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Adhesive and adhered thin film

A technology of adhesives and adhesive properties, applied in the direction of adhesives, pressure-sensitive films/sheets, non-polymer adhesive additives, etc., can solve problems such as poor practicability, poor solubility, and insufficient film flexibility

Active Publication Date: 2004-12-01
MITSUBISHI GAS CHEM CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The polyimide obtained with 1,2,3,4-cyclobutane tetracarboxylic dianhydride has poor solubility in organic solvents, so the precursor of polyimide, that is, polyamic acid solution, must be used as a bonding agent. agent or adhesive film forming liquid, failed to solve the above problems
Moreover, if 1,2,4,5-cyclopentane tetracarboxylic dianhydride, bicyclo[2.2.2]oct-7-ene-2,3,5,6-tetracarboxylic dianhydride are used, although Polyimide that is easily soluble in organic solvents is obtained, but the film obtained by coating polyimide is not flexible enough. For example, it cannot be used for products that require flexibility such as flexible printed circuit boards, and its practicability is poor.

Method used

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  • Adhesive and adhered thin film
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  • Adhesive and adhered thin film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] Into a 500mL 5-neck flask equipped with a thermometer, stirrer, nitrogen inlet tube, dropping funnel with side tube, Dean-Stark trap, and condenser tube, add 4,4'-di Amino diphenyl ether 10.0g (0.05 moles) and N-methyl-2-pyrrolidone 85g as a solvent were dissolved, and then the 1,2,4,5-cyclohexane tetrachloride synthesized in the reference example was 11.2 g (0.05 mol) of acid dianhydride solids were added in portions over 1 hour, and stirred at room temperature for 2 hours. Then add 30.0 g of azeotropic dehydration solvent xylene, heat up to 180°C, react for 3 hours, use a Dean-Stark water separator to carry out xylene reflux, and azeotropically separate and remove the produced water. After 3 hours, after confirming that the distillation of water was completed, xylene was distilled off while raising the temperature to 190°C for 1 hour, and after recovering 29.0 g, air cooled to an internal temperature of 60°C to obtain an organic solvent for polyimide solution. The o...

Embodiment 2

[0064]The polyimide solution obtained in Example 1 was coated on a glass plate, heated on a heating plate at 90° C. for 1 hour to evaporate the solvent, and then peeled off from the glass plate to obtain an independent film. The independent film was fixed to a stainless steel fixing jig, and the solvent was further evaporated by heating at 220° C. for 2 hours in a hot air drier to obtain a light brown flexible adhesive polyimide film with a film thickness of 80 μm. Next, sandwich the obtained adhesive polyimide film between two commercially available steel plates (cold-rolled steel plate, JIS K6848, 1.6 × 25 × 100mm), and carry out 30 minutes by a hot press with a set temperature of 330°C. Minute heat press bonding. The tensile and shear bond strengths at room temperature and 200°C are shown in Table 1. The results showed good bonding performance.

Embodiment 3

[0076] Add 11.2 g (0.05 moles) of 1,2,4,5-cyclohexanetetracarboxylic dianhydride synthesized in the reference example and N-dimethyl - 40.0 g of 2-pyrrolidone was dissolved, and at room temperature, 10.5 g (0.05 moles) of 4,4'-diaminodicyclohexylmethane was dissolved in 45.0 g of dimethylacetamide to form a solution that was dropped through a dropping funnel for 2 hours. add. After the dropwise addition, the temperature was raised to 90° C. and stirred for 1 hour. Then add 30.0 g of azeotropic dehydration solvent xylene, then raise the temperature to 180° C., react for 3 hours, reflux the xylene with a Dean-Stark trap, and azeotropically separate the generated water. After 3 hours, it was confirmed that the evaporation of water was completed, and xylene was evaporated while raising the temperature to 190° C. over 1 hour, and 30.0 g was recovered. Then, it was air-cooled until the internal temperature became 60° C., and an organic solvent solution of polyimide was obtained. ...

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Abstract

An adhesive and an adhesive polyimide film using the adhesive are provided, to improve adhesion, heat resistance, flexibility and a dielectric property at high frequency. The adhesive comprises the polyimide having a repeating unit represented by the formula (I), wherein R and phi are as defined in the specification.

Description

technical field [0001] The present invention relates to an adhesive and an adhesive film having good heat resistance and adhesiveness. Background technique [0002] Conventionally, epoxy-based or acrylic-based adhesives have been used as adhesives or adhesive films in the fields of electrical and electronic equipment, aerospace machinery, and transportation machinery. However, due to poor heat resistance of these resins, the heat resistance of the bonded product is insufficient, which restricts the processing conditions and use conditions of the subsequent processes. [0003] Therefore, people wish to obtain adhesives and adhesive films with good heat resistance. For example, it has been disclosed that polyimide resin dispersions are coated on substrates as adhesives to form thermocompression-bonded adhesives. layering method. This adhesive layer is thermocompression-bonded to the adherend (for example, JP-A-61-143477). There is also disclosed a method in which a polyimid...

Claims

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Application Information

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IPC IPC(8): C09J179/08H05K3/38
CPCC09J7/35C09J7/38C09J9/00C09J11/06C09J179/08
Inventor 木原秀太毛户耕
Owner MITSUBISHI GAS CHEM CO INC