Supercharge Your Innovation With Domain-Expert AI Agents!

Adhering tape for laser cutting

A technology of laser cutting and bonding tape, used in laser welding equipment, adhesives, film/sheet adhesives, etc.

Inactive Publication Date: 2002-12-18
FURUKAWA ELECTRIC CO LTD
View PDF8 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, when a laser micro-injection system is used for semiconductor wafer dicing, the above-mentioned problems caused by the conventional adhesive tape cannot be sufficiently solved.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0068] The test of the tape was performed using a laser cutting device (trade name: Laser Microinjector, manufactured by Synova). The adhesive tape uses a non-woven fabric (manufactured by Kureha Tec Co., Ltd. (trade name: Bonden) CX26026, with a fiber diameter of 10 μm to 50 μm and a thickness of 140 μm) as a base material, and is coated on the base material. 20 µm of the radiation-curable adhesive described below as the adhesive material was prepared.

[0069] (Radiation Curing Adhesive)

[0070] To 100 parts by weight of an acrylic adhesive (a copolymer of 2-ethylhexyl acrylate and n-butyl acrylate), 3 parts by weight of a polyisocyanate compound (manufactured by Japan Polyurethane (Polyuretan) Co., Ltd., trade name: Corone tL) 60 parts by weight, tris-2-propenyloxyethyl isocyanurate as an isocyanurate compound and α-hydroxycyclohexyl phenyl ketone as a photopolymerization initiator in 1 part by weight, to produce radiation curing type adhesive.

[0071] Using the adhesi...

Embodiment 2

[0076] On one side of the lining film with a thickness of 38 microns, a non-radiation film consisting of 100 parts of acrylate copolymer and 2 parts of polyisocyanate compound (manufactured by Japan Polyurethane Co., trade name: Coronet L) as a curing agent is coated with a thickness of 10 microns. After the (ultraviolet) curable adhesive, dry at 110°C for 2 minutes. Immediately after drying, a non-woven fabric (manufactured by Kureha Tech (trade name: Bonden) CX26026, thickness 140 μm) as a base material was laminated on the coating layer to obtain an adhesive tape. In addition, the same radiation (ultraviolet) curable adhesive used in Example 1 was coated on one side of the 38-micron-thick liner film to a thickness of 10 microns, and then dried at 110° C. for 2 minutes. Immediately after drying, the porous base material obtained above and the non-radiation-curable adhesive layer were laminated on the coating layer of the above-mentioned radiation-curable adhesive while peeli...

Embodiment 3

[0078] An adhesive tape for laser cutting was obtained in the same manner as in Example 2, except that a 50-micrometer-thick non-radiation-curable adhesive was coated on one side of the liner film.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Fiber diameteraaaaaaaaaa
Thicknessaaaaaaaaaa
Login to View More

Abstract

An adhesive tape for laser cutting used in laser cutting guided by a water jet. The base material of the adhesive tape for laser cutting can pass through the water jet of the water jet.

Description

[0001] The technical field of the invention [0002] The present invention relates to an adhesive tape for laser cutting. Background technique [0003] In the past, a proposal has been made. When performing so-called dicing for cutting and dividing a semiconductor wafer on which a circuit pattern is formed into element pieces, the semiconductor wafer is bonded and fixed to a radiation-cured adhesive tape in advance, and then the semiconductor wafer is passed through a diamond blade (rotating ball). A knife) cuts the wafer along the element shape, irradiates radiation, such as light such as ultraviolet rays or ionizing radiation such as electron beams, from the inside of the adhesive tape, and then moves to the next pickup process. [0004] The radiation-curable adhesive tape used in this manner is an adhesive tape composed of a radiation-transmissive base material and a radiation-curable adhesive layer coated on the base material. The adhesive tape is characterized by having ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/78B23K26/00C09J7/02H01L21/302H01L21/304H01L21/68
CPCH01L21/6836H01L2221/68327
Inventor 丸山弘光矢野正三森田彻玉川有理
Owner FURUKAWA ELECTRIC CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com