Self-cleaning colloidal slurry composition and process for finishing a surface of a substrate

Abstract

A self-cleaning colloidal slurry and process for finishing a surface of a glass, ceramic, glass-ceramic, metal or alloy substrate for use in a data storage device, for example. The slurry comprises a carrying fluid, colloidal particles, etchant, and a surfactant adsorbed and / or precipitated onto a surface of the colloidal particles and / or substrate. The surfactant has a hydrophobic section that forms a steric hindrance barrier and substantially prevents contaminates, including colloidal particles, from bonding to the substrate surface. The slurry is applied to the surface of the substrate while a pad mechanically rubs the surface. Subsequent cleaning with standard soap solutions removes substantially all remaining contamination from the substrate surface. In an exemplary embodiment, the slurry is used to superfinish a glass disk substrate to a surface roughness of less than 2 Å, with substantially no surface contamination as seen by atomic force microscopy (AFM) after standard soap cleaning steps.

Description

CROSS-REFERENCE TO RELATED APPLICATION CLAIMING BENEFIT UNDER 35 U.S.C. 120 [0001] This application is a divisional application of U.S. patent application Ser. No. 09 / 976,167, filed Oct. 12, 2001, entitled “SELF-CLEANING COLLOIDAL SLURRY COMPOSITION AND PROCESS FOR FINISHING A SURFACE OF A SUBSTRATE”, which is incorporated by reference.FIELD OF THE INVENTION [0002] The present invention relates in general to colloidal slurry compositions and processes for finishing a surface of a substrate. More particularly, the present invention relates to a self-cleaning colloidal slurry composition and process that may be used, for example, to superfinish or texture a surface of a substrate for a data storage device. BACKGROUND [0003] A typical data storage device includes a medium for storing data, typically in magnetic, magneto-optical or optical form, and a transducer used to write and read data respectively to and from the medium. A disk drive data storage device, for example, includes one o...

AI Technical Summary

Benefits of technology

The self-cleaning colloidal slurry achieves a surface roughness of less than 2 Å with minimal contamination, reducing glide failures and maintaining surface stability, thereby enhancing production efficiency and reducing costs while ensuring high data storage device performance.

Problems solved by technology

This is known as a glide defect, which can ultimately cause disk drive failure.

These bumps further cause magnetic defects, corrosion and decreased disk life.

Unfortunately, aluminum-based substrates have relatively low specific stiffness, as well as relatively low impact and dent resistance.

For example, the relatively low specific stiffness of the Al / Mg—NiP substrates (typically 3.8 Mpsi / gm / cc) makes this type of disk substrate susceptible to environmental forces which create disk flutter and vibration and which may cause the read / write head to impact and dent the disk substrate surface.

The surface uniformity of glass substrates can still present a problem, however, especially for low glide heights (typically ≦20 nanometers) and near contact recording.

Standard methods of scrubbing with soaps using polyvinyl alcohol (PVA) pads, ultrasonics or megasonics will not remove any significant percentage of such molecular bonded silica particles.

Just as with aluminum-based substrates, if these particles are left in place on the glass substrate, glide defects occur that can ultimately cause disk drive failure.

These glide defects further cause magnetic defects, corrosion and decreased disk life.

The surface finish of glass and NiP substrates are, however, damaged by such a technique by surface topography change such as pitting and chemical composition changes.

Glass has low resistance to acid etching and overly aggressive acid solutions, such as hydrofluoric acid and caustic etching at high pH's and temperatures.

Damage and compositional change to the superfinished glass surface will adversely affect the morphology of layers deposited by subsequent sputtering processes and can cause magnetic, glide and corrosion failures.

Moreover, acid or base etching adds to the equipment requirements, production cycle times and cost.

However, glass substrates cannot be effectively micropolished because applying the burnishing head to the glass surface can cause micro-fracturing rather than just a surface levelling.

The micro-fractured site becomes a risk for corrosion and / or a growing defect.

Moreover, micropolishing adds to the equipment requirements, production cycle times and cost.

The cleaning polish etch process, however, adds equipment and handling costs.

Nonetheless, without the cleaning polish etch process the surface of the glass substrate can be damaged by using only chemical etch due to the low resistance of the glass material to acid etching or overly aggressive caustic etch solutions.

In addition, because the Ferro SRS 596 slurry contains fumed silica, scratching of the substrate surface results due to the inherent presence of silica aggregates in the fumed silica, limiting the surface finish possible.

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