A formulation of semiconductor surface electrothermal coat and making method thereof

A thermal coating and semiconductor technology, applied in the direction of electric heating devices, ohmic resistance heating, electrical components, etc., can solve the difficulty of ensuring the stability of metal oxides, the limitation of the application field and scope, and the difficulty of quantifying the guarantee of product consistency and reliability, etc. question

Inactive Publication Date: 2005-09-21
杨葆华 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the development of electrothermal film technology, the manufacturing methods of electrothermal film can be roughly divided into two types. One is mainly to use graphite or carbon fiber materials to process and manufacture electrothermal film or electric heating elements. The processing method of electrothermal film is to combine graphite carbon powder with solidified agent and flame retardant are mixed and then coated on the insulating material and cured. The electrothermal film manufactured by this method has the advantages of good oxidation resistance, stable thermal power, simple processing technology, and long service life. However, due to the carbon element The thermal power of itself is poor, and it cannot meet the requirements of high power, so its application field and

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Tin tetrachloride (SnCl 4 ) 68%

[0023] Copper Carbonate 11%

[0024] Graphite 11%

[0025] boric acid (H 3 BO 3 ) 5%

[0026] Antimony trichloride (SbCl 3 ) 2%

[0027] Fluoboric acid (BF) 2%

[0028] Potassium Hydroxide (KOH) 1%

Embodiment 2

[0030] Tin tetrachloride (SnCl 4 ) 62%

[0031] Copper Carbonate 10%

[0032] Graphite 13%

[0033] boric acid (H 3 BO 3 ) 8%

[0034] Antimony trichloride (SbCl 3 ) 2.5%

[0035] Fluoboric acid (BF) 3%

[0036] Potassium Hydroxide (KOH) 1.5%

Embodiment 3

[0038] Tin tetrachloride (SnCl 4 ) 60%

[0039] Copper Carbonate 15%

[0040] Graphite 15%

[0041] boric acid (H 3 BO 3 ) 5%

[0042] Antimony trichloride (SbCl 3 ) 2%

[0043] Fluoboric acid (BF) 2%

[0044] Potassium Hydroxide (KOH) 1%

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PUM

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Abstract

A formula of semiconductor surface electric heating coating an preparation method thereof, which is composed of (by weight) 60-70 % of tin tetrachloride, 10-15 % of copper carbonate, 10-15 % of graphite, 5-8 % boric acid, 2-3 % of antimonous chloride etc, the preparation contains 1, mixing above mentioned compositions and pulverizing into powder, added with absolute ethyl alcohol and terpineol, agitating into uniform emulsify slurry, 2, pretreating insulation base unit component and drying, 3, spraying slurry to surface of insulation base unit surface, solidifying in furnace at 400-600 degree centigrade, insulation for 15-20 minute, then cooling in furnace.

Description

technical field [0001] The invention relates to a formula of an electrothermal coating on a semiconductor surface and a manufacturing method thereof, which relates to the improvement of the formula and processing technology of the electrothermal coating on a semiconductor surface in the existing manufacturing method, and improves the performance of the electrothermal coating on a semiconductor surface. Background technique [0002] With the development of electrothermal film technology, the manufacturing methods of electrothermal film can be roughly divided into two types. One is mainly to use graphite or carbon fiber materials to process and manufacture electrothermal film or electric heating elements. The processing method of electrothermal film is to combine graphite carbon powder with solidified agent and flame retardant are mixed and then coated on the insulating material and cured. The electrothermal film manufactured by this method has the advantages of good oxidation ...

Claims

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Application Information

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IPC IPC(8): H05B3/12H05B3/20
Inventor 杨葆华朴荣山
Owner 杨葆华
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