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UV-cured conductive silver paste and preparation method thereof

A technology of conductive silver paste and solidification solution, which is applied in the manufacture of cables/conductors, conductive materials dispersed in non-conductive inorganic materials, circuits, etc., and can solve the problems of silver paste adhesion, bending resistance, and cost pressure. Problems, achieve the effect of enhancing the conductive effect, reducing the dosage, and contacting closely

Pending Publication Date: 2022-08-05
SHENZHEN TONGTAIYING ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

On the one hand, high silver powder filling will increase the cost pressure, on the other hand, it will also have a negative impact on the adhesion and bending resistance of the silver paste after curing.

Method used

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  • UV-cured conductive silver paste and preparation method thereof
  • UV-cured conductive silver paste and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] The present embodiment shows a preparation method of a UV-cured conductive silver paste, which specifically includes the following steps:

[0027] Step 1: Weigh 0.5 parts of 1-hydroxycyclohexyl phenyl ketone, 0.25 parts of isopropylthioxanthone, 1 part of acrylic acid, 4 parts of 1,4-hexanediol diacrylate and add them to the reaction kettle, heat When the temperature reaches 50°C, the initiator is fully dissolved by high-speed stirring, and then cooled to room temperature to obtain a photo-initiated curing solution;

[0028] Step 2: Weigh 8 parts of polyester acrylate, 10 parts of urethane acrylate, 0.25 parts of tetraneoalkoxy bis(didecyl phosphite acyloxy) titanate and 76 parts of 500nm spherical silver powder into step 1 In the initiating curing solution of , use a three-roll mill to grind the conductive adhesive with a fineness of less than 5 μm;

[0029] Step 3: Print the conductive adhesive on the PET film with 300 mesh screen, and then use 1500mW / cm 2 The cured...

Embodiment 2

[0032] The present embodiment shows a preparation method of a UV-cured conductive silver paste, which specifically includes the following steps:

[0033] Step 1: Weigh 0.5 parts of 1-hydroxycyclohexyl phenyl ketone, 0.25 parts of isopropylthioxanthone, 1 part of acrylic acid, and 5 parts of 1,4-hexanediol diacrylate and add them to the reaction kettle, heat When the temperature reaches 55 °C, the initiator is fully dissolved by high-speed stirring, and then cooled to room temperature to obtain a photo-initiated curing liquid;

[0034] Step 2: Weigh 13 parts of polyester acrylate, 10 parts of urethane acrylate, 0.25 parts of tetraneoalkoxy bis(didecyl phosphite acyloxy) titanate and 70 parts of 500nm spherical silver powder and add them to step 1 In the initiating curing solution of , use a three-roll mill to grind the conductive adhesive with a fineness of less than 5 μm;

[0035] Step 3: Print the conductive adhesive on the PE film with 400 mesh screen, and then use 1500mW / c...

Embodiment 3

[0038] The present embodiment shows a preparation method of a UV-cured conductive silver paste, which specifically includes the following steps:

[0039]Step 1: Weigh 0.5 parts of 1-hydroxycyclohexyl phenyl ketone, 0.25 parts of isopropylthioxanthone, 1.5 parts of acrylic acid, and 5 parts of 1,4-hexanediol diacrylate and add them to the reaction kettle, heat At 45°C, stir at a high speed to fully dissolve the initiator, and then cool to room temperature to obtain a photoinitiated solidification solution;

[0040] Step 2: Weigh 10 parts of polyester acrylate, 10 parts of polyurethane acrylate, 0.75 parts of tetraneoalkoxy bis(didecyl phosphite acyloxy) titanate and 72 parts of 200nm flake silver powder and add to step 1 In the initiating solidification solution in , use a three-roll mill to grind the conductive adhesive with a fineness of less than 5 μm;

[0041] Step 3: Print the conductive adhesive on the PC film with 500 mesh screen, and then use 2500mW / cm 2 The cured sil...

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Abstract

The invention relates to the technical field of new material preparation, in particular to UV curing conductive silver paste and a preparation method thereof. The preparation method of the UV-cured conductive silver paste comprises the following steps: step 1, dissolving a photoinitiator in a reactive diluent under a heating condition, and cooling to obtain a photo-initiation curing liquid; step 2, adding a prepolymer, a conductive additive and conductive powder into the photo-initiation curing liquid in the step 1, and grinding to obtain a conductive adhesive; wherein the conductive auxiliary agent is prepared from at least one of tetra-neo-alkoxy bis (didecyl phosphorous acid acyloxy) titanate, isopropoxy dioleic acid acyloxy (dioctyl phosphate acyloxy) titanate and isopropoxy trioleic acid acyloxy titanate. The conductive auxiliary agent is prepared from at least one of the following components: tetrakis (neo-alkoxy) bis (didecyl phosphorous acid acyloxy) titanate, isopropoxy dioleic acid acyloxy (dioctyl phosphate acyloxy) titanate and isopropoxy trioleic acid acyloxy titanate. According to the invention, the titanate coupling agent with a special structure is innovatively introduced as a conductive auxiliary agent, so that the use amount of silver powder can be effectively reduced, the conductivity of the silver paste can be improved, the flexibility of the cured silver paste can be enhanced, and the bending resistance can be improved.

Description

technical field [0001] The invention relates to the technical field of preparation of conductive silver paste, in particular to a UV-cured conductive silver paste and a preparation method thereof. Background technique [0002] Conductive silver paste is an important part of electronic products and is widely used in printed circuits, semiconductor packaging, solar cells and other fields. Most of the existing conductive silver pastes are epoxy resin systems, which have problems such as high curing temperature, long time, and solvent volatilization. The UV-curable conductive silver paste developed in recent years has the advantages of high curing efficiency, no solvent emission, energy saving and environmental protection, and has gradually become a new trend in the development of conductive silver paste. At present, in order to achieve high conductivity of UV-curable conductive silver paste, more than 80% silver powder filling amount is often required. On the one hand, a high...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B13/00H01B1/22
CPCH01B13/00H01B13/0016H01B13/003H01B1/22Y02E10/50
Inventor 张子靖王江何云蔚莫海彬胡涢波
Owner SHENZHEN TONGTAIYING ELECTRONICS TECH CO LTD
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