High adhesion leadless soldering tin grease

A lead-free solder paste, lead-free solder powder technology, applied in welding media, welding equipment, welding/cutting media/materials, etc., can solve the problems of easy oxidation, high welding temperature requirements, unsatisfactory mechanical properties, etc.

Inactive Publication Date: 2005-01-26
郴州金箭焊料有限公司
View PDF0 Cites 38 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The mechanical properties of the Sn-Bi system are not satisfactory, the Sn-Zn sys

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Embodiment 1; Calculated by mass percentage, the spherical powder of the lead-free solder powder with the composition of 2.0%Ag-1.0%Cu-0.5%Bi-0.5%Ni-Sn (remainder) with 90.0% in Table 1 10% flux of the composition shown in Example 1 to prepare the high adhesion lead-free solder paste of the present invention.

Embodiment 2

[0021] Embodiment 2; Calculated by mass percentage, the spherical powder of the lead-free solder powder with the composition of 88.0% being 2.5%Ag-1.2%Cu-1.5%Bi-0.8%Ni-Sn (remainder), and having in table 1 The 12.0% flux of the composition shown in Example 2 is used to prepare the high adhesion lead-free solder paste of the present invention.

Embodiment 3

[0022] Embodiment 3; Calculated by mass percentage, the spherical powder of the lead-free solder powder with the composition of 1.5%Ag-0.7%Cu-0.9%Bi-0.1%Ni-Sn (remainder), and the spherical powder with the composition in Table 1 The 8.0% flux of the composition shown in Example 3 is used to prepare the high adhesion lead-free solder paste of the present invention.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a leadless solder paste with high adhesion force for electron product surface pasting. The leadless solder paste contains a Sn-Ag-Cu-Bi-Ni base leadless solder powder blended with solder agent. The solder agent is made up of 35-50wt% of resin (such as modified abietic resin and waterless malic acid resin), 1-10wt% of thixotrope(such as modified hydro castor oil, fatty glyceride), 35-55%wt% of solvent (undercanol, dimethyl hexanediol), 1.5-5wt%of activator (succinic acid, tetrabutyl amine hydrobromic acid). The solder agent may also include 0.01-0.9wt% copper inhibitor made up of one or several of benzothiazole, benzotrinitrogenazole, and benzimidazole.

Description

Technical field [0001] The invention relates to a lead-free solder paste for surface mounting of electronic products, in particular to a high-adhesion lead-free solder paste suitable for electronic products that are mixed with plug-in and use a reflow soldering process. Background technique [0002] Traditional solder paste products are composed of tin-lead solder powder and flux. The tin-lead solder powder is generally composed of 63% Sn, 37% Pb or 62% Sn, 36% Pb, 2% Ag spherical powder of 25μm∽75μm; Generally, it is composed of resin, activator, thixotropic agent, solvent and additive. On the one hand, after soldering the PCB, the heavy metal lead in the solder paste will be scattered in the environment along with the discarded electronic products. After long-term corrosion by acid rain, the lead will seep into the ground and dissolve into the groundwater system. After drinking, it will remain in the human body for a long time Accumulation can cause harm to the nervous sy...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B23K35/22B23K35/26B23K35/362
Inventor 邓和升于耀强邓和军
Owner 郴州金箭焊料有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap