Poly 4-methyl-1-pentene resin composition, film, and die for manufacturing electronic component seal

A technology of resin composition, pentene resin, which is applied to in-use molds to achieve the effect of good mold release, excellent heat resistance and mold release, and high value

Active Publication Date: 2007-07-04
MITSUI CHEM INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is a problem of durability during repeated use

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0078] (Preparation of solid catalyst components)

[0079] 750g of anhydrous magnesium chloride, 2800g of decane and 3080g of 2-ethylhexanol were heated at 130°C for 3 hours to form a uniform solution, and then 220mL of 2-isobutyl-2-isopropyl was added to the solution Yl-1,3-dimethoxypropane, and then stirred and mixed at 100°C for 1 hour. The homogeneous solution thus obtained was cooled to room temperature, and then 3000 mL of the homogeneous solution was added dropwise to 800 mL of titanium tetrachloride kept at -20°C under stirring, and the addition was completed in 45 minutes. After the dripping was completed, the temperature of the mixed solution was increased to 110°C in 4.5 hours, and when it reached 110°C, 5.2 mL of 2-isobutyl-2-isopropyl-1,3-dimethoxypropane was added, And keep this temperature and stir for 2 hours. After the completion of the reaction for 2 hours, the solid part was collected by hot filtration, the solid part was resuspended in 1000 mL of titanium tetra...

Embodiment 2

[0087] Except for adjusting the polymerization amount of the first stage polymerization and the second stage polymerization so that the mass ratio of polymer (A) to polymer (B) is polymer (A) / polymer (B)=5 / 95, the same as in Example 1 The polymerization is carried out in the same manner, and the obtained powder is melt-kneaded to obtain pellets. The MFR of the obtained pellets was 25 g / 10 minutes. Then, the film was formed, and the evaluation results of the physical properties of the film are shown in Table 1.

Embodiment 3

[0089] Except for adjusting the polymerization amount of the first stage polymerization and the second stage polymerization, so that the mass ratio of polymer (A) to polymer (B) is polymer (A) / polymer (B)=50 / 50, the same as in Example 1. The polymerization is carried out in the same manner, and the obtained powder is melt-kneaded to obtain pellets. The MFR of the obtained pellets was 25 g / 10 minutes. Then, the film was formed, and the evaluation results of the physical properties of the film are shown in Table 1.

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Abstract

To provide a resin composition that has a short semicrystallization time, and when molded into film, a film bears a high degree of surface crystallization and a small blocking coefficient. Further, to provide a release film having good releasability suitable for the production of a FPC, which is obtained by molding the resin composition. Further, to provide a mold for production of a sealed electronic element product having excellent heat resistance and releasibility, in which the mold is hard to deform even when repeatedly used in the production of a sealed electronic element product of an LED or the like, and to provide an LED mold. The invention provides a poly 4-methyl-1-pentene resin composition which comprises a polymer containing 80% by mass or more of 4-methyl-1-pentene in which the resin composition has a melting point of 170 to 240 DEG C and a semicrystallization time of 70 to 220 seconds, and a release film having good releasibility, a mold for production of a sealed electronic element product having excellent heat resistance and releasibility and an LED mold, which are obtained by molding the resin composition.

Description

Technical field [0001] The present invention relates to a poly-4-methyl-1-pentene resin composition having excellent mold release properties. More specifically, it relates to a poly-4-methyl-1-pentene resin composition that has a short half-crystallization time and high surface crystallinity when formed into a film, so the film has a low blocking coefficient and excellent mold release properties, and the resin composition A mold for manufacturing a sealed electronic component obtained by molding the composition, particularly a mold for sealing a light emitting diode (hereinafter abbreviated as LED), a so-called LED mold, and a release film suitable for manufacturing a flexible printed circuit board. Background technique [0002] As we all know, with the rapid advancement of electronic equipment, the integration of ICs is gradually increasing, and printed wiring boards are used in large quantities for the purpose of meeting higher density and high reliability requirements. [0003...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L23/20C08J5/18H01C17/02H05K3/46
CPCH05K3/4611C08L23/24C08J5/18H01C17/02C08J2323/20C08L23/20H01G2/103C08L2666/02C08L2205/02C08L2201/02
Inventor 田中徹广瀬敏行
Owner MITSUI CHEM INC
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