Method for modifying surface of polymer microffow chip by sputtering TiO2
A technology of surface modification and microfluidic chip, applied in the surface modification of polymer microfluidic chip, sputtering TiO2 to modify the surface of polymer microfluidic chip, which can solve the complex operation method and insufficient surface hydrophilicity, etc. problems, to achieve the effect of simple process implementation, improved protein adsorption characteristics, and easy large-scale production
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Embodiment 1
[0015] For the preparation of polymer (PDMS) chips, Dow Corning's sylgard184A solution and sylgard184B solution are fully mixed at a volume ratio of 10:1, and the mixture is placed in a vacuum box at 6.666Pa (0.05Torr) to remove air bubbles, and poured on the designed chip. On the silicon mold of the pattern, shake the glue at a speed of 1000rpm for 90 seconds to obtain a chip with a thickness of 2mm. The chip was placed in the working chamber with a distance of 60 mm between the chip and the Ti target. Vacuum to 159.9864 Pa (1.2×10 -3 Torr), Ar gas ions were introduced to bombard the target, the starting current was 2.5A, and the power was 3KW. After the discharge voltage is stabilized, the reaction gas oxygen is introduced, the energy of oxygen ions is 20KeV, and the volume ratio of oxygen to Ar gas is 1:4. TiO 2 The deposition rate is 0.5A / s. The deposition time is 1 hour, the thickness of the prepared film is 180 nm, and the surface is light blue and transparent. Then...
Embodiment 2
[0017] For the preparation of polymer (PDMS) chips, Dow Corning’s sylgard184A solution and sylgard184B solution were thoroughly mixed at a volume ratio of 10:1, and the mixture was placed in a vacuum box at 9.999 Pa (0.075 Torr) to remove air bubbles, and poured on the designed chip. On the silicon mold of the pattern, shake the glue at a speed of 1000rpm for 90 seconds to obtain a chip with a thickness of 2mm. The chip is placed in the working chamber, the distance between the chip and the Ti target is 100mm, the energy of oxygen ions is changed to 38KeV, the volume ratio of oxygen to Ar gas is 1:9, and the other parameters are the same as in Example 1. The thickness of the prepared film is 250nm, and the surface is light red and transparent. Hydrophilicity test and BSA (bovine serum albumin) adsorption test were carried out on the surface of the modified chip. The static contact angle of water droplets on the surface decreased from 105° to 62° before modification, and the st...
Embodiment 3
[0019] For the preparation of polymer (PDMS) chips, Dow Corning's sylgard184A solution and sylgard184B solution are fully mixed at a volume ratio of 10:1, the mixture is placed in a vacuum box at 13.3322 Pa (0.1 Torr) to remove air bubbles, and the mixed solution is poured On the silicon mold, spin the glue for 90 seconds at a speed of 2500 rpm to obtain a chip with a thickness of 200 μm. After putting it into the working chamber, adjust the parameters, the distance between the chip and the Ti target is 80mm, the energy of oxygen ions becomes 28KeV, the volume ratio of oxygen and Ar gas is 1:0.05, and the surface is blue and transparent. Carry out hydrophilicity test and BSA (bovine serum albumin) adsorption test to the chip surface after modification, the static contact angle of water drop on the surface drops from 105 ° before modification to 59 °, the static adsorption amount of BSA on the surface From 0.030μg / cm before modification 2 down to 0.013μg / cm 2 .
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