Photosensitive thermosetting pastel composition and fired article pattern used by it
A thermosetting and photosensitive technology, applied in photosensitive material processing, optics, optomechanical equipment, etc., can solve problems such as broken patterns, limited light transmission, and insufficient curing of photocuring reactions.
Inactive Publication Date: 2010-04-21
TAIYO INK MFG CO LTD
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Problems solved by technology
As a result, it is easy to cause the complexity of the process in the heat-curable paste composition
[0006] On the other hand, when a light-curable glass paste is used in the above-mentioned embedding method, the light transmittance of the inorganic fine particles used in the same way as the photolithography method is limited. Insufficient curing of the curing reaction, and the curability of the surface and the deepest part are different when irradiated with ultraviolet rays, so there is a problem of so-called pattern breakage in the pattern groove removal process, which makes it difficult to form
Method used
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Embodiment 1～9
[0077] Various components shown in Table 1 below were mixed and dispersed with stirring to prepare a photosensitive thermosetting glass paste composition.
[0078] Also, as the glass fine particles, 60% PbO, 20% B 2 o 3 , 15% SiO 2 , 5% Al 2 o 3 The composition is a mixture of fine particles with a glass transition temperature of 445°C and an average particle size of 1.6 μm, a titanium oxide white pigment (average particle size of about 0.25 μm) and alumina as an inorganic filler (average particle size of 2 μm).
[0079] On the other hand, a high molecular weight acrylic resin polymer (manufactured by Mitsubishi Rayon Co., Ltd., BR-101, molecular weight: 160,000) having a weight average molecular weight in the range of 3,000 to 300,000 as a binder component was dissolved in a monofunctional acrylic monomer ( It was prepared by adding a trifunctional acrylic monomer (manufactured by Toagosei Co., Ltd., M-350) as a crosslinking agent to Kyoeisha Co., Ltd., Light Acryle-toECA...
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Abstract
Provided is a photosensitive thermosetting paste composition which is easily filled into dents or through-holes, is excellent in depth curability, is not limited in selecting inorganic particles, anddoes not allow pattern peeling, cracks, and a baked product residue (bubble generation) to occur during baking.The paste composition contains (A) fine inorganic particles, (B) a binder polymer with aweight average mol.wt. of 3,000-300,000, (C) an ethylenically unsaturated compound, (D) an optical free radical generator, and (E) a thermal free radical generator. Component B is used by dissolving it in at least one kind of component C.
Description
technical field [0001] The present invention relates to being suitable for forming structural support body (being called liner, rib (rib)) in plasma display screen (PDP), field emission display (FED), liquid crystal display device (LCD), fluorescent display device, hybrid integrated circuit or separator), electrode (conductor circuit) pattern, dielectric (resistor) pattern, black matrix pattern, etc., and a fired product pattern obtained using the same. Background technique [0002] At present, to form a thick film such as a structural support in a flat panel display, it is generally patterned by screen printing using a solvent-based glass paste, and patterned by sandblasting by sandblasting after coating the entire surface. However, the pattern formed by the screen printing method can be formed in a thickness of 10 to 20 μm per printing. Therefore, in order to form a structural support with a required height of about 100 to 200 μm, printing and drying must be repeated. In ...
Claims
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IPC IPC(8): G03F7/032C08F2/44C09D5/34G03F7/027G03F7/26G03F7/42G09F9/00H01B3/00H01J9/02H01J11/22H01J11/34H01J11/36H01L21/027
CPCY02P20/582C09D5/34
Inventor 小岛秀明柿沼正久
Owner TAIYO INK MFG CO LTD