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Single-component high-elasticity epoxy adhesive

An epoxy adhesive, high-elasticity technology, applied in the direction of adhesive type, adhesive, epoxy resin, etc., can solve the problem of not meeting the requirements of use, and achieve the effect of good adhesion and good thixotropy

Inactive Publication Date: 2003-11-12
HASCO VISION TECHNOLOGY CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, this type of adhesive can not meet the requirements for use

Method used

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  • Single-component high-elasticity epoxy adhesive

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0042] 10 grams of 2-heptadecyl imidazole, 12 grams of dicyandiamide and 190 grams of epoxy-terminated polysulfide rubber were placed in an oil bath at 100° C. for 1 hour to obtain a pre-reaction product. After cooling, add 100 grams of epoxy resin, 60 grams of calcium carbonate, 100 grams of titanium dioxide, 1 gram of carbon black, 0.5 gram of defoamer BYK-555, 0.5 gram of KH550, and 2 grams of fumed silica. Rolled twice on the roller machine. Then put it in a pressure vessel, vacuumize and defoam under stirring, and then it becomes an adhesive. The viscosity of the adhesive is 300 Pa.s. The adhesive can be fully cured at 130°C for 1 hour. Thixotropy is less than 5mm. The shear strength (normal temperature) is 7.5 MPa, and it is 6.0 MPa after 120 hours in warm water at 40°C. T-peel strength (room temperature) 500N / 20mm, 350N / 20mm after 120 hours in warm water at 40°C. Adhesive strength with glass plate (room temperature) 80N without peeling, 60N without peeling after 24...

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Abstract

The present invention relates to a single-component high-elasticity epoxy adhesive. Said adhesive system is formed from epoxy resin whose molecule contains more than two epoxy groups, polysulfide rubber, solidifying agent, solidification promotor, defoaming agent, silicone coupling agent, pigment filling material and thixotropic agent. The epoxy adhesive prepared by said compsition has high elasticity, good cohesive property and good thixotropy, and has the transmission viscosity which can be used by mechanical group, so that it is a good engineering adhesive.

Description

technical field [0001] The present invention relates to the field of epoxy adhesives. Background technique [0002] The adhesive based on epoxy resin can bond a variety of metal and non-metal materials. It has good processing performance, excellent mechanical properties, electrical properties and chemical resistance. However, after the unmodified epoxy resin is cured, its use is limited due to its high brittleness (about 4% elongation at break). [0003] There are many ways to modify epoxy resin, but the main method is to add elastomers and thermoplastics for modification and toughening. However, in the past elastomer modification methods, the phase separation of the elastomer and the epoxy resin occurs during the curing process of the adhesive, and the elastomer forms a dispersed phase, which can absorb energy when the system is impacted, thereby achieving the purpose of toughening modification. With the increase in demand for engineering adhesives, there is currently an ...

Claims

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Application Information

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IPC IPC(8): C09J163/00
Inventor 唐晓林黄静贤李善君李玉泉
Owner HASCO VISION TECHNOLOGY CO LTD
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