Inductor and preparation method thereof, and preparation method of low-voltage integrally-formed inductor material

Abstract

The invention discloses an inductor, a preparation method of the inductor and a preparation method of a low-voltage integrally-formed inductor material. The preparation method of the low-voltage integrally-formed inductor material comprises the steps that first particle powder treatment is conducted, specifically, first particle powder containing 90-94 wt% of Fe, 2.9-4.5 wt% of Si, 0.5-3.0 wt% of P, 0.5-3.0 wt% of B, 0.05-0.75 wt% of C and 0.05-0.75 wt% of Mn is mixed with ammonia water and then dried till the water content ranges from 1 wt% to 10 wt%, and then heat treatment is conducted; a resin suspension preparation step: mixing the second particle powder with at least one of liquid epoxy resin, liquid phenolic aldehyde or liquid polyester resin, and adding ester and ketone solvents for dispersion to form a resin suspension; and a mixing treatment step: mixing the resin suspension and the first particle powder subjected to heat treatment, and drying to obtain the low-pressure integrally-formed material. According to the scheme of the invention, through the cooperation of the selection of material components, the design of a treatment process, the design of a resin formula and the like, the pressure required by molding can be reduced, the magnetic conductivity is improved, and the technical problems existing in the prior art are solved.

Description

technical field [0001] The invention relates to the technical field of preparation of soft magnetic alloy materials, in particular to an inductor and a preparation method thereof, and a preparation method of a low-voltage integrally formed inductor material. Background technique [0002] With the development of electronic products, their functions are more and more, and their size is getting smaller and smaller, and the size of the inductive device is also rapidly decreasing. The miniaturization of the size makes the processing more and more difficult. It is mainly manifested in that after integral pressing, either the open circuit problem of the product is serious, or the performance cannot meet the requirements, such as low magnetic permeability and poor insulation. Therefore, it is urgent to solve this dilemma brought about by the miniaturization of inductors. [0003] It should be noted that the information disclosed in the above Background section is only for understan...

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Problems solved by technology

[0002] With the development of electronic products, their functions are more and more, and the size is getting smaller and smaller. The size of the inductance device is also decreasing rapidly. Among them, the integrated inductor is used more and more because of its superior performance, but with the The miniaturization of the size makes the processing more and more difficult, which is mainly reflected in the fact that after the integral pressing, the open circuit problem of the product is serious, or the performance cannot meet the requirements, such as the magnetic permeability is too low, the insulation is not good, etc.

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