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Integrated laser in-situ auxiliary turning device

An integrated, auxiliary vehicle technology, applied in laser welding equipment, metal processing equipment, welding equipment, etc., can solve the problems of inflexible adjustment of laser incident angle, insufficient tool rigidity, inconvenience, etc., to improve energy utilization, improve Improved surface quality and machining efficiency

Pending Publication Date: 2022-07-29
CHANGCHUN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the optical-mechanical structure integration inside the tool handle, the adjustment of the laser incident angle is inflexible and inconvenient when the laser is incident in situ; and the hollow tool handle will lead to insufficient rigidity of the tool, which is prone to instability

Method used

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  • Integrated laser in-situ auxiliary turning device
  • Integrated laser in-situ auxiliary turning device
  • Integrated laser in-situ auxiliary turning device

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Embodiment Construction

[0039] Nowadays, difficult-to-machine materials (hard and brittle materials, superalloys, composite materials, etc.) are widely used in aerospace, aerospace, military, and automobile manufacturing. Use as a component requires a very high surface quality. However, when machining difficult-to-machine materials, there will be large cutting forces, rapid tool wear, and low surface quality. Simple traditional manufacturing and processing cannot meet the needs of current materials in various fields. Therefore, the combination of laser-assisted turning, laser-assisted milling, laser-assisted polishing, and other laser-assisted and traditional processing methods is introduced. Through laser-assisted heating of the workpiece, the purpose of material softening is achieved, and the processing domain characteristics of the workpiece are locally changed, so that difficult-to-machine materials can be processed in the ductile domain, which can reduce cutting force, improve surface quality i...

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Abstract

The method is applied to the field of ultra-precision machining and used for machining materials difficult to machine. The invention particularly relates to an integrated laser in-situ auxiliary turning device. The integrated laser in-situ auxiliary turning device is composed of a tool rest structure design part and a laser light path system design part. Wherein the knife rest structure design comprises a knife rest mounting bottom plate structure design, a knife rest mounting cover plate structure design and a sleeve structure design; the design of the laser light path system comprises the design of a laser adjusting module, the design of a reflection adjusting module and the design of a focusing adjusting module. According to the device, the incident position and the incident angle of laser can be adjusted according to factors such as a diamond cutter and machining requirements, and the size and the position of a laser spot are adjusted; the device adopts a modular design, and is convenient to adjust and install. Meanwhile, the device has the advantage of being high in laser energy utilization rate, off-site and in-site integration is achieved, and a solid foundation is laid for research work in the laser-assisted aspect.

Description

technical field [0001] The invention is applied to the field of ultra-precision machining, in particular to an integrated laser in-situ auxiliary turning device. Background technique [0002] Laser-assisted cutting is a composite machining technology that softens the machining area on the workpiece by heating with a high-energy laser beam to achieve the optimal softening cutting temperature of the material. When cutting at this temperature, the deformation of the material is easier, the cutting force, cutting specific energy, surface roughness, surface damage and tool wear are reduced, and the processing efficiency is improved. [0003] Laser-assisted processing includes laser off-site assisted processing and laser in-situ assisted processing. Laser off-position auxiliary processing is further divided into laser coaxial off-position auxiliary processing and laser non-coaxial off-position auxiliary processing: [0004] Laser in-situ assistance sets the optical path system a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/064B23K26/08B23K26/70
CPCB23K26/38B23K26/064B23K26/0884B23K26/702
Inventor 石广丰李洪达高继雨邹春阳夏明强姚栋孟巳崴毕娇龙丁艳春
Owner CHANGCHUN UNIV OF SCI & TECH
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