Method for electroforming nickel-cobalt alloy

A technology of cobalt alloy and electroforming nickel, which is applied in the field of non-ferrous metal electroforming nickel-cobalt alloy layer, which can solve the problems of poor bonding between the coating and the substrate, thin coating, non-wear resistance, large coating stress, etc., and achieve small changes in atomic bonds , reduce cracks, high hardness and wear resistance

A technology of cobalt alloy and electroforming nickel, which is applied in the field of non-ferrous metal electroforming nickel-cobalt alloy layer, which can solve the problems of poor bonding between the coating and the substrate, thin coating, non-wear resistance, large coating stress, etc., and achieve small changes in atomic bonds , reduce cracks, high hardness and wear resistance

CN1239752CInactive Publication Date: 2006-02-01ELECTROMECHANICAL APPTS PLANT MASCH MFG ANGANG GRP

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] The copper plate that has been degreased and derusted before electroplating is placed in the plating tank, and the nickel-cobalt alloy layer is electroformed.

[0029] The composition and optimal ratio of the electroplating solution are:

[0030] NiSO 4 *7H 2 O 180g / l,

[0031] NiCl 2 *6H 2 O 10g / l,

[0032] CoSO 4 *7H 2 O 15g / l,

[0033] NaCl 1g / l,

[0034] h 3 BO 3 30g / l,

[0035] C 12 h 25 SO 4 Na 0.3g / l,

[0036] ADD1 is the aqueous solution of saccharin and glucose 6ml / l,

[0037] ADD2 is the aqueous solution of sodium formate and citric acid 10ml / l,

[0038] The process conditions are: PH value = 2.5, current density = 2.5A / dm 2 Temperature 55°C

[0039] S 阴 :S 阳 =1:2, stirring method: reciprocating cathode movement, mechanical stirring.

Embodiment 2

[0040] Embodiment 2, the copper plate that degreasing before electroplating, derusting treatment is placed in plating tank, electroforms nickel-cobalt alloy layer, and the composition and preferred proportioning of electroplating solution are:

[0041] NiSO 4 *7H 2 O 220g / l,

[0042] NiCl 2 *6H 2 O 15g / l,

[0043] CoSO 4 *7H 2 O 45g / l,

[0044] NaCl 1g / l,

[0045] h 3 BO 3 30g / l,

[0046] C 12 h 25 SO 4 Na 0.4g / l,

[0047] ADD1 is the aqueous solution of saccharin and glucose 8ml / l,

[0048] ADD2 is the aqueous solution of sodium formate and citric acid 15ml / l,

[0049] The process conditions are: PH value = 3, current density = 4A / dm 2 Temperature 60°C

[0050] S 阴 :S 阳 =1:3, stirring method: mechanical stirring or gas stirring.

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Abstract

The present invention relates to a method for electroforming nickel-cobalt alloy, belonging to the field of electroforming technology. The optimum composition of its electroplating solution includes nickel sulfate 220g / l, nickel chloride 15 g / l, cobalt sulfate 45g / l, sodium chloride Ig / l, boric acid 30g / l and sodium louryl sulfate 0.4 g / l. The thickness of nickel-cobalt alloy coat of the conticaster crystallizer copper plate electroformed by said invention is 2.0-3.0 mm. The binding force of the coat and base body is strong, the service life of the crystallizer copper plate is long.

Description

technical field [0001] The invention relates to a method for electroforming a nickel-cobalt alloy layer of nonferrous metals such as copper plates, and belongs to the field of electroforming. Background technique [0002] As the key component of the continuous casting machine, the mold copper plate has poor working conditions. Under the simultaneous action of high-temperature molten steel and cooling water, it is subjected to high-temperature oxidation, thermal fatigue, chemical corrosion, high-temperature cavitation, and vibration of casting dummy and mold. Unfavorable conditions such as friction, wear, scratches, etc. The mold copper plate of the continuous casting machine currently generally has a large coating stress, is prone to cracks, has poor bonding force between the coating and the plate base, the coating is easy to fall off, the coating is thin and not wear-resistant, and the service life is short. These disadvantages have not been completely solved so far. Cont...

Claims

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Application Information

Patent Timeline
01 Feb 2006
Publication
CN1239752C
IPC
C25D3/56; B22D11/057
Inventors
孙凤国; 原天壮