Energy-beam curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the same

A pressure-sensitive adhesive, thermal peeling technology, applied in the direction of bonding method using foam adhesive, chemical instrument and method, adhesive heating bonding method, etc., can solve the adhesive pollution, damage, etc. Smoothness, fine bond failures, etc.

Inactive Publication Date: 2004-01-28
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the layer is made thinner than the diameter of the heat-expandable microspheres, these microspheres protrude from the surface of the layer and impair its smoothness, making it impossible to exhibit an adhesive force sufficient to maintain the adherend
Thus, the heat-peelable pressure-sensitive adhesive sheet cannot be thinned without limitation, so the above-mentioned problems cannot always be overcome by thinning
[0004] In addition, conventional heat-peelables are sometimes unsuitable for low-contamination applications such as semiconductors, because microscopic bond failures are induced at the interface of pressure-sensitive adhesive layers due to deformation of heat-expandable microspheres, and adherends may be transferred thereto causing binder contamination

Method used

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  • Energy-beam curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the same
  • Energy-beam curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the same
  • Energy-beam curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] By adding 0.5 parts by weight of an epoxy crosslinking agent, 40 parts by weight of a hexa-functional ultraviolet polymerizable compound, and 35 parts by weight of heat-expandable microspheres ("Matsumot Microspheres F-50 D", trade name; Matsumoto Yushi-Seiyaku Co. Ltd. The product of .) and 2.5 parts by weight of ultraviolet polymerization initiators are added in 100 parts by weight of acrylic copolymer (weight average molecular weight: 700000) to prepare mixture solution 1, and described acrylic acid copolymer is made of 80 parts by weight of ethyl acrylate, 20 parts by weight of acrylic acid 2-ethylhexyl ester and 3 parts by weight of acrylic acid. The resulting mixture solution was applied on the surface of a corona-treated polyester film (substrate) to a thickness of 50 μm, followed by drying, whereby a 45 μm thick acrylic ultraviolet curable viscoelastic layer was formed.

[0054] A mixed solution 2 consisting of 100 parts by weight of the above-mentioned acrylic ...

Embodiment 2

[0063] By adding 3 parts by weight of an energy beam polymerization initiator and 30 parts by weight of heat-expandable microspheres ("Matsumot microspheres F-50 D", trade name; product of Matsumoto Yushi-Seiyaku Co. Ltd.) to 100 parts by weight of the energy beam active A mixed solution 3 was prepared in a polymer (weight average molecular weight: 600000) in which the energy beam active polymer was composed of 70 parts by weight of ethyl acrylate, 30 parts by weight of butyl acrylate and 8 parts by weight of 2-hydroxyethyl acrylate. Acrylic copolymer is obtained by adding methacryloxy isocyanate with 2-hydroxyethyl equivalent of 0.6 (molar ratio). In a similar manner to Example 1 except that this mixture solution was used, an energy beam curable thermally expandable viscoelastic layer was formed.

[0064] In a similar manner to Example 1, except that mixed solution 4 obtained by adding 3 parts by weight of an energy beam polymerization initiator to 100 parts by weight of the ...

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Abstract

An energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet having, on at least one side of a base material, an energy-beam-curable thermo-expandable viscoelastic layer containing thermo-expandable microspheres and a pressure-sensitive adhesive layer stacked in this order. The pressure-sensitive adhesive layer has a thickness of about 0.1 to 10 mum and can be formed from a pressure-sensitive adhesive. The energy-beam-curable thermo-expandable viscoelastic layer, on the other hand, can be formed from a tacky substance. The energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet according to the invention has adhesion enough to withstand a carrying step of an adherend, causes neither winding up of the adhesive nor chipping upon cutting and facilitates peeling and collection of cut pieces after cutting. In addition, it exhibits low contamination on the adherend after peeling.

Description

technical field [0001] The present invention relates to an energy beam curable heat-peelable pressure-sensitive adhesive sheet from which cut pieces obtained as adherends can be easily peeled off and collected by irradiation with energy beams and heat treatment; and to the use of such a sheet A method of cutting small pieces of wood production. Background technique [0002] When a semiconductor wafer or a multilayer capacitor sheet is cut into small pieces of a predetermined size, a so-called pressure-sensitive adhesive sheet that is peeled off from the wafer or sheet (adhered body) and collects the cut pieces such as cut chips is Heat-peelable pressure-sensitive adhesive sheet having a foaming agent-containing pressure-sensitive adhesive layer on a highly elastic film or sheet substrate such as plastic (JP-B-50-13878, JP-B-51 -24534, JP-A-56-61468, JP-A-56-61469, JP-A-60-252681, etc.). This heat-peelable pressure-sensitive adhesive sheet is designed to simultaneously reta...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B7/06B32B27/00C09J5/06C09J5/08C09J7/22C09J7/38H01L21/00H01L21/68H01L21/683
CPCH01L21/6836H01L21/67092C09J2203/326Y10T428/28Y10T428/1476Y10T428/1495H01L2221/68327C09J2205/11Y10T428/2839Y10T156/1052Y10T428/24843C09J7/0246Y10T428/2486Y10T428/2883H01L21/67132C09J2201/36C09J7/0207Y10T428/2809Y10T428/1405Y10T428/2852H01L2924/19041C09J7/38C09J7/22C09J2301/208C09J2301/412
Inventor 木内一之大岛俊幸村田秋桐有满幸生
Owner NITTO DENKO CORP
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