A formulation of semiconductor surface electrothermal coat and making method thereof
A thermal coating and semiconductor technology, applied in the direction of electric heating devices, ohmic resistance heating, electrical components, etc., can solve the difficulty of ensuring the stability of metal oxides, the limitation of the application field and scope, and the difficulty of quantifying the guarantee of product consistency and reliability, etc. question
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Embodiment 1
[0022] Tin tetrachloride (SnCl 4 ) 68%
[0023] Copper Carbonate 11%
[0024] Graphite 11%
[0025] boric acid (H 3 BO 3 ) 5%
[0026] Antimony trichloride (SbCl 3 ) 2%
[0027] Fluoboric acid (BF) 2%
[0028] Potassium Hydroxide (KOH) 1%
Embodiment 2
[0030] Tin tetrachloride (SnCl 4 ) 62%
[0031] Copper Carbonate 10%
[0032] Graphite 13%
[0033] boric acid (H 3 BO 3 ) 8%
[0034] Antimony trichloride (SbCl 3 ) 2.5%
[0035] Fluoboric acid (BF) 3%
[0036] Potassium Hydroxide (KOH) 1.5%
Embodiment 3
[0038] Tin tetrachloride (SnCl 4 ) 60%
[0039] Copper Carbonate 15%
[0040] Graphite 15%
[0041] boric acid (H 3 BO 3 ) 5%
[0042] Antimony trichloride (SbCl 3 ) 2%
[0043] Fluoboric acid (BF) 2%
[0044] Potassium Hydroxide (KOH) 1%
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