Magnesium-alloy surface coating method
A surface coating, magnesium alloy technology, used in sputtering, ion implantation, vacuum evaporation, etc.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0019] After cleaning the surface of the magnesium alloy parts to be plated, place them in a vacuum sputtering tank for sputtering of copper metal films. The process conditions of vacuum sputtering are: background vacuum<2.0e~4mbar, working vacuum 1 -3e~3mbar, the number of targets is 2, the working power is 15KW, the chain speed is 15Hz, and the number of passes is 1.
[0020] The surface of the obtained copper metal plating is dense, the film thickness is uniform, and the adhesion is good. After the peeling test of the coating with 3M gummed paper, no plating phenomenon occurs, and the same effect as chemical plating is achieved.
Embodiment 2
[0022] After cleaning the surface of the magnesium alloy parts to be plated, place them in a vacuum sputtering tank for sputtering of stainless steel films. The process conditions of vacuum sputtering are: background vacuum <2.0e~4mbar, working vacuum 1- 3e~3mbar, the number of targets is 2, the working power is 12KW, the chain speed is 15Hz, and the number of passes is 1.
[0023] The surface of the obtained copper metal plating is dense, the film thickness is uniform, and the adhesion is good. After the peeling test of the coating with 3M gummed paper, no plating phenomenon occurs, and the same effect as chemical plating is achieved.
Embodiment 3
[0025] After cleaning the surface of the magnesium alloy parts to be plated, place them in a vacuum sputtering tank for sputtering of copper metal films. The process conditions of vacuum sputtering are: background vacuum<2.0e~4mbar, working vacuum 1 -3e~3mbar, the number of targets is 1, the working power is 13KW, and the chain speed is 12Hz.
[0026] The surface of the obtained copper metal plating is dense, the film thickness is uniform, and the adhesion is good. After the peeling test of the coating with 3M gummed paper, there is no plating phenomenon, and the same effect as chemical electroplating is achieved.
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com