Organosilicon modified polyurethane acrylic sealant and preparation method thereof

A technology of polyurethane acrylic acid and water-based acrylic acid, which is applied in the field of sealants, can solve problems such as poor adhesion, easy cracking, and high toxicity, and achieve good environmental friendliness and airtightness.

Pending Publication Date: 2022-07-29
HUNAN SOKAN NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, epoxy resin sealants usually have poor temperature resistance, and are prone to cracking in alternating cold and hot environments. Free isocyanate monomers in polyurethane sealants are highly toxic
Silicone sealants have good sealing properties, but poor adhesion, so we propose a silicone-modified polyurethane acrylic sealant and its preparation method to solve the above-mentioned problems

Method used

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  • Organosilicon modified polyurethane acrylic sealant and preparation method thereof
  • Organosilicon modified polyurethane acrylic sealant and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] A silicone-modified polyurethane acrylic sealant, comprising the following raw materials in parts by mass: 100 parts of polyethylene glycol, 26 parts of isophorone diisocyanate, 9 parts of 1,4-butanediol, 2,2-diisocyanate 13 parts of methylolpropionic acid, 6 parts of E-44 epoxy resin, 7 parts of silane coupling agent, 1.5 parts of triethylamine, 25 parts of water-based acrylic resin, 6 parts of solvent, 12 parts of alcohol ester, defoamer 0.5 part, 0.8 part of wetting agent, 0.6 part of thickener A, 1 part of thickener B.

[0037] 100 parts by mass of polyethylene glycol (PEG-1000) and 26 parts by mass of isophorone diisocyanate (IPDI) were added to a three-necked flask with nitrogen protection, and the reaction was mechanically stirred at 80 ° C for 2 h, and 9 were added dropwise in turn. Mass parts of 1,4-butanediol (BDO) were reacted at the same temperature for 0.5h, and then 13 parts by mass of 2,2-dimethylolpropionic acid (DMPA) were added to react for 1.5h; the t...

Embodiment 2

[0041] A silicone-modified polyurethane acrylic sealant, comprising the following raw materials in parts by mass: 150 parts of polyethylene glycol, 27 parts of isophorone diisocyanate, 9 parts of 1,4-butanediol, 2,2-diisocyanate 14 parts of methylolpropionic acid, 6 parts of E-44 epoxy resin, 7 parts of silane coupling agent, 2 parts of triethylamine, 27 parts of water-based acrylic resin, 6 parts of solvent, 12 parts of alcohol ester, defoamer 0.6 part, 0.9 part of wetting agent, 0.7 part of thickener A, 1.2 part of thickener B.

[0042] 150 parts by mass of polyethylene glycol (PEG-1000) and 27 parts by mass of isophorone diisocyanate (IPDI) were added to a three-necked flask with nitrogen protection, and the reaction was mechanically stirred at 80 ° C for 2 h, and 9 were added dropwise in turn. Mass parts of 1,4-butanediol (BDO) were reacted at the same temperature for 0.5h, and then 14 parts by mass of 2,2-dimethylolpropionic acid (DMPA) were added to react for 1.5h; the t...

Embodiment 3

[0046] A silicone-modified polyurethane acrylic sealant, comprising the following raw materials in parts by mass: 180 parts of polyethylene glycol, 28 parts of isophorone diisocyanate, 10 parts of 1,4-butanediol, 2,2-diisocyanate 15 parts of methylolpropionic acid, 7 parts of E-44 epoxy resin, 8 parts of silane coupling agent, 2.4 parts of triethylamine, 29 parts of water-based acrylic resin, 7 parts of solvent, 12 parts of alcohol ester, defoamer 0.8 part, 1 part of wetting agent, 0.8 part of thickener A, 1.5 part of thickener B.

[0047] 180 parts by mass of polyethylene glycol (PEG-2000) and 28 parts by mass of isophorone diisocyanate (IPDI) were added to a three-necked flask with nitrogen protection, and the reaction was mechanically stirred at 80 ° C for 2 h, and then added dropwise for 10 Mass parts of 1,4-butanediol (BDO) were reacted at the same temperature for 0.5h, and then 15 parts by mass of 2,2-dimethylolpropionic acid (DMPA) were added to react for 1.5h; the temp...

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Abstract

The invention belongs to the technical field of sealants, and particularly relates to an organosilicone modified polyurethane acrylic sealant, which is prepared from the following raw materials in parts by mass: 100 to 200 parts of polyethylene glycol, 26 to 30 parts of isophorone diisocyanate, 9 to 11 parts of 1, 4-butanediol, 2 to 4 parts of 2, 4-diphenyl-1, 3-pentanediol, 2 to 4 parts of 2, 4-diphenyl-1, 3-pentanediol, 2 to 4 parts of 2, 4-diphenyl-1, the coating is prepared from the following components in parts by weight: 13 to 16 parts of 2, 2-dimethylolpropionic acid, 6 to 7 parts of E-44 epoxy resin, 7 to 8 parts of a silane coupling agent, 1.5 to 2.7 parts of triethylamine, 25 to 30 parts of waterborne acrylic resin, 6 to 7 parts of a solvent, 1 to 2 parts of texanol, 0.5 to 0.8 part of a defoaming agent and 0.8 to 1 part of a wetting agent. The invention also discloses a preparation method. The sealant can resist corrosion of most daily chemical products, cannot be corroded by most daily chemical products to cause reduction of adhesive force, cannot cause phenomena of colloid falling, foaming and pulverization when being in contact with most daily chemical products, is suitable for various use environments of users, cannot generate bubbles in the curing process, and is high in sealing performance. The air tightness of a construction part can be ensured, and the health and safety of personnel cannot be harmed in the operation and use process.

Description

technical field [0001] The invention relates to the technical field of sealants, in particular to an organosilicon modified polyurethane acrylic sealant and a preparation method thereof. Background technique [0002] Electronic sealants usually have good sealing properties and can bond with different types of materials. Construction at the material joints will block external moisture, moisture and dust from the outside of the electronic components, and protect the electronic components from damage. Electronic sealants have been widely used in new energy, military, medical, aviation, ships, electronics, automobiles, instruments, power supplies, high-speed rail and other industries. [0003] Now, more and more electronic products pay attention to the waterproof characteristics of their products, and the improvement of waterproof characteristics mainly relies on structural waterproofing and sealant waterproofing. Structural waterproofing is mainly to reduce the splicing of the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/04C09J11/08
CPCC09J175/04C09J11/08C08L33/00
Inventor 熊一帜曾煜孙润鹤邓磊乔李绘江符饶生
Owner HUNAN SOKAN NEW MATERIAL
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