Photoresist film removing method and device therefor
A photoresist, relative position technology, applied in optics, optomechanical equipment, photosensitive material processing, etc., can solve the problem of high raw material cost and achieve the effect of reducing raw material cost
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
no. 1 example
[0044] As a second aspect of the present invention, the first embodiment relates to a method of removing a photoresist film using a photoresist film removing apparatus (A1 of FIG. 1).
[0045] In this application, the photoresist film to be removed refers to a film composed of a photoresist material containing an organic polymer compound (where the photoresist material is used in the process of manufacturing a semiconductor device), including a film whose surface is highly The film or its surface modified by atomic doping is coated with an inorganic film during etching.
[0046] The above-mentioned substrate with a photoresist film on its surface may include, for example, a silicon wafer, a glass substrate for a liquid crystal display, a glass-reinforced epoxy resin substrate used in the manufacture of a printed circuit board, etc., but it is not particularly limited thereto, As long as it is a common substrate material for any semiconductor device fabrication.
[0047] devic...
no. 2 example
[0075] The first embodiment above shows a method and apparatus for moving the substrate itself in order to change the relative position between the substrate surface and the solution level. However, the present invention also provides another method and apparatus for changing the level of the photoresist film removal solution to control the relative position. Figure 4 shows a device capable of varying the level of the solution to control the relative position.
[0076] The apparatus (A2) shown in FIG. 4 has a structure basically similar to that of the apparatus (A1) shown in FIG. ). However, in the apparatus (A2) of the second embodiment, it is not necessary to vertically move the substrate 8 in the airtight container 7 by the substrate cassette holder apparatus 10. The reaction tank 6 in the airtight container 7 is equipped with an automatic operation valve 61 for controlling the liquid level of the photoresist film removing solution 5 containing ozone-containing gas. The ...
no. 3 example
[0080] In addition to the method and device described in the first embodiment and the second embodiment above, the present invention also provides a different method and device, which also includes a sonotrode and uses the sonotrode to contain ozone-containing gas Ultrasonic oscillation is applied to the photoresist film removal solution and the substrate in order to increase the processing capacity.
[0081] FIG. 5 shows an example of a photoresist film removing apparatus (A3) used in the third embodiment, in which most of the components are the same as those described in the first embodiment except for the components and functions described in detail below.
[0082] The sonotrode 71 used in the device (A3) of the third embodiment may be a device known in the prior art. In FIG. 5, the ultrasonic generator 71 is close to the bottom wall of the airtight container 7, but it is not limited to this structure. As long as the ultrasonic vibration can effectively act on the photores...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More