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Thermosetting polyimide aerogel resistant to 350 DEG C and preparation method

A technology of polyimide and airgel, which is applied in the field of polyimide airgel and its preparation, can solve the problems of polyimide airgel temperature resistance and low high-temperature strength, and achieve the goal of ensuring high-temperature strength Effect

Active Publication Date: 2022-08-05
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention aims to solve the problems of low temperature resistance and high-temperature strength of the existing polyimide airgel, and further provides a thermosetting polyimide airgel resistant to 350°C and a preparation method thereof

Method used

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  • Thermosetting polyimide aerogel resistant to 350 DEG C and preparation method
  • Thermosetting polyimide aerogel resistant to 350 DEG C and preparation method
  • Thermosetting polyimide aerogel resistant to 350 DEG C and preparation method

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specific Embodiment approach 1

[0033] Embodiment 1: A thermosetting polyimide aerogel resistant to 350°C in this embodiment is prepared from tertiary amines, aromatic diamines, aromatic dianhydrides, end-capping agents and solvents; the The molar ratio of aromatic diamine and aromatic dianhydride is 1:(0.50~0.90); the molar ratio of the aromatic diamine and tertiary amine is 1:(0.05~2); the aromatic diamine and the end-capping agent The molar ratio is 1:(0.2~1); the mass ratio of the aromatic diamine to the solvent is 1:(2~20); and the acid anhydride functional group of the aromatic dianhydride and the acid anhydride functional group of the capping agent are The total number of moles is equal to the number of moles of amino functional groups of the aromatic diamine;

[0034] The aromatic diamine is composed of p-phenylenediamine and fluorenyl-containing diamine, and the molar ratio of the p-phenylenediamine and the fluorenyl-containing diamine is 1:(0.05-0.15); Fluorenyldiamine is 9,9-bis[4-(4-aminophenoxy...

specific Embodiment approach 2

[0047] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the solvent is water. Others are the same as the first embodiment.

specific Embodiment approach 3

[0048] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that the tertiary amines are triethylamine, trialkyl tertiary amine, octadecyldimethyl tertiary amine and dodecyl amine. One or several mixtures of alkyl dimethyl tertiary amines. Others are the same as in the first or second embodiment.

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Abstract

The invention discloses 350 DEG C-resistant thermosetting polyimide aerogel and a preparation method thereof, and relates to polyimide aerogel and a preparation method thereof. The problems that existing polyimide aerogel is low in temperature resistance and high-temperature strength are solved. The 350 DEG C-resistant thermosetting polyimide aerogel is prepared from tertiary amine, aromatic diamine, aromatic dianhydride, an end-capping reagent and a solvent, the preparation method comprises the following steps: 1, weighing; 2, adding a solvent and p-phenylenediamine into a three-necked bottle for reaction under the conditions of nitrogen atmosphere, certain temperature and stirring, heating, adding aromatic dianhydride, fluorenyl-containing diamine and tertiary amine, stirring for reaction, finally adding an end-capping reagent, cooling and standing; 3, freeze-drying; and 4, carrying out thermal imidization reaction.

Description

technical field [0001] The present invention relates to a polyimide aerogel and a preparation method. Background technique [0002] Lightweight structures, including foam, honeycomb, aerogel and other structures, have higher specific strength and specific modulus than solid materials, good fatigue resistance and vibration resistance, and can effectively absorb shock loads. The advantages that a series of traditional materials do not possess have become one of the indispensable key materials in aviation, aerospace, electronics and other fields. With the development of aerospace vehicles in the direction of high speed and high performance, they are required to have better mechanical properties, lower density and thermal stability at high temperatures (≥350°C). At present, commercial foam, honeycomb, aerogel and other product structures have been unable to meet the requirements of honeycomb resistance above 300 ℃. [0003] Polyimide has good mechanical properties, excellent c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08J9/28C08L79/08
CPCC08G73/1071C08G73/1067C08G73/1014C08G73/1042C08G73/1039C08J9/28C08J2379/08C08J2205/026C08J2201/0484Y02P20/54
Inventor 刘长威王德志周东鹏肖万宝宿凯范旭鹏赵立伟杨海冬李洪峰冯浩张杨刘成臻
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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