Chip module with high radiating performance and its substrate
A high heat dissipation, chip module technology, used in electrical components, electrical solid devices, circuits, etc., can solve the problems of shortened component life, reduced component efficiency, poor thermal conductivity, etc., to achieve good heat dissipation properties and lighten the structure. The effect of weight
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Example Embodiment
[0043] figure 1 It is a schematic diagram of the structure of the single-layer substrate of the chip module of the present invention. A metal composite plate 23 is covered with an insulating layer 22. The insulating layer is a metal compound of the metal composite plate, that is, an oxide film layer or a nitride film layer, or an insulating ceramic material or polymer material deposited on the metal composite. The surface of the plate 23. The insulating film 22 can be used to replace the known composite substrate, that is, as an electrical insulator between the circuit layer 21 and the metal composite sheet 23. For example, an aluminum-based composite material is used as the material of the metal composite plate 23, and an insulating film layer of aluminum oxide or aluminum nitride is formed on the surface of the aluminum-based composite material. It can be seen from Table 1 that the thermal conductivity of aluminum is 237W / MK, aluminum oxide is 46W / MK, and aluminum nitride is 1...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap