Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Diamond carbon fiber composite material with high bonding strength and preparation method thereof

A technology of bonding strength and composite materials, applied in chemical instruments and methods, lamination auxiliary operations, lamination, etc., can solve problems such as inability to meet the heat dissipation requirements of high-power electronic devices, achieve high bonding strength, resist thermal shock, and improve The effect of binding strength

Pending Publication Date: 2022-07-22
TAIYUAN UNIV OF TECH
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a high bonding strength diamond carbon fiber composite material for the existing thermal management materials that cannot meet the increasing heat dissipation requirements of high-power electronic devices

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Diamond carbon fiber composite material with high bonding strength and preparation method thereof
  • Diamond carbon fiber composite material with high bonding strength and preparation method thereof
  • Diamond carbon fiber composite material with high bonding strength and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] A high-bonding strength diamond carbon fiber composite material and a preparation method thereof are formed by stacking self-supporting diamond diaphragms 1 and carbon fiber layers 2 alternately arranged in sequence, and the top layer and the bottom layer are both self-supporting diamond diaphragms 1; The number of layers of diamond diaphragm 1 is three, and the length, width and thickness of each layer are 10 mm × 5 mm × 1 mm, and the number of layers of carbon fiber layer 2 is two, and the length, width and thickness of each layer are 10 mm × 5 mm×0.3 mm; the bottom surface of the top layer self-supporting diamond diaphragm 1, the top surface of the bottom layer self-supporting diamond diaphragm 1 and the top and bottom surfaces of the middle layer self-supporting diamond diaphragm 1 have been textured, such as Figure 5 shown.

[0040] The specific preparation method of the above-mentioned high bonding strength diamond carbon fiber composite material comprises the fo...

Embodiment 2

[0049] A high-bonding strength diamond carbon fiber composite material and a preparation method thereof are formed by stacking self-supporting diamond diaphragms 1 and carbon fiber layers 2 alternately arranged in sequence, and the top layer and the bottom layer are both self-supporting diamond diaphragms 1; The number of layers of diamond diaphragm 1 is six, and the length, width and thickness of each layer are 15 mm × 15 mm × 0.6 mm, and the number of layers of carbon fiber layer 2 is five, and the length, width and thickness of each layer are 15 mm × 15 mm×0.15 mm; the bottom surface of the top layer self-supporting diamond diaphragm 1, the top surface of the bottom layer self-supporting diamond diaphragm 1, and the top and bottom surfaces of the middle layers of self-supporting diamond diaphragm 1 are all textured, such as Image 6 shown.

[0050] The specific preparation method of the above-mentioned high bonding strength diamond carbon fiber composite material comprises ...

Embodiment 3

[0059] A high-bonding strength diamond carbon fiber composite material and a preparation method thereof are formed by stacking self-supporting diamond diaphragms 1 and carbon fiber layers 2 alternately arranged in sequence, and the top layer and the bottom layer are both self-supporting diamond diaphragms 1; The number of layers of diamond diaphragm 1 is ten, and the length, width and thickness of each layer are 20 mm × 15 mm × 0.3 mm, and the number of layers of carbon fiber layer 2 is nine, and the length, width and thickness of each layer are 20 mm × 15 mm×0.1 mm; the bottom surface of the top layer self-supporting diamond diaphragm 1, the top surface of the bottom layer self-supporting diamond diaphragm 1, and the top and bottom surfaces of the middle layers of self-supporting diamond diaphragm 1 are all textured, such as Figure 7 shown.

[0060] The specific preparation method of the above-mentioned high bonding strength diamond carbon fiber composite material comprises ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thermal conductivityaaaaaaaaaa
Parallelismaaaaaaaaaa
Flatnessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a high-bonding-strength diamond carbon fiber composite material and a preparation method thereof.The composite material is formed by sequentially and alternately arranging self-supporting diamond diaphragms and carbon fiber layers in a stacked mode, and the top layer and the bottom layer of the composite material are the self-supporting diamond diaphragms; and texturing treatment is performed on the contact surfaces of the self-supporting diamond diaphragm and the carbon fiber layer. The preparation method comprises the following steps: firstly, carrying out shape cutting, thickness finishing, surface smoothing and surface texturing on the self-supporting diamond diaphragm; then, the carbon fibers infiltrated with the binder are flatly laid and bonded between the self-supporting diamond diaphragms subjected to texturing treatment; and then a clamping frame is adopted for fixing, normal static pressure is applied, surplus binder and residual bubbles in the carbon fibers are discharged, then the binder is heated and cured, and finally the high-bonding-strength diamond carbon fiber composite material is obtained. The method is easy to operate, large-scale and batch production is easy, and a foundation is laid for engineering development of a new generation of high-thermal-conductivity parts.

Description

technical field [0001] The invention belongs to the technical field of thermal management materials and preparation thereof, and in particular relates to a high bonding strength diamond carbon fiber composite material and a preparation method thereof. Background technique [0002] With the rapid development of electronic technology, the power of components in the thermal control system of electronic equipment in the military and civilian fields is getting higher and higher, thermal management has become particularly important, and even become a bottleneck in the development of high-power electronic devices. However, the current general metals (Al, Cu), ceramics (SiC, AlN), and metal matrix composites (Cu / Mo, Al / SiC) are more and more difficult to meet the heat dissipation requirements of high-power electronic devices. Therefore, the development of a new generation of high thermal conductivity materials to ensure the stable operation of the thermal control system of high-powe...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B32B9/00B32B9/04B32B7/12B32B3/30B32B37/12B32B37/10B32B37/00B32B38/00B32B38/16
CPCB32B9/007B32B9/047B32B5/02B32B3/30B32B7/12B32B38/0004B32B38/00B32B37/1284B32B37/10B32B37/003B32B38/162B32B38/0012B32B2038/0064B32B2038/0076B32B2260/021B32B2260/046B32B2250/42B32B2262/106B32B2307/306B32B2307/558
Inventor 郑可马永高洁于盛旺黑鸿君吴艳霞
Owner TAIYUAN UNIV OF TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com