Process for preparing lead sulfur family compound semiconductor single crystal
A technology of chalcogenides and semiconductors, applied in chemical instruments and methods, single crystal growth, single crystal growth, etc., can solve the problems of long cycle, slow growth speed, small crystal size, etc., and achieve the effect of fast growth rate
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Embodiment 1
[0016] Preparation of PbS semiconductor single crystal:
[0017] (1) Metal Pb powder and chemical element S powder with a high purity of 99.9999% (6N, that is, the purity of 6 nines) are used, and weighed according to a 1:1 molar (mol) ratio, wherein considering the volatilization of S, the S powder is usually Add 0.1% amount again, both are placed in the raw material melting reaction zone of the lower end of outer quartz tube; PbS semiconductor seed crystal is placed at the shrinkage narrow tube neck of inner quartz tube top in addition, and its crystal face can be selected as ( 100), (110) or (111);
[0018] (2) The bottom edge of the inner quartz tube with an open bottom and the tube wall at the lower part of the outer quartz tube are welded by brazing to fix the inner quartz tube; then the narrow neck of the outer quartz tube is shrunk on the upper part Use a vacuum pump to evacuate the vacuum to make the vacuum in the quartz tube reach 10 -4 Pa or 10 -5 Pa, followed by...
Embodiment 2
[0023] The steps for preparing a PbSe semiconductor single crystal in this embodiment are exactly the same as those in the above-mentioned embodiment 1. The difference is: metal Pb powder with 6N purity and chemical element Se powder are used, weighed at a mol ratio of 1:1, and the excess of Se powder is increased by 0.1%; the raw materials Pb and Se are heated in a vertical heating furnace to the melting point of PbSe at 1065°C , after reaching the melting point, rise 20°C to 1085°C, keep melting, and then drop to the melting point temperature of 1065°C after 1 day.
[0024] The obtained PbSe semiconductor single crystal has an average single crystal diameter of 25-30mm according to detection.
Embodiment 3
[0026] Preparation of PbTe semiconductor single crystal:
[0027] The steps for preparing a PbTe semiconductor single crystal in this embodiment are exactly the same as those in the above-mentioned embodiment 1. The difference is: use metal lead powder with 6N purity and chemical element Te powder, and weigh according to 1:1 mol ratio, wherein Te powder is increased by 0.1% in excess; the raw materials Pb and Te are heated to the melting point of PbTe at 924°C in a vertical heating, After reaching the melting point, raise the temperature by 20°C, raise the temperature to 944°C, keep melting, and then cool down to the melting point temperature of 924°C after 1 day.
[0028] The obtained PbTe semiconductor single crystal has an average single crystal diameter of 25-30 mm according to detection.
[0029] The essence of the method of the invention is to grow and prepare a semiconductor single crystal through melt vapor deposition, and grow a single crystal material according to a...
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