Printed circuit board and method of manufacturing the same

Abstract

Disclosed herein is a printed circuit board, including: a metal substrate; an anodic oxide layer formed by anodizing the metal substrate; circuit layers formed on the anodic oxide layer; and a first sol-gel layer formed by applying a photocatalytic material between circuit wirings of the circuit layers and then curing the applied photocatalytic material. The printed circuit board is advantageous in that it can be realized into a high-voltage package printed circuit board because a sol-gel layer is formed between circuit wirings of circuit layers.

Description

CROSS REFERENCE TO RELATED APPLICATION[0001]This application claims the benefit of Korean Patent Application No. 10-2010-0048232, filed May 24, 2010, entitled “Printed circuit board and the method of manufacturing thereof”, which is hereby incorporated by reference in its entirety into this application.BACKGROUND OF THE INVENTION[0002]1. Technical Field[0003]The present invention relates to a printed circuit board and a method of manufacturing the same.[0004]2. Description of the Related Art[0005]Recently, alongside the rapid advancement of semiconductor technology necessary for signal processing, the development of semiconductor devices has been remarkable. Simultaneously, semiconductor packages, such as SIPs (system in packages), CSPs (chip sized packages), FCPs (flip chip packages) and the like, which are formed by mounting an electronic device, such as a semiconductor device, on a printed circuit board, have been under active development. Recently, with the advance of semiconduc...

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Benefits of technology

[0009]Accordingly, the present invention has been devised to solve the above-mentioned problems, and the present invention provides a printed circuit board, which can improve heat radiation performance and can prevent an electric short from occurring between the circuit wirings of a circuit layer because a sol-gel layer is formed between the circuit wirings of the circuit layer and which can increase the heat radiation effect because an anodic oxide layer is removed from one side of a metal substrate, that is, the one side thereof not provided with a circuit layer, and provides a method of manufacturing the same.

Problems solved by technology

Therefore, the conventional high-power semiconductor package 100 provided with the radiation plate 180 is problematic in that the base layer 110 is additionally required in order to provide the radiation plate 180, its thickness cannot be easily adjusted because the radiation plate180 is additionally provided, and its size cannot be easily decreased.

Further, the conventional high-power semiconductor package 100 is problematic in that the rapidity and reliability of the processes are deteriorated because the process of attaching the base layer 110 must be performed in addition to the process of mounting a semiconductor chip using a lead frame and a wire bonding process.

Further, the conventional high-power semiconductor package 100 is problematic in that the total manufacturing cost thereof is increased because the base layer 180 is provided and the adhesive layer 185 is used.

Furthermore, the conventional high-power semiconductor package 100 is problematic in that the desired heat dissipation effect cannot be sufficiently realized because the rate of heat radiation possible using the radiation plate 180 is limited.

In this case, there is a problem in that an electric short occurs between the circuit wirings of a circuit layer.

Moreover, there is a problem in that an electric short occurs due to the instability of the insulation layer during a process of precipitating residues of a metal layer for forming a circuit layer or additives (Mg, Si, Cu and the like) in anodic oxidation.

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