Adhesive for mutual inductor, and preparing method thereof
A technology of adhesives and transformers, applied in the direction of adhesives, adhesive types, epoxy resin glue, etc., can solve problems such as fluctuations in bonding strength, failure to meet production requirements, peeling of diamond glue, etc., to achieve easy raw materials and reduce storage and transportation The effect of simple cost and production process
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Embodiment 1
[0030] 1). The mass parts of each component of the epoxy resin adhesive are as follows:
[0031] Bisphenol A epoxy resin E-44:2 with an epoxy equivalent (g / eq) of 210-250;
[0032] Bisphenol A epoxy resin E-12:95 with an epoxy equivalent (g / eq) of 800-1200;
[0033] β,β′-Dimethylaminoethoxy-1,3,6,2-dioxaborocane: 2
[0034] Dicyandiamide: 1; Ethyl acetate: 100; Ethylene glycol methyl ether: 2.
[0035] 2). The preparation steps of epoxy resin adhesive are as follows:
[0036] ①. Add 80 parts of ethyl acetate into a four-necked bottle equipped with a thermometer, spherical condenser and stirrer, and then add bisphenol A epoxy resin E-12 while stirring. Stir and heat up to 75°C, the resin gradually dissolves to form a homogeneous liquid, which is used as component A.
[0037] ②. At room temperature, the solution of bisphenol A epoxy resin E-44 dissolved in 20 parts of ethyl acetate was used as component B.
[0038] ③. At room temperature, mix the two components A and B acco...
Embodiment 2
[0042] 1). The mass parts of each component of the epoxy resin adhesive are as follows:
[0043] Bisphenol A epoxy resin E-44:4 with an epoxy equivalent (g / eq) of 210-250;
[0044] Bisphenol A epoxy resin E-12:92 with an epoxy equivalent (g / eq) of 800-1200;
[0045] β,β′-Dimethylaminoethoxy-1,3,6,2-dioxaborocane: 1.5
[0046] Dicyandiamide: 2.5; Ethyl acetate: 100; Ethylene glycol methyl ether: 4.
[0047] 2). The preparation steps of epoxy resin adhesive are as follows:
[0048] ①. Add 80 parts of ethyl acetate into a four-necked bottle equipped with a thermometer, spherical condenser and stirrer, and then add bisphenol A epoxy resin E-12 while stirring. Stir and heat up to 70°C, the resin gradually dissolves to form a homogeneous liquid, which is used as component A.
[0049] ②. At room temperature, the solution of bisphenol A epoxy resin E-44 dissolved in 20 parts of ethyl acetate was used as component B.
[0050] ③. At room temperature, after mixing components A and B...
Embodiment 3
[0054] 1). The mass parts of each component of the epoxy resin adhesive are as follows:
[0055] Bisphenol A type epoxy resin E-44 with an epoxy equivalent (g / equivalent) of 210-250; 8;
[0056] Bisphenol A epoxy resin E-12:88 with an epoxy equivalent (g / eq) of 800-1200;
[0057] β, β'-Dimethylaminoethoxy-1,3,6,2-dioxaborocane: 1;
[0058] Dicyandiamide: 3; ethyl acetate: 100; ethylene glycol methyl ether: 6.
[0059] 2). The preparation steps of epoxy resin adhesive are as follows:
[0060] ①. Add 80 parts of ethyl acetate into a four-necked bottle equipped with a thermometer, spherical condenser and stirrer, and then add bisphenol A epoxy resin E-12 while stirring. Stir and heat up to 65°C, the resin gradually dissolves to form a homogeneous liquid, which is used as component A.
[0061] ②. At room temperature, the solution of bisphenol A epoxy resin E-44 dissolved in 20 parts of ethyl acetate was used as component B.
[0062] ③. At room temperature, after mixing the tw...
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