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Curable resin composition, overcoats, and process for formation thereof

A curable resin and composition technology, applied in the direction of electric solid-state devices, semiconductor/solid-state device components, instruments, etc., can solve problems such as poor display, pollution of baking ovens, and pollution of panel substrates

Inactive Publication Date: 2007-01-17
JSR CORPORATIOON +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In addition, with the increase in the size of panel substrates in recent years, when a thermosetting composition is used for the formation of a protective film, a very small amount of unreacted monomers remaining will sublimate and accumulate inside the baking furnace, contaminating the baking furnace, making it difficult to process. The control of baking conditions, or the accumulation of unreacted monomers and / or their thermal products adhere to and contaminate the panel substrate, causing poor display problems
[0010] When forming a protective film for a color filter, it is preferable to use a curable resin composition that has the advantage of being able to easily form a protective film with excellent surface hardness. A material capable of forming a protective film satisfying various requirements as described above and having excellent storage stability of the composition has not yet been known.

Method used

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  • Curable resin composition, overcoats, and process for formation thereof
  • Curable resin composition, overcoats, and process for formation thereof
  • Curable resin composition, overcoats, and process for formation thereof

Examples

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Embodiment approach -

[0254] When the preferable embodiment of each curable resin composition of this invention is shown more concretely, there are following (I)-(IV).

[0255] (1) One-component curable resin composition (α) containing polymer (A) (preferably at least A) and (B) the cationic polymerizable compound, depending on the situation, also contain the following optional additive components, relative to 100 parts by weight of the polymer (A), the amount of the cationic polymerizable compound is 3-100 parts by weight, more preferably 5-50 parts by weight.

[0256] In this one-component curable resin composition (α), a protective film having sufficient surface hardness can be obtained by making the usage-amount of the cationically polymerizable compound within the above-mentioned range. This one-component curable resin composition (α) is particularly excellent in long-term storage stability.

[0257] (II) A one-component curable resin composition (α1) containing a copolymer (A3), (B) a catio...

Embodiment

[0306] Synthesis examples and examples are given below to further describe the present invention in detail, but the present invention is not limited to the following examples.

[0307]

[0308] Device: GPC-101 (manufactured by Showa Denko Co., Ltd.)

[0309] Column: Combine GPC-KF-801, GPC-KF-802, GPC-KF-803 and GPC-KF-804

[0310] Mobile phase: tetrahydrofuran containing 0.5% by weight phosphoric acid.

[0311] Synthesis of Copolymer (A)

Synthetic example 1

[0313] 1 part by weight of azobisisobutyronitrile, 4 parts by weight of cumyl dithiobenzoate and 50 parts by weight of diethylene glycol ethyl methyl ether were added to a flask equipped with a condenser tube and a stirrer. Next, 80 parts by weight of glycidyl methacrylate and 20 parts by weight of styrene were added, and after replacing with nitrogen, the mixture was slowly stirred. The temperature of the reaction solution was raised to 60° C., and the temperature was maintained for 24 hours, then 3 parts by weight of azobisisobutyronitrile was added, and then stirred at 60° C. for 4 hours, and 200 parts by weight of diethylene glycol ethyl methyl ether was added, A solution of the copolymer (A-1) was obtained. The polystyrene conversion weight average molecular weight (Mw) of copolymer (A-1) was 10,000, the molecular weight distribution (Mw / Mn) was 1.3, and the residual monomer was 1.7 weight%. The solid content concentration of the polymer solution was 29.7% by weight.

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Abstract

The present invention provides a curable resin composition capable of forming a protective film for an optical device, which satisfies required transparency, heat resistance, surface hardness, and adhesion, and which is stable even under heating. It is excellent in load resistance, has few sublimated substances during baking, and is also excellent in the performance of flattening the level difference of the color filter formed on the base substrate. This curable resin composition contains (A) and (B), wherein said (A) has two or more epoxy groups and is a polystyrene-equivalent weight average molecular weight (Mw) measured by gel permeation chromatography A polymer whose ratio (Mw / Mn) to the polystyrene-equivalent number average molecular weight (Mn) is 1.7 or less, and (B) is a cationically polymerizable compound different from the component (A). The present invention also provides a protective film formed from the composition, and a method for forming the protective film.

Description

technical field [0001] The present invention relates to a curable resin composition, and particularly to a curable resin composition suitable as a protective film forming material used in optical devices such as liquid crystal display elements (LCD) or charge-coupled devices (CCD) or CMOS sensors. A protective film formed from the composition and a method for forming the protective film. Background technique [0002] In the steps of manufacturing optical devices such as LCDs or CCDs, the display elements are treated by immersion in solvents, acids, or alkalis. In addition, when the wiring electrode layer is formed by sputtering, the surface of the element is locally exposed to high temperature. Therefore, in order to prevent Display elements are degraded or damaged by the above-mentioned treatment, and a protective film resistant to the above-mentioned treatment has conventionally been provided on the surface of the display element. [0003] The protective film is required ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/20H01L23/29H01L23/31G03F7/00G03F7/038
CPCG03F7/0007G03F7/038H01L23/293H01L2924/0002H01L2924/00C08G59/20C08G59/24C08J5/22
Inventor 梶田彻马场厚志保浩司
Owner JSR CORPORATIOON