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Photosensitive coating resin of auxiliary plates for drilling and application thereof

a technology of coating resin and auxiliary plates, applied in the field of resin composition, can solve the problems of lubricating resin coated on the cover having problems such as flowing over, residue, or even blocking holes, and drilling holes tipped,

Inactive Publication Date: 2016-02-04
GTA ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The patent text describes a resin composition and drilling auxiliary plate for PCBs. The drilling auxiliary plate has a lubricating resin layer made by coating the resin composition on a substrate and curing it using illuminating or baking. The technical effects of this invention include improving the drilling process of PCBs by reducing friction and wear, and achieving better hole quality. The invention also provides a better understanding of the purpose, features, and effects of the invention through the detailed description of its composition and use in different examples.

Problems solved by technology

However, due to low melting point, the lubricating resin coated on the covers has problems of flowing over, residue, or even blocking holes.
During drilling process, an instantaneous temperature reaches approximately 200° C. due to friction between drill bits and PCBs to be drilled, but the melting point of known lubricating resin is about 60° C. Secondly, because lubricating resin does not adheres well to aluminum foil, resin with high hardiness is often chosen to be the undercoat.
This method is complicated, and if the undercoat resin remains in the holes on PCBs, it will cause problems such as broken copper or diffusion of coating during electroplating process.
Although the methods mentioned above improved drilling quality, low melting points of the coating resin cause curling problems, which lead to tilting problems of drill bits and decreasing positioning accuracy.
However, the method mentioned above must have an additional thermosetting resin layer, which increases complexity of the manufacturing process, and the high hardness of the resin may lead to drill bits slipping, which causes shifting of holes, or drill bits breaking.
In addition to extending manufacturing time, the baked resin layer may have problems of inconsistent functions and uneven coating thickness due to inconsistent molecular weights of the resin and different evaporation rates of solvent, which may hinder the following drilling application.
The concern of inconsistent molecular weights may lead to problems of drill bit getting stuck, degumming of coating layers, and contaminating walls of the drilled holes.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0028]One mole of polyether amine (Huntsman JEFFAMINE® D-4000) is mixed with 1 mole of 1,2,4,5-Benzenetetracarboxylic dianhydride, and the mixture reacts at 20° C. for 12 hours to form the first polymer of formula (I), in which the reaction is shown as follows:

[0029]wherein n is an integer from 2 to 100, and m is an integer from 1 to 1000.

[0030]In addition, 1 moles of polyether amine (Huntsman JEFFAMINE® D-4000) and 2 mole of vinyl chloride react at 20° C. for 12 hours to form the second polymer of formula (II), in which the reaction is shown as follows:

[0031]wherein o is an integer from 2 to 100.

[0032]One unit of the first polymer of formula (I) and 1 unit of the second polymer of formula (II) are further mixed well with 3% of photoinitiator (1173) and 1% of photosensitizer (ITX) based on the second polymer to produce the resin composition of the present invention. Fifty micrometers in thickness of the resin composition is directly coated on aluminum foil (material: A1N30) with 100...

example 2

[0034]The first polymer of formula (I) and the second polymer of formula (II) are polymerized by the method of Example 1, and the product is coated and drilled under the same condition as Example 1. The composition comprises polymers of formula (I) and formula (II), wherein the proportion of the polymer of formula (I) and the polymer of formula (II) is 1:2, and the drilling auxiliary plate is made under the same condition of photoreaction as Example 1. The drilling results are shown in Table 1.

example 3

[0035]The polymers of formula (I) and formula (II) are polymerized by the method of Example 1, and the product is coated and drilled under the same condition as Example 1. The composition comprises polymers of formula (I) and formula (II), wherein the proportion of the polymer of formula (I) and the polymer of formula (II) is 2:1, and the drilling auxiliary plate is made under the same condition of photoreaction as Example 1. The drilling results are shown in Table 1.

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PUM

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Abstract

A photosensitive resin composition and auxiliary plates for drilling are introduced. The auxiliary plates are made by coating the photosensitive resin composition on aluminum foil and photocuring the coated resin to make the resin bonded on the aluminum foil. The resin composition comprises a first polymer formed by the reaction of 1,2,4,5-pyromellitic dianhydride and polyetheramine; and a second polymer formed by the reaction of polyetheramine and vinyl chloride, wherein the second polymer is a photosensitive polymer. The novel resin composition provided by the present invention can be coated on drilling auxiliary plates. When the drilling auxiliary plates coated with the resin composition are used in a drilling process, it can avoid the coated resin being cracked due to the heat caused by friction of high speed drilling, so it can further enhance the stability, accuracy, and precision of drilling.

Description

FIELD OF THE INVENTION[0001]The invention relates to a resin composition, especially a coating resin composition that is applied to auxiliary plates used in a drilling process.BACKGROUND OF THE INVENTION[0002]Printed circuit boards (PCBs) provide electronic connection among electronic components and have been developed for about a hundred years. PCBs are made by using insulating plates as substrates, which are cut to a certain size, and having at least one conductive pattern and holes (such as component holes, fastening holes, or metallizing holes) on the substrates to connect electronic components. A common method of manufacturing multilayer PCBs is stacking copper-plated laminates, placing a cover plate on the obtained stack, drilling small holes from the top of the stack, and then connecting holes by electroplating. Therefore, selecting proper materials of cover plates can usually prevent irregular holes, reduce burrs, and improve positioning accuracy.[0003]Recently, because elec...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C10M107/44
CPCC10M107/44C10M2217/0443C10M2217/0465C10M107/40C10M2217/0415C09D4/00C09D5/00C10N2040/14C10N2050/14
Inventor TSAI, YUNG-CHI
Owner GTA ELECTRONICS CO LTD
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