Selectively doped trench device isolation

Abstract

A selectively doped trench isolation device is provided. The trench isolation device of the preferred embodiment includes a semiconductor substrate having a trench. A thin field oxide layer is grown on the side walls of the trench, and the trench is filled with a heavily doped polysilicon. The work function difference between the substrate and the heavily doped polysilicon increases the field threshold voltage of the gated trench isolation device so that smaller isolation structures can be formed between adjacent active devices in higher density integrated circuits.

Description

RELATED APPLICATIONS [0001] This Application is a divisional application of U.S. patent application Ser. No. 10 / 920,579 filed Aug. 17, 2004, which is a divisional application of Ser. No. 09 / 143,585 filed Aug. 31, 1998, now U.S. Letters Pat. No. 6,781,212 entitled “SELECTIVELY DOPED TRENCH DEVICE ISOLATION”, which are hereby incorporated by reference in their entirety.BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates to semiconductor device design and fabrication and more particularly to trench isolation of such devices. [0004] 2. Description of the Related Art [0005] In the semiconductor industry, there is a continuing trend towards increasing the number of components formed in an area of an integrated circuit. This trend is resulting in Ultra Large Scale Integration (ULSI devices). This trend is driving the semiconductor industry to explore new materials and processes for fabricating integrated devices having sub-micron sized features...

AI Technical Summary

Benefits of technology

The present invention is a process and device for manufacturing a selectively doped trench isolation device. The invention involves forming an isolation structure in a semiconductor material substrate with a first work function, which includes a trench with an insulation layer and a material with a second work function inside the trench. The isolation material can be of the same dopant type as the substrate but with higher concentration. The invention also provides a method for forming the isolation structure by depositing an isolation layer on the inner surfaces of a trench and then positioning a material with a second work function on the inner surfaces of the isolation layer. The higher work function of the isolation material results in a high flat band voltage that prevents current leakages between active devices separated by the isolation device. The invention also allows for control of the threshold voltage through varying the bias on the gate material and forms a higher doped channel stop region adjacent to the interface between the substrate and the isolation region without requiring the use of channel implants or side wall-implants.

Problems solved by technology

This situation presents a special challenge for the isolation structures as these devices must be smaller and yet still provide the necessary isolation.

In fact, the integrity and the reliability of each active device greatly depends on ability to electrically isolate each active device from adjacent active devices as leakage currents from adjacent devices can result in failure.

Although the high field threshold provided by such thick field oxide effectively isolates the active devices, the LOCOS process presents some disadvantages associated with the nature of the oxidation process.

For example, thick isolation structures formed through oxidation consume a considerable amount of area on the chip limiting the amount of area available for active devices and thereby limiting the active device density.

Moreover, during the oxidation process there is lateral encroachment into the active areas of the chip.

This lateral encroachment is known as bird's beak encroachment and it further limits the size of the active areas of the chip and the active device density.

This bird's beak encroachment remains a significant problem even as device dimensions and isolation structure dimensions are decreased to accommodate higher active device densities.

However, scaling down trench dimensions to accommodate higher active device densities on an integrated circuit adversely affects the field threshold voltage and can result in parasitic conduction between the active devices.

Consequently, while trench isolation techniques generally do not have the lateral encroachment problems associated with LOCOS isolation structures, trench isolation structures must still have relatively large minimum dimensions to maintain adequate isolation between adjacent active devices which inhibits significant increase in device density on an integrated circuit.

However, doping trench walls is a tedious and technically difficult process, and the doped implant often has a tendency to diffuse into active device regions, resulting in undesirable changes in device characteristics.

However, as the trench dimensions are reduced, the field threshold voltage of these isolation structures may not be adequately high enough to prevent channel formation.

Moreover, as in the case of silicon oxide filled trenches, poly filled trenches may still require side wall channel stop implants.

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