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Adhesive tape for semiconductor device

An adhesive tape and semiconductor technology, which is applied in semiconductor devices, semiconductor/solid device manufacturing, electric solid devices, etc., can solve problems such as copper migration, double bond cracking, and loss of elasticity

Inactive Publication Date: 2007-01-24
TOMOEGAWA PAPER CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for tape boards using epoxy resin / NBR series adhesives, NBR is very soft during wire bonding, and there are wire bonding problems such as sinking of the land part and failure of the wire to adhere to the land part.
Also, there are problems with reflow resistance, wire bonding, and insulation due to long-term temperature changes, high temperatures, and high humidity
This is because NBR is made from diene compounds as the initial raw material, so when it is exposed to high temperature for a long time, the double bonds contained in the main chain will be cracked due to oxidation, and the elasticity will gradually be lost, the stress buffering effect will disappear, and solder joints will occur. issues such as connection reliability
And, especially when the wiring substrate is further refined, under high temperature and high humidity, due to the introduction of copper ions into the acrylonitrile group of NBR, problems such as copper migration occur.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] On one side of a protective film made of a polyethylene terephthalate film with a thickness of 38 μm after peeling, the coating for the adhesive layer of the following composition is coated with a thickness of 12 μm after drying, at 130 ℃ and dried for 5 minutes to form an adhesive film.

[0056] Subsequently, an insulating film made of polyimide with a thickness of 75 μm is superimposed on the adhesive film, and at 100 ° C and 1 kg / cm 2 The adhesive tape for semiconductor devices of the present invention is produced by thermocompression bonding under certain conditions.

[0057] (Paint used to form the adhesive layer)

[0058] ・A polyamide resin (amine value 20) formed by mixing 25% by mass of an unsaturated fatty acid dimer obtained from 90% by mass of linoleic acid and 10% by mass of oleic acid and hexamethylenediamine as condensation polymerization components , mass average molecular weight 2800) isopropanol / toluene mixed solution: 64 parts by mass

[0059] 50% b...

Embodiment 2

[0064] An adhesive tape for a semiconductor device of the present invention was produced in the same manner as in Example 1 except that the following composition was used as the adhesive layer forming paint. The thickness of the adhesive layer was 20 μm.

[0065] (Paint used to form the adhesive layer)

[0066] ・A polyamide resin (amine value 50) formed by mixing 25% by mass of an unsaturated fatty acid dimer obtained from 85% by mass of linoleic acid and 15% by mass of oleic acid and hexamethylenediamine as condensation polymerization components , mass average molecular weight 2300) isopropanol / toluene mixed solution: 47 parts by mass

[0067] ・A polyamide resin (amine value 15) formed by mixing 50% by mass of an unsaturated fatty acid dimer obtained from 80% by mass of linoleic acid and 20% by mass of oleic acid and hexamethylenediamine as condensation polymerization components , mass average molecular weight 8000) of methyl ethyl ketone mixed solution: 20 parts by mass

...

Embodiment 3

[0070] An adhesive tape for a semiconductor device of the present invention was produced in the same manner as in Example 1 except that the following composition was used as the adhesive layer forming paint. The thickness of the adhesive layer was 12 μm.

[0071] (Paint used to form the adhesive layer)

[0072] 25% by mass of a polyamide resin (amine value 20 , mass average molecular weight 2300) isopropanol / toluene mixed solution: 64 parts by mass

[0073] - Methyl ethyl ketone solution of 50% by mass of naphthalene-type epoxy resin (trade name: Epichrome HP7200 manufactured by Dainippon Inki Chemical Industry Co., Ltd.): 15 parts by mass

[0074] - Methyl ethyl ketone solution mixed with 50% by mass of a novolak-type resin (trade name: CKM2400 manufactured by Showa High Molecule Co., Ltd.): 6.5 parts by mass

[0075] - Methyl ethyl ketone solution mixed with 50% by mass of a novolak-type resin (trade name: ELS373Z manufactured by Showa High Molecular Co., Ltd.): 13 parts ...

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Abstract

An adhesive tape for a semiconductor device is provided to improve a bonding characteristic by forming a thermosetting adhesive layer on at least one side of an insulating film. An adhesive tape for semiconductor device includes an insulating film and a thermosetting adhesive layer. The thermosetting adhesive layer is disposed on at least one side of the insulating film. A product of an inverse of a thickness of the thermosetting adhesive layer and a loss elastic modulus of the thermosetting adhesive layer after thermosetting at 200 degrees is larger than 0.25 MPa / micrometers. Further, a product of an inverse of the thickness of the thermosetting adhesive layer and a retaining elastic modulus of the thermosetting adhesive layer after thermosetting at 200 degrees is larger than 1 MPa / micrometers. The thermosetting adhesive layer consists of a polyamide resin.

Description

technical field [0001] The present invention relates to the adhesive tape that semiconductor device uses, relate to the adhesive tape that is particularly suitable for the semiconductor device of surface mounting type semiconductor device in particular, and this adhesive tape can be used for the assembling process of semiconductor device, and is used for TAB (Tape Automated Bonding) TAB tape suitable for high-density mounting of devices; especially suitable for BGA (Ball Grid Array), CSP (Chip Scale Package) built-in TCP (Tape Carrier Package) tape; tape used for fixing lead frames ; and connecting lead frames and film carrier tapes, etc. by wire bonding. Background technique [0002] In recent years, due to the increasing demand for small, thin, light weight, and high-density semiconductor devices, the multi-pin IC (semiconductor integrated circuit) package that constitutes the core of electronic products has gradually changed from the peripheral connection type in the past...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/52H01L21/58C09J7/02C09J9/00C09J177/00C09J201/00H01L21/60
CPCH01L2924/0002H01L2924/00H01L21/60
Inventor 藤井俊雄海野清小林信子清章训成岛均
Owner TOMOEGAWA PAPER CO LTD
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