes due to the moisture generated in the condensation reaction, the amino group contained in the raw material monomer, and the amino group generated in the hydrolysis of the polyamide, and the segment length becomes short. As a result, the obtained Polyamide has a problem that the molecular weight decreases and the performance becomes insufficient

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0085] Hereinafter, the present invention will be specifically described by way of examples, but the present invention is not limited to these examples.

[0086] A. Evaluation method

[0087] The physical properties of polyamide and polyamide film were measured by the following methods.

[0088] (1) Composition

[0089] Using a high-resolution nuclear magnetic resonance apparatus (ECA-500NMR manufactured by JEOL Ltd.), the obtained polyamide and polyamide film were subjected to 1 In H-NMR analysis, the resin composition (resolution: 500 MHz, solvent: mixed solvent of deuterated trifluoroacetic acid and deuterated chloroform with a volume ratio of 4 / 5, temperature: 23° C.) was obtained from the peak intensities of the respective copolymerized components.

[0090] (2) Melting point

[0091] Several milligrams were cut out from the obtained polyamide film, and the temperature was raised to 350°C at a temperature increase rate of 20°C / min using a differential scanning calorimet...

manufacture example

[0102] ·Polyamide P1

[0103] 4.7 parts by mass of dimer acid, 4.5 parts by mass of dimer diamine, 44.5 parts by mass of terephthalic acid, 46.2 parts by mass of 1,10-decanediamine, sodium hypophosphite Hydrate 0.1 part by mass.

[0104] Then, it heated to 260 degreeC while stirring, and carried out the superposition|polymerization at 260 degreeC for 5 hours under a nitrogen stream, normal pressure, while discharging|emitting condensation water to the outside of the system. During the polymerization, the system is in a suspended state.

[0105] After completion of the polymerization, it was discharged and cut to obtain a polyamide P1.

[0106] ·Polyamide P2~P8

[0107] Except having changed the monomers put into the reaction container as shown in Table 1, the same operation as that of the polyamide P1 was carried out to obtain the polyamides P2 to P8.

[0108] ·Polyamide P9

[0109] 24.8 parts by mass of 1,4-butanediamine, 17.6 parts by mass of dimer diamine, and 18 parts...

Embodiment 1

[0121] Example 1 (simultaneous biaxially stretched film)

[0122] 100 parts by mass of polyamide P1 and 0.4 parts by mass of SumilizerGA-80 were dry-blended, put into a twin-screw extruder with a barrel temperature of 330° C. and a screw diameter of 26 mm, melt-kneaded, and extruded into After tow-like, cooling and cutting are performed to obtain pellets.

[0123] The obtained pellets were put into a uniaxial extruder with a barrel temperature of 330° C. and a screw diameter of 50 mm to be melted, and a metal fiber sintered filter (manufactured by Nippon Seiko Co., Ltd., "NF-13", absolute filter diameter: 60 μm) After filtering the molten polymer, it was extruded from a T-die at 330°C to form a film, and it was brought into close contact with a cooling roll at 10°C by an electrostatic application method and cooled to obtain a substantially non-oriented unstretched polymer. amide membrane.

[0124] When the resin composition of the polyamide component of the obtained unstretc...

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Abstract

A flexible polyamide film which is obtained by molding a polyamide containing a unit comprising an aliphatic dicarboxylic acid (A1) having 18 or more carbon atoms and / or a unit comprising an aliphatic diamine (B1) having 18 or more carbon atoms, and which is characterized in that: the polyamide contains a unit comprising an aliphatic dicarboxylic acid (A1) having 18 or more carbon atoms and / or a unit comprising an aliphatic diamine (B1) having 18 or more carbon atoms; the total of the content of the unit composed of (A1) and the content of the unit composed of (B1) in the polyamide is 10-92 mass%, and the melting point of the film is 240 DEG C or higher.

Description

technical field [0001] The present invention relates to a polyamide film having both heat resistance and flexibility. Background technique [0002] Since polyamide films are excellent in heat resistance and mechanical properties, their development into the electrical and electronic fields has been studied. In recent years, applications to flexible and foldable devices have also been studied (for example, Patent Documents 1 and 2). However, conventional polyamide films having heat resistance do not have sufficient flexibility for use in these devices. [0003] As a method of improving the flexibility of polyamide, there is a method of forming a structure in which a hard segment and a soft segment are combined and each segment is phase-separated, which is considered to be an ideal form with high flexibility. Conventionally, polyamides having hard segments and soft segments are mostly composed of crystalline polyamides such as polyamide 6, polyamide 11, and polyamide 12 as the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G69/26
CPCC08J5/18C08G69/34C08G69/265C08G69/40C08L77/08C08J2377/06C08G69/26C08J2377/08
Inventor 多木俊雄丸尾刚史中井诚八木优介
Owner UNITIKA LTD