Method for preventing tungsten plug corrosion

Abstract

The invention provides a method to prevent wolfram (W) plug from corroding in the semiconductor component making technique, wherein the W plug has been formed on the substrate and coupled with the lead wire formed on the substrate. Then, it uses discharger to process the substrate, eliminating the charges accumulated on the lead wire surface in the lead wire etching making technique. Then, it makes wet cleaning.

Description

Technical field [0001] The present invention relates to a semiconductor manufacturing process, and more particularly to a method for preventing corrosion of tungsten plugs. Background technique [0002] With the continuous miniaturization of the line width of semiconductor components, high-speed, multi-function, high-component integration, low power consumption and low-cost extremely large-scale integrated circuit chips can be mass-produced. Due to the miniaturization of semiconductor components and the increase in integration, the number of interconnects continues to increase, making the chip surface unable to provide enough surface area to accommodate the increasing number of interconnects. In order to solve this problem, a multi-metal interconnect structure has been proposed, and it has become a necessary method for integrated circuit manufacturing technology. [0003] In the multi-metal interconnect manufacturing process, after the metal tungsten plug is completed, the next l...

AI Technical Summary

Problems solved by technology

Immersing the substrate in a neutral ionic solution can effectively remove the accumulated charge on the surface of the wire. However, although this method can protect the tungsten plug from electrochemical corrosion, it will make the wires of the internal connection on the surface of the tungsten plug Corrosion (i.e. wire metal reacts with salt or electrolyte in neutral ionic solution)

Moreover, in the known method, the time for treating the substrate with a neutral solution (such as an electrolyte) or deionized water is not only lengthy, but after the substrate is soaked, an additional cleaning-drying step is necessary to remove the solution remaining on the substrate (i.e. salt / electrolyte)

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