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CMOS image sensor with compact pixel layout

a pixel layout and image sensor technology, applied in the field of image sensors, can solve the problems of large pixel arrays and large overall area, and achieve the effect of increasing compactness and conversion gain performan

Active Publication Date: 2020-07-30
SMARTSENS TECH (HK) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This solution enables increased compactness and performance of image sensor pixel arrays, enhancing dynamic range and conversion gain, particularly in high light conditions, while maintaining reduced pixel area and power consumption.

Problems solved by technology

However, miniaturization has led to pixel arrays becoming much larger in the number of pixels, but not much larger in overall area due to the use of narrower interconnect lines and smaller electronic components in the pixels and in the readout and control circuits.

Method used

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  • CMOS image sensor with compact pixel layout
  • CMOS image sensor with compact pixel layout

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Experimental program
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first embodiment

[0028]FIG. 3 is an electrical schematic diagram of dual pixel unit 300 whose layout is illustrated in FIG. 5 in accordance with the invention. The electrical schematic diagram shown in FIG. 3 more clearly illustrates the electrical connections between the electrical components depicted in the layout illustrated in FIG. 5. The component names are common in both figures and will be used in the description of the operation of the dual pixel unit 300. FIG. 3 depicts a set of two transfer transistors (TXa, TXb), each coupled to respective photodiodes (PDa, PDb) and coupled to and sharing a floating drain (FD) for accumulating and transferring an image charge in response to light incident upon the photodiodes. Also residing on pixel unit 300 are a reset transistor (RST) and an amplifier transistor (SF) for converting the image charge to an image signal (PIXO) for coupling out of pixel unit 300. A power supply provides voltage VDD to both reset transistor RST and source follower transistor...

second embodiment

[0029]FIG. 4 is an electrical schematic diagram of dual pixel unit 400 whose layout is illustrated in FIG. 6 in accordance with the invention. The electrical schematic diagram shown in FIG. 4 more clearly illustrates the electrical connections between the electrical components depicted in the layout illustrated in FIG. 6. The component names are common in FIGS. 3, 4, 5, and 6, and will be used in the description of the operation of the pixel unit. FIG. 4 illustrates a pixel unit 400 like that illustrated in FIG. 3 with the addition of a signal dynamic range enhancing feature based on modifying conversion gain. Pixel unit 400 includes Double Conversion Gain capability as provided by dynamic range enhancement capacitor Cdcg and capacitor control transistor DCG. By switching in capacitor Cdcg through the action of capacitor control transistor DCG the pixel unit conversion gain is modified to accommodate higher or lower illumination incident of the photodiodes leading to increased dynam...

third embodiment

[0035]FIG. 7 is an electrical schematic diagram of dual pixel unit 700 whose layout is illustrated in FIG. 9 in accordance with the invention. The electrical schematic diagram shown in FIG. 7 more clearly illustrates the electrical connections between the electrical components depicted in the layout illustrated in FIG. 9. The component names are common in both figures and will be used in the description of the operation of the pixel unit. FIG. 7 depicts a set of two pairs of transfer transistors (TXa and TXb, TXc and TXd), each pair of transistors coupled to respective photodiodes (PDa and PDb, PDc and PDd). Each pair of transfer transistors are also coupled to and sharing a floating drain (FD1 and FD2) for accumulating and transferring an image charge in response to light incident upon the photodiodes. Also residing on pixel unit 700 are a reset transistor (RST) and an amplifier transistor (SF) for converting the image charge to an image signal (PIXO) for coupling out of pixel unit...

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PUM

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Abstract

An image sensor array of shared pixel units fabricated by a CMOS technology, wherein each pixel unit includes a plurality of photodiodes and respective transfer transistors and floating drains whose layout constitutes mirror images. The plurality of photodiodes each share a single reset transistor and source follower amplifier transistor wherein the shared floating diode is spaced at the minimum distance from a gate electrode of the source follower transistor as is allowed by the CMOS fabrication technology chosen to manufacture the image sensor array.

Description

BACKGROUND OF THE INVENTIONField of the Invention[0001]This invention relates generally to image sensors, and more particularly to CMOS image sensors. The present invention provides an image sensor array and circuit design employing a compact pixel unit layout to enable very large pixel arrays. An image sensor comprising the invented circuit design may be incorporated within a digital camera.Description of Related Art[0002]An image capture device includes an image sensor and an imaging lens. The imaging lens focuses light onto the image sensor to form an image, and the image sensor converts the light into electrical signals. The electric signals are output from the image capture device to other components of a host electronic system. The image capture device and the other components of a host electronic system form an imaging system. Image sensors have become ubiquitous and may be found in a variety of electronic systems, for example a mobile device, a digital camera, a medical devi...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H01L27/146H04N5/3745
CPCH04N5/378H01L27/14641H04N5/3745H01L27/14643H01L27/14603H01L27/14612H04N25/778H04N25/77H04N25/57H04N25/75
Inventor XU, CHENSHAO, ZEXUWANG, XIN
Owner SMARTSENS TECH (HK) CO LTD