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Allyl ether modified polyurethane acrylate and its use

A technology of urethane acrylate and allyl ether, which is applied in the field of resin-allyl ether modified urethane acrylate, which can solve the problems of low photocuring performance of unsaturated double bonds and limited ability of photocuring components

Inactive Publication Date: 2005-05-18
SUN YAT SEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The unsaturated double bonds in this crosslinker have low photocuring properties
At the same time, the photocurable component (acryloyloxy-containing oligomer or monomer) has limited ability to participate in air curing during dark curing

Method used

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  • Allyl ether modified polyurethane acrylate and its use
  • Allyl ether modified polyurethane acrylate and its use
  • Allyl ether modified polyurethane acrylate and its use

Examples

Experimental program
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Effect test

Embodiment 1

[0037] The raw material (II) used in this embodiment is trimethylolpropane monoallyl ether, the raw material (III) is polyethylene glycol 400, the raw material (IV) is 2,4 toluene diisocyanate, and the raw material (VI) is methylol propane beta-hydroxyethyl acrylate (HEMA). The raw material consumption of this embodiment is raw material (II): raw material (III): raw material (IV): raw material (VI)=2:1:4:2. The synthesis steps are: add raw material (II) and raw material (III) in a dry three-necked round bottom flask, add dropwise raw material (IV) and 5‰ (mass fraction) of dibutyltin laurate (catalyst) to mix under medium-speed stirring solution, (the dropping rate is 4 seconds / drop), after the dropping is completed, the system is heated up to 50°C, reacted for 4 hours until the concentration of isocyanate does not change with time, then slowly add the raw material (VI) dropwise to the system (the dropping rate is 4 second / drop), after the dropwise addition, the system was he...

Embodiment 2

[0039] The raw material consumption of present embodiment is raw material (II): raw material (III): raw material (IV): raw material (VI)=5: 0: 7: 4, all the other are identical with embodiment one.

Embodiment 3

[0041] The raw material (IV) of this embodiment adopts isophorone diisocyanate (IPDI), and the remaining raw materials and synthesis steps are the same as the first embodiment. Compared with TDI in Example 1, IPDI is used as the polyisocyanate component in this example, the experimental conditions are better controlled, and the product storage stability is better, but the price of raw materials is slightly higher than that of TDI.

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Abstract

The present invention provides allyl ether modified polyurethane acrylate and the application of the resin in compounding form maintaining paint. The allyl ether modified polyurethane acrylate features that the molecular chain contains optical active acylyloxy radical or methyl acylyloxy radical as well as allyloxy radical endowing the resin with air / oxygen curing performance, and thus has both light curing and air curing performance. The form maintaining paint compounded with the allyl ether modified polyurethane acrylate may be cured through cross-linking under the initiation of light and oxygen in the air. The form maintaining paint is used mainly to protect electronic circuit board with electronic elements soldered, and may be used also in other fields needing double curing.

Description

technical field [0001] The present invention relates to a class of resins with light / air dual curing characteristics—allyl ether modified polyurethane acrylate, and the use of such resins in preparing conformal coatings (protective coatings for electronic circuit plates), especially light / air dual curing protective coatings. application in shape coatings. Background technique [0002] Protective coatings applied to printed wiring boards of soldered connector components are often referred to as conformal coatings. It can not only protect electronic products from the erosion of harmful external environments, such as dust, moisture, chemicals, mildew corrosion, foreign objects scratches, short circuits and other human errors, but also prolong the life of electronic devices and improve the stability of use. So that the performance of electronic products is improved. [0003] The curing methods of conformal coatings are divided into light curing, heat curing, moisture curing, e...

Claims

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Application Information

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IPC IPC(8): C08G18/83C09D175/16
Inventor 曾兆华袁慧雅杨建文陈用烈
Owner SUN YAT SEN UNIV
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