Unlock instant, AI-driven research and patent intelligence for your innovation.

Liquid for reducing copper oxides and process thereof

A technology of copper oxide and treatment method, which is applied in the secondary treatment of printed circuits, the improvement of metal adhesion of insulating substrates, electrical components, etc., and can solve the problem of treatment time, treatment temperature limitation, difficulty in reduction treatment cost, and easy to decompose treatment liquid Life and other issues, to achieve the effect of preventing treatment costs, increasing treatment costs, and preventing life shortening

Inactive Publication Date: 2004-11-03
MELTEX
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, it is difficult to fully reduce the copper oxide layer to metallic copper by adopting the methods disclosed in JP-A-64-8479 and JP-1-156479, and there are also problems such as very limited treatment time and treatment temperature.
Moreover, the treatment method using dimethylamine borane has the problem that dimethylamine borane is easy to decompose, resulting in a short service life of the treatment liquid.
Moreover, the price of reducing agents such as sodium borohydride and dimethylamine borane is high, and it is difficult to reduce the cost of reduction treatment

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] First, a 1 mm thick copper substrate (25.5 cm × 25.5 cm) with a thickness of 35 μm electrolytic copper foil was subjected to pretreatment (immersion in Empret PC-499 manufactured by Meltex Co., Ltd. at 70° C. for 5 minutes) →Water washing→Immerse in Meltex Co., Ltd. Melpure-to AD-331 at 25°C for 1 minute→Water washing→Immerse in 10% sulfuric acid aqueous solution at room temperature for 1 minute→Water washing→Meltex Co., Ltd. トMB-438A 35mL / L aqueous solution at room temperature for 1 minute). Then, immerse in an aqueous solution containing 80 mL / L of Empret MB-438A manufactured by Meltex Co., Ltd. and 130 mL / L of Empret MB-438B manufactured by Meltex Co., Ltd. (5 minutes at 80° C.), and then, After washing, a copper oxide film is formed on the surface. The surface of the copper oxide thin film has fine irregularities.

[0039] Next, dimethylamine borane was added to water so as to have the concentrations shown in the following Tables 1 and 2 to prepare treatment soluti...

Embodiment 2

[0049] First, in the same manner as in Example 1, a copper oxide thin film was formed on the surface of the copper substrate.

[0050] Next, dimethylamine borane was added to a basic bath (pH=13) having the following components so as to have the concentrations shown in Tables 3 and 4 below to prepare a treatment solution (sample 2-1 to 2-15 ), and after 5 minutes of preparation, the copper substrate on which the copper oxide was formed was dipped (at 50° C. for 5 minutes) to perform a reduction treatment of the copper oxide. Furthermore, the volume of the treatment liquid was adjusted so that the treated area of ​​the copper substrate per unit volume of liquid was as shown in Tables 3 and 4 below.

[0051] (basic bath composition)

[0052] ·37% formaldehyde solution …10mL / L

[0053] ·Sodium hydroxide …10g / L

[0054] · Water … balance

[0055] After performing the reduction treatment and drying, the copper substrate was immersed in a 50% hydrochloric acid aqueous solution f...

Embodiment 3

[0060] First, in the same manner as in Example 1, a copper oxide thin film was formed on the surface of the copper substrate.

[0061] Next, the set treatment liquids (Samples 3-1 to 3-10) were prepared under the conditions of the concentration of dimethylamine borane, the concentration of 37% aqueous formaldehyde solution, and the pH of the treatment liquid as shown in Table 5 below. The treatment solution is prepared by adding dimethylamine borane to a basic bath containing an aqueous formaldehyde solution, and immersing the above-mentioned copper substrate for forming copper oxides (5 minutes at 50° C.) after preparation for 5 minutes to perform reduction treatment of copper oxides . Adjust the pH by changing the amount of sodium hydroxide added. Also, the treatment liquid volume was adjusted according to the copper substrate treatment area per unit liquid volume shown in Table 5 below.

[0062] After performing the reduction treatment and drying, the copper substrate was...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

There are provided a treatment solution for reducing a copper oxide formed on the surface of copper to copper, wherein dimethylamine borane is contained in an amount of 0.3 to 2.0 g / L and the relationship y>=0.232x-0.185 holds between the concentration y (g / L) of dimethylamine borane and an area x (dm2 / L) to be treated per unit solution amount, and a treatment method for reducing a copper oxide formed on the surface of a copper material to copper by dipping the copper material in the treatment solution as described above, wherein the addition of dimethylamine borane to water is carried out within 10 minutes before the dipping of the copper material or after the dipping of the copper material.

Description

field of invention [0001] The present invention relates to a treatment liquid and a treatment method for reducing copper oxides that improve adhesion to resins, and in particular, to improving the adhesion between copper wiring for inner layers and resin layers when manufacturing multilayer printed wiring boards, Furthermore, the treatment liquid and treatment method improve the acid resistance of copper wiring for inner layers. Background technique [0002] In the manufacture of multilayer printed wiring boards, if the surface of the copper wiring for the inner layer adhered to the resin layer in multiple layers is smooth, the adhesion becomes weak. Therefore, at present, cuprous oxide or oxide Copper oxide layer of copper etc. Such a copper oxide layer has fine unevenness on its surface, so it has a mechanical fixation effect on the resin layer, and since it has a high chemical affinity to the resin layer, it has extremely excellent adhesion to the resin layer. [0003] ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C23C22/63C22B15/00C23C22/83H05K3/38
CPCC22B15/00H05K3/385C23C22/83C23C22/63
Inventor 藤田康治池岛贤司
Owner MELTEX