White bias to blue paster type light-emitting diode and producing method thereof
A technology of white-to-blue patch type and light-emitting diodes, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of unsatisfactory, poor luminous efficiency, and incomplete satisfaction, etc., and achieve small size, uniform distribution, and energy-saving effects significant effect
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Embodiment 1
[0027] Embodiment 1: as figure 1 As shown, the white bluish SMD LED includes a blue chip 1, a wire 2, a printed circuit board 4 and a fluorescent rubber cake 3, the fluorescent rubber cake 3 covers the blue chip 1, and the wire 2 connects the positive and negative of the blue chip 1. The pole is connected to the printed circuit board 4, the fluorescent rubber cake 3 is epoxy resin containing yellow phosphor powder, the blue light chip 1 is an ordinary Ni / Au nitride blue light emitting diode chip, and its wavelength is 462.5-465nm, and the fluorescent rubber cake 3 The yellow fluorescent powder is cerium-doped yttrium aluminum garnet phosphor, the thickness of fluorescent rubber cake 3 is 0.3mm, and the raw material of fluorescent rubber cake 3 per 100 grams is: 9 grams of yellow fluorescent powder, of which dysprosium Dy0.03 grams, epoxy 91 grams of resin, the principle of the present invention is to use 462.5-465nm blue light chips to excite yellow phosphor powder to make it ...
Embodiment 2
[0028] Embodiment 2: The thickness of fluorescent rubber cake 3 is 0.35mm, and the raw material of every 100 grams of fluorescent rubber cake 3 is: 6 grams of yellow fluorescent powder, wherein dysprosium Dy 0.04 grams, epoxy resin 94 grams, all the other are the same as embodiment 1.
Embodiment 3
[0029] Embodiment 3: The technological process of the white bluish patch type light-emitting diode is as follows: a. expand the core of the original blue light disc to make the spacing meet the production requirements, b. put silver glue on the 4 circuits of the printed circuit board for pasting Blu-ray chip 1, c. paste the blue-ray chip 1 on the silver glue, and then cure it at a temperature of 100°C-180°C, d. clean it with plasma ion spraying, restore the surface of the printed circuit board 4 and the blue-ray chip 1, e. Use ultrasonic welding wires 2 to connect the positive and negative poles of the blue light chip 1 to the printed circuit board 4, f. hot press with epoxy resin containing yellow phosphor, and cover the blue light chip 1 to protect the circuit and the blue light chip 1, g. At 100°C-180°C temperature, fully cure the epoxy resin, h. Level the PCB 4, attach the adhesive tape on the back of the PCB 4, then stick it on the cutting ring, and cut it into the final p...
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