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Device and method for modifying surface of micro-nano powder

A powder surface modification, micro-nano technology, applied in vacuum evaporation plating, coating, sputtering and other directions, can solve the problem of less powder and achieve the effect of high coverage

Pending Publication Date: 2022-08-05
西安稀有金属材料研究院有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The device perfectly solves the problem of a small amount of powder in a single treatment on the premise of ensuring the uniformity, compactness and purity requirements through a special vibration turning method, combined with a vacuum feeding device and a storage device. , and the powder is based on the existing equipment, by selecting different evaporation sources, it can realize the preparation of modified materials such as metals, ceramics and non-metals

Method used

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  • Device and method for modifying surface of micro-nano powder
  • Device and method for modifying surface of micro-nano powder
  • Device and method for modifying surface of micro-nano powder

Examples

Experimental program
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Effect test

Embodiment 1

[0039] like figure 1 , figure 2 and image 3 As shown, the device for modifying the surface of micro-nano powder in this embodiment includes a vacuum chamber 1, and a vibrating material turning mechanism is installed in the vacuum chamber 1, and the vibrating material turning mechanism includes a vibrating bowl 2, and the vibrating bowl 2. The upper part is provided with a dust baffle 3 that opens or closes the vibrating bowl 2, the middle part of the vibrating bowl 2 is provided with a guide column 4, the lower side of the vibrating bowl 2 is provided with a vibrator 5, and the lower side of the vibrating bowl 2 There is also a support column 6 for supporting the vibrating bowl 2, an evaporation source 7 for processing the powder inside the vibrating material turning mechanism is installed on the vacuum chamber 1, and the lower part of the vibrating bowl 2 is provided with an opening through the material guide column 4. Or a closed feed port.

[0040] It should be noted t...

Embodiment 2

[0050] This embodiment includes the following steps:

[0051] Step 1: Divide the powder into three equal parts and load them into the vibrating bowl 2, the vacuum chamber 12 and the powder chamber 13 respectively, close the dust baffle 3, and obtain the modification device equipped with the powder; the powder is the total amount. 150g, Ti powder with a particle size of 50nm~100nm;

[0052] Step 2: Evacuate the vacuum chamber 1 of the powder modification device obtained in the step 1 and fill it with argon, then heat the powder in the vibrating bowl 2, and open the dust baffle 3 to obtain A modification device equipped with heated powder; the pressure in the vacuum chamber 1 is 1.0×10 -4 Pa, the heating is to heat the powder to 120°C;

[0053] Step 3, open the vibrator 5 and the vibrating block 8 of the modification device that is equipped with the heating powder obtained in the step 2, so that the powder is turned in the vibrating bowl 2, and the bias power supply 9 is loade...

Embodiment 3

[0059] This embodiment includes the following steps:

[0060] Step 1: Load the powder into the vibrating bowl 2, close the dust baffle 3, and obtain a modification device equipped with the powder; the powder is 500 g of Al with a particle size of 200 μm to 300 μm 2 O 3 pink;

[0061] Step 2: Evacuate the vacuum chamber 1 of the powder modification device obtained in the step 1 and fill it with argon, then heat the powder in the vibrating bowl 2, and open the dust baffle 3 to obtain A modification device equipped with heated powder; the pressure in the vacuum chamber 1 is 2.0×10 -3 Pa, the heating is to heat the powder to 100°C;

[0062] Step 3, open the vibrator 5 and the vibrating block 8 of the modification device that is equipped with the heating powder obtained in the step 2, so that the powder is turned in the vibrating bowl 2, and the bias power supply 9 is loaded to the vibrating bowl 2 simultaneously to obtain The modification device of the powder to be modified is...

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Abstract

The invention discloses a micro-nano powder surface modification device which comprises a vacuum chamber and a vibration material turning mechanism, the vibration material turning mechanism comprises a vibration bowl and a dust baffle, a material guide column is installed in the middle of the vibration bowl, a vibrator and a supporting column are installed on the lower side of the vibration bowl, and an evaporation source for treating powder in the vibration material turning mechanism is installed on the vacuum chamber. The invention further provides a method for modifying the surface of the micro-nano powder. The method comprises the following steps: putting the powder into the vibration turning mechanism, and modifying by adopting the evaporation source. The surface of each powder is fully exposed to plasma through cooperation of the vibration material turning mechanism and the evaporation source, the high coating rate of powder surface modification is ensured, the single-time powder treatment capacity can reach the kilogram level on the premise that the requirements for uniformity, compactness and purity are ensured through combination of the vacuum feeding assembly and the material storage assembly, and the production efficiency is improved. And the method also realizes surface modification of different micro-nano powder, has a wide application prospect, and can be used for industrial mass production.

Description

technical field [0001] The invention belongs to the technical field of surface modification of micro-nano powder, and in particular relates to a device and method for modifying the surface of micro-nano powder. Background technique [0002] With the continuous demand for high-performance materials, various difficulties have been encountered in the research and development of powder metallurgy technology. Among them, the most important technical problem affecting the performance of materials is the interface bonding of materials. Doping, mechanical alloying and other methods are used to improve the interface problem, but these methods have problems such as uneven distribution of elements. [0003] Therefore, in order to obtain excellent interfacial bonding, the researchers envisage surface modification by coating the surface of the powder with the core-shell structure of the modified film, and then sintering to improve the interfacial bonding force. However, in order to obtai...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/22C23C14/30C23C14/32C23C14/35
CPCC23C14/223C23C14/35C23C14/325C23C14/30
Inventor 郑富凯张思雨胡小刚邱龙时潘晓龙张于胜
Owner 西安稀有金属材料研究院有限公司
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