Prefabricated method for thin film microcrack and special apparatus for the same

A thin-film material and micro-crack technology, applied in microstructure devices, manufacturing microstructure devices, measuring devices, etc., can solve the problems of difficult to control crack length, difficult to measure crack length, dynamic instability, etc., to achieve simple and improved stress field. Accuracy, effect of crack shape rules

Inactive Publication Date: 2007-02-28
INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

Due to the limitation of the size of MEMS materials and the particularity of preparation, traditional mechanical property testing techniques and equipment have encountered great difficulties and challenges in the testing of MEMS materials. In recent years, scholars have carried out extensive and in-depth explorations in this area. Various methods such as nanoindentation method, scratch method and uniaxial stretching method have been proposed, but these methods are quite different, and they are especially unreliable in terms of film crack sensitivity and toughness testing
In the study of the mechanical properties of multilayer films, because the multilayer film structure can improve the toughness of the material, the toughness enhancement mechanism is mainly crack tip passivation,

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  • Prefabricated method for thin film microcrack and special apparatus for the same
  • Prefabricated method for thin film microcrack and special apparatus for the same
  • Prefabricated method for thin film microcrack and special apparatus for the same

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Embodiment Construction

[0029] The present invention will be further described below in conjunction with the embodiments and the accompanying drawings.

[0030] As shown in Figure 1-2, the micro-crack prefabrication device of film material of the present invention mainly consists of stage 1-2, dynamometer 1-7, pressure wheel fixed beam (frame) 1-4, load adjustment knob 1-5 Composed of pressure rollers 1-9, a force gauge 1-7 for measuring the load pressure is installed on the stage 1-2, and the pressure rollers arranged vertically and parallel are fixed by fixing bolts 1-6 on both sides of the stage 1-2. The fixed arm 1-3 is fixed, and the top of the two parallel fixed arms 1-3 is provided with a fixed beam 1-4, and the center shaft hole of the pressure wheel 1-9 is equipped with a pressure wheel fixing pin 2-1, and the pressure wheel 1-9 is connected to the pressure roller support rod 1-10 through the pressure roller fixing pin 2-1, and the pressure roller support rod 1-10 passes through the pressure...

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Abstract

The invention discloses a film material micro-cracking preparing method and specific device, which comprises the following steps: fixing film material on the polishing surface of silicon single-wafer, cutting the silicon single-wafer with film material into piece sample, adhering multiple piece samples into block sample with the direction of piece samples consistent, setting film material between two silicon single-wafers, falling the pressurized wheel on one side of micro-crack, making the surface with micro-crack in the whole sliding course to generate micro-crack under the trace. The device is composed of objective table, force gauge, pressurized wheel fixing beam, load adjusting button and pressurized wheel.

Description

technical field [0001] The invention relates to a method for prefabricating microcracks by adhering thin film materials on a single crystal silicon substrate, specifically a method for prefabricating microcracks of thin film materials under load control by using a WC (tungsten carbide) pressure wheel and a special device thereof. Background technique [0002] In recent years, thin-film materials have attracted great attention due to their unique microstructure, physical and chemical properties. With the development of thin-film materials themselves towards functionalization, complexity and low Electromechanical Systems (MEMS) field. With the development and deepening of MEMS research, the basic material properties such as characterizing and testing the mechanical properties of materials have become the key factors to improve the life and reliability of MEMS devices. Due to the limitation of the size of MEMS materials and the particularity of preparation, traditional mechani...

Claims

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Application Information

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IPC IPC(8): B81C1/00G01L1/00
Inventor 谭军张磊万晔温井龙姚戈
Owner INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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