Modified dimaleimide resin and its preparation method and application in cladding copper plate

A bismaleimide resin and bismaleimide technology are applied in chemical instruments and methods, layered products, metal layered products, etc., and can solve problems such as difficult processing, high molding temperature, and poor toughness , to achieve good stability

Inactive Publication Date: 2004-05-05
梁国正 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, because it is a thermoplastic resin, it has creep properties, poor solvent resistance, and difficult processing, so PPO has not yet been used in practical applications. It is mainly used to modify epoxy resin at this stage to improve its heat

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0039]The preparation method of modified bismaleimide resin is as follows: take raw material according to above-mentioned parts by weight, epoxy resin, allyl compound and bismaleimide resin will be weighed in reaction bottle, in oil Heat the bath and stir slowly to 120°C-150°C, wait for the resin solution to be transparent and react for 30-60min by timing, add 70 parts of acetone and 30 parts of dimethylformamide (acetone / dimethylformamide, 70 / 30) of the mixed solvent, the solvent used can also be acetone, butanone, dimethylformamide, dimethylacetamide, N-methylpyrrolidone, toluene, xylene, chloroform, dichloromethane, ethanol one or a mixture of several. Reduce to room temperature to obtain a uniform and transparent modified bismaleimide resin solution; put the epoxy resin curing agent and accelerator for use, and mix it with the modified bismaleimide resin solution when in use. .

[0040] When applying the modified bismaleimide resin in the preparation of copper-clad lami...

specific Embodiment 1

[0042] Weigh 100g of 4,4'-bismaleimide diphenylmethane, 50g of diallyl bisphenol A, 350g of tetrabrominated bisphenol A epoxy resin, put them into a 2000ml reaction bottle, and heat to 140-150 React at ℃ for 30 minutes, cool down to 100℃ and add 500ml of acetone / dimethylformamide (70 / 30), drop to room temperature and add 10g of dicyandiamide, 3.5g of 2-methylimidazole, and stir well. Brush the above glue on EW210 glass cloth, and after the volatile content is less than 5%, ventilate and dry at 150°C for 10 minutes to obtain a prepreg. Cut off the burrs of the prepreg, select a place with a flat surface and no stains and cut it into a square of 100cm×100cm, take 8 sheets and stack them together, put an electrolytic copper foil of the same size on the upper and lower sides, and send it to the hot pressing stage for pressing , the pressing process is as follows: the pressing pressure is 2.5MPa, the pressure is maintained at 170°C for 2h, and the pressure is maintained at 200°C fo...

specific Embodiment 2

[0043] Weigh 100g of 4,4'-bismaleimide diphenylmethane, 50g of diallyl bisphenol A, 150g of tetrabrominated bisphenol A epoxy resin, put them into a 2000ml reaction bottle, and heat to 140-150 React at ℃ for 20 minutes, cool down to 100℃ and add 300ml of acetone / dimethylformamide (70 / 30), drop to room temperature and add 4.5g of dicyandiamide, 1.5g of 2-methylimidazole, and stir well. Brush the above glue on EW210 glass cloth, and after the volatile content is less than 5%, ventilate and dry at 150°C for 10 minutes to obtain a prepreg. Cut off the burrs of the prepreg, select a place with a flat surface and no stains and cut it into a square of 100cm×100cm, take 8 sheets and stack them together, put an electrolytic copper foil of the same size on the upper and lower sides, and send it to the hot pressing stage for pressing , the pressing process is as follows: the pressing pressure is 2.5MPa, the pressure is maintained at 170°C for 2h, and the pressure is maintained at 200°C f...

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PUM

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Abstract

A modified bimaleimid resin is prepared from bimaleimide resin, allyl compound, epoxy resin, solidifying agent, and promoter. It can be used to prepare the substrate of copper coated board, which has high resistance to high temp (15-280 deg.C), low loss, high fire retarding performance and thermal and wet stability, and excellent mechanical performance. It can be used for computer, satellite communication equipment, mobile telephone, etc.

Description

1. Technical field: [0001] The invention relates to the field of composite materials; in particular, it relates to a modified bismaleimide resin and its preparation method and its application as a copper clad laminate base material. 2. Technical background: [0002] Since the 1990s, the world's electronic information industry represented by electronic computers and mobile phones has developed rapidly. The total amount of electronic products in the world has been increasing at a rate of about 13% per year. Electronic products have become the largest in the world today. industry. At the same time, electronic products are constantly developing in the direction of thinner, thinner, higher performance and lower cost, and circuit assembly technology is also developing towards high density and miniaturization. All these require that the copper clad laminate as the basic material of the printed circuit board must have more, higher and better performance, mainly in high heat resista...

Claims

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Application Information

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IPC IPC(8): B32B15/08C08J5/18C08L35/00C08L63/00
Inventor 梁国正顾嫒娟
Owner 梁国正
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