A formulation of semiconductor surface electrothermal coat and making method thereof
A thermal coating and semiconductor technology, applied in the direction of electric heating devices, ohmic resistance heating, electrical components, etc., can solve the difficulty of ensuring the stability of metal oxides, the limitation of the application field and scope, and the difficulty of quantifying the guarantee of product consistency and reliability, etc. question
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Embodiment 1
[0022] Tin tetrachloride (SnCl 4 ) 68%
[0024] Graphite 11%
[0025] boric acid (H 3 BO 3 ) 5%
[0026] Antimony trichloride (SbCl 3 ) 2%
[0027] Fluoboric acid (BF) 2%
Embodiment 2
[0030] Tin tetrachloride (SnCl 4 ) 62%
[0032] Graphite 13%
[0033] boric acid (H 3 BO 3 ) 8%
[0034] Antimony trichloride (SbCl 3 ) 2.5%
[0035] Fluoboric acid (BF) 3%
Embodiment 3
[0038] Tin tetrachloride (SnCl 4 ) 60%
[0040] Graphite 15%
[0041] boric acid (H 3 BO 3 ) 5%
[0042] Antimony trichloride (SbCl 3 ) 2%
[0043] Fluoboric acid (BF) 2%
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