Copper foil on thin-film for integrated circuit chip, plasma displaying device or high-efficient printing circuit board
A plasma display and printed circuit board technology, applied in the fields of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the problems of poor linearity of the circuit, difficulty in cutting out precise graphics, undulating shape of the circuit, etc.
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Embodiment 1
[0144] The original foil 1, the original foil 2, the original foil 3, and the original foil 4 were subjected to antirust treatment and silane coupling agent treatment I by electroplating H, respectively. After that, it adhered to the polyimide film manufactured by A manufacturer under high temperature and high pressure conditions, and the adhesiveness was good at this time. A dry film protective layer is pasted on the copper foil surface, etched, and a resin substrate for COF (COF) is produced. When this resin substrate for COF was produced, the circuit did not have an undulating shape, and the linearity of the circuit was excellent, and a width of 15 μm was completed. COF with precise pattern of 15μm between conductors. By pattern-etching the removed polyimide film and aligning the COF while identifying the integrated circuit, the position of the integrated circuit can be easily confirmed from the film, and the integrated circuit and the COF circuit can be correctly connecte...
Embodiment 2
[0146] The raw foil 1, the raw foil 2, the raw foil 3, and the raw foil 4 are nickel-plated by electroplating A, and galvanized by electroplating B. Thereafter, antirust treatment and silane coupling agent treatment I are performed by electroplating H, respectively. When the polyimide film made by manufacturer A was adhered to the surface of this copper foil under high temperature and high pressure conditions, the adhesion was good. Then, a dry film protective layer was pasted on the surface of the copper foil, and etching was performed to prepare a resin substrate for COF (COF). When this resin substrate for COF was fabricated, the circuit did not have an undulating shape, and the linearity of the circuit was excellent, and a COF with a precise pattern with a width of 15 μm and a conductor interval of 15 μm was completed. By pattern-etching the removed polyimide film and aligning the COF while identifying the integrated circuit, the position of the integrated circuit can be ...
Embodiment 3
[0148] After the original foil 1, the original foil 2, the original foil 3, and the original foil 4 were finely roughened by electroplating C, antirust treatment and silane coupling agent treatment I were respectively performed by electroplating H. The surface of this copper foil was coated with a polyimide resin manufactured by manufacturer B, and the resin was cured by heating to form a film, followed by heat aging treatment to obtain a copper-clad polyimide film. Adhesion between copper and polyimide in this copper-pasted polyimide film was good. Then, a dry film protective layer was pasted on the surface of the copper foil, and etching was performed to prepare a resin substrate for COF (COF). When this resin substrate for COF was fabricated, the circuit did not have an undulating shape, and the linearity of the circuit was excellent, and a COF with a precise pattern with a width of 25 μm and a conductor interval of 25 μm was completed. By pattern-etching the removed polyi...
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