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Adhesive for mutual inductor, and preparing method thereof

A technology of adhesives and transformers, applied in the direction of adhesives, adhesive types, epoxy resin glue, etc., can solve problems such as fluctuations in bonding strength, failure to meet production requirements, peeling of diamond glue, etc., to achieve easy raw materials and reduce storage and transportation The effect of simple cost and production process

Inactive Publication Date: 2004-11-17
SHANGHAI UNIV OF ENG SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, its toughness is poor, and it is easy to cause the applied diamond glue to peel off.
When it is combined with diethyl-tetramethylimidazole, due to the low activity temperature of diethyl-tetramethylimidazole, the pot life at room temperature is short, so after using the above formula, the storage period of up to 6 months Internally, the partial curing of the resin will cause fluctuations in the bond strength, which cannot meet the needs of production

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] 1). The mass parts of each component of the epoxy resin adhesive are as follows:

[0031] Bisphenol A epoxy resin E-44:2 with an epoxy equivalent (g / eq) of 210-250;

[0032] Bisphenol A epoxy resin E-12:95 with an epoxy equivalent (g / eq) of 800-1200;

[0033] β,β′-Dimethylaminoethoxy-1,3,6,2-dioxaborocane: 2

[0034] Dicyandiamide: 1; Ethyl acetate: 100; Ethylene glycol methyl ether: 2.

[0035] 2). The preparation steps of epoxy resin adhesive are as follows:

[0036] ①. Add 80 parts of ethyl acetate into a four-necked bottle equipped with a thermometer, spherical condenser and stirrer, and then add bisphenol A epoxy resin E-12 while stirring. Stir and heat up to 75°C, the resin gradually dissolves to form a homogeneous liquid, which is used as component A.

[0037] ②. At room temperature, the solution of bisphenol A epoxy resin E-44 dissolved in 20 parts of ethyl acetate was used as component B.

[0038] ③. At room temperature, mix the two components A and B acco...

Embodiment 2

[0042] 1). The mass parts of each component of the epoxy resin adhesive are as follows:

[0043] Bisphenol A epoxy resin E-44:4 with an epoxy equivalent (g / eq) of 210-250;

[0044] Bisphenol A epoxy resin E-12:92 with an epoxy equivalent (g / eq) of 800-1200;

[0045] β,β′-Dimethylaminoethoxy-1,3,6,2-dioxaborocane: 1.5

[0046] Dicyandiamide: 2.5; Ethyl acetate: 100; Ethylene glycol methyl ether: 4.

[0047] 2). The preparation steps of epoxy resin adhesive are as follows:

[0048] ①. Add 80 parts of ethyl acetate into a four-necked bottle equipped with a thermometer, spherical condenser and stirrer, and then add bisphenol A epoxy resin E-12 while stirring. Stir and heat up to 70°C, the resin gradually dissolves to form a homogeneous liquid, which is used as component A.

[0049] ②. At room temperature, the solution of bisphenol A epoxy resin E-44 dissolved in 20 parts of ethyl acetate was used as component B.

[0050] ③. At room temperature, after mixing components A and B...

Embodiment 3

[0054] 1). The mass parts of each component of the epoxy resin adhesive are as follows:

[0055] Bisphenol A type epoxy resin E-44 with an epoxy equivalent (g / equivalent) of 210-250; 8;

[0056] Bisphenol A epoxy resin E-12:88 with an epoxy equivalent (g / eq) of 800-1200;

[0057] β, β'-Dimethylaminoethoxy-1,3,6,2-dioxaborocane: 1;

[0058] Dicyandiamide: 3; ethyl acetate: 100; ethylene glycol methyl ether: 6.

[0059] 2). The preparation steps of epoxy resin adhesive are as follows:

[0060] ①. Add 80 parts of ethyl acetate into a four-necked bottle equipped with a thermometer, spherical condenser and stirrer, and then add bisphenol A epoxy resin E-12 while stirring. Stir and heat up to 65°C, the resin gradually dissolves to form a homogeneous liquid, which is used as component A.

[0061] ②. At room temperature, the solution of bisphenol A epoxy resin E-44 dissolved in 20 parts of ethyl acetate was used as component B.

[0062] ③. At room temperature, after mixing the tw...

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Abstract

An adhesive for mutual inductor is prepared from the biphenol A-type mixed epoxy resin prepared from epoxy chloropropane, phenol and acetone through condensation, and the latent solidifying system prepared from beta, beta'-dimethylaminoethoxy-1,3,6,2-dioxaboron heterooctacycle and dicyanoamine through mixing, through mixing. Its advantages are high performance, low cost of storage and transportation, and wide application range.

Description

technical field [0001] The invention belongs to the field of adhesives, in particular to rhombic adhesives for transformers and a preparation method thereof. Background technique [0002] A transformer is a type of transformer used to transmit information to measurement, protection and control devices. When used to transform current or voltage, they are called current transformers and voltage transformers, respectively. Transformers have to withstand the working voltage of the power system for a long time during operation, so there are quite high requirements for insulating materials. [0003] The solid insulating medium formed by curing the synthetic resin adhesive has the characteristics of high dielectric strength, high mechanical strength, moisture resistance, and fire prevention. Resin adhesive has good fluidity at room temperature or high temperature, can fill small gaps in the insulating layer, can be cast into various desired shapes, and can firmly bond metal and m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J163/02
Inventor 陈月辉
Owner SHANGHAI UNIV OF ENG SCI