High dielectric resin compsn.
A resin composition, high dielectric technology, used in capacitors, electrical components, fixed capacitor dielectrics, etc., can solve problems such as large dielectric loss tangent
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Problems solved by technology
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Examples
Embodiment 1
[0120] Into a reaction vessel equipped with a stirrer, torque meter, nitrogen introduction tube, thermometer and reflux condenser, 141 g (1.02 mol) of p-hydroxybenzoic acid, 63.3 g (0.34 mol) of 4,4'-dihydroxybis Benzene, 56.5 grams (0.34 moles) of isophthalic acid, and 191 grams (1.87 moles) of acetic anhydride. After sufficiently replacing the inside of the reaction vessel with nitrogen, the inside thereof was heated to 150° C. during 15 minutes under a nitrogen flow, and the temperature was maintained at reflux for 3 hours.
[0121] Then, it was internally heated to 320° C. during 170 minutes, and distillation by-product acetic acid and unreacted acetic anhydride were evaporated, when a rise in torque was observed, the reaction was considered complete, and the reactor contents were removed. The resulting solid was cooled to room temperature and ground with a coarse grinder, then kept at a temperature of 250° C. for 3 hours under a nitrogen atmosphere, and solid-phase polyme...
Embodiment 2
[0127] Into a reaction vessel equipped with a stirrer, torque meter, nitrogen introduction tube, thermometer and reflux condenser, 128 g (0.68 mol) of 2-hydroxy-6-naphthoic acid, 63.3 g (0.34 mol) of 4,4' - Dihydroxybiphenyl, 56.5 grams (0.34 moles) of isophthalic acid, and 152.7 grams (1.50 moles) of acetic anhydride. After the inside of the reaction vessel was sufficiently replaced with nitrogen, the inside was heated to 150° C. in 15 minutes under a nitrogen flow, and the temperature was maintained at reflux for 3 hours.
[0128]Then, it was internally heated to 320° C. during 170 minutes, and distillation by-product acetic acid and unreacted acetic anhydride were evaporated, when a rise in torque was observed, the reaction was considered complete, and the reactor contents were removed. The resulting solid was cooled to room temperature and ground with a coarse grinder, then kept at a temperature of 250° C. for 3 hours under a nitrogen atmosphere, and subjected to solid pha...
Embodiment 3
[0134] A high dielectric resin film was obtained in the same manner as in Example 2, but using HF-120 manufactured by Kyoritsu Material as the high dielectric filler. When the temperature T of NF-120 is -20℃≤T≤80, [(ε T -ε 25 ) / ε 25 ] with a maximum value of 0.01 or less and a relative permittivity ε at 25°C 25 for 120.
[0135] The relative permittivity and dielectric loss tangent of the resulting high dielectric resin film measured with an impedance analyzer manufactured by HP were 17.0 and 0.002 (frequency: 1 GHz), respectively.
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Abstract
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