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Lead-free welding flux alloy suitable for dissimilar metals soldering flux of aluminum and copper

A lead-free solder alloy, dissimilar metal technology, used in metal processing equipment, welding/welding/cutting items, welding/cutting media/materials, etc. And other issues

Inactive Publication Date: 2007-08-01
GUANGZHOU RES INST OF NON FERROUS METALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, widely recommended lead-free solders such as Sn-3.0Ag-0.5Cu and Sn-0.7Cu alloys can form a good wetting bond with copper, but the mutual solubility with metal aluminum is small and cannot be very good. Good compatibility with brazing of Cu-Al dissimilar metals
Due to the brittleness of intermetallic compounds, the strength and toughness of welded joints are greatly reduced, and thermal cracks are easily caused, which significantly reduces the reliability of welded joints
At the same time, silver also increases the cost of solder alloys and limits the use of Sn-Ag-Cu alloys.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0015] In the preparation process of the alloy of the present invention, since the differences in the melting points of Sn, Zn, Cu, Ce, and P increase, and Ce, Zn, and P are easily burned, in order to accurately control the alloy composition and ensure product quality, an intermediate alloy is used. Various alloying elements are added in the form of , the preparation method is as follows:

[0016] Sn-Cu master alloy: Add 99.95% refined Sn into the graphite crucible, heat up after melting, and add 99.95% pure Cu to the melting temperature of Cu. The mass percentage of refined Sn and pure Cu is prepared according to 90:10, stirred evenly, left standing, and casted into a Sn-Cu master alloy ingot with a Cu content of 10%.

[0017] Sn-Zn master alloy: Add 99.95% refined Sn into the graphite crucible, heat up after melting, and add 99.95% Zn to the melting temperature of Zn. The mass percentage of refined Sn and Zn is prepared according to 91:9, stirred evenly, left standing, and ...

Embodiment 1

[0021] Embodiment 1: Each component is calculated by weight percentage: Zn 0.7%, Cu 0.6%, Ce 0.01%, P 0.002%, Ga 0.0015%, and the balance is Sn.

Embodiment 2

[0022] Example 2: The components are: Zn 0.9%, Cu 0.8%, Ce 0.05%, P 0.0265%, Ga 0.0118%, Ge 0.0117% by weight percentage, and the balance is Sn.

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PUM

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Abstract

A lead-free solder alloy suitable for copper-aluminum heterogenic metal soft braze welding. The weight percentage of its components is the following: Zn 0.1 ~ 3.0, Cu 0.2 ~ 3.5, Ce 0.001 ~ 0.6, P 0.001 ~ 0.14, Ge or / and Ga 0. 001 ~ 0.13 and the rest is Sn. The solder alloy in the invention has better spreading property on the connection of copper-aluminum heterogenic metal, and the extensibility of alloy is better than Sn-0.7Cu and Sn63Pb37 solder alloy, it applies to soft braze welding of copper-aluminum heterogenic metal.

Description

technical field [0001] The invention relates to a lead-free solder alloy for brazing dissimilar metals, in particular to a lead-free solder alloy suitable for soldering copper and aluminum dissimilar metals. Background technique [0002] With the continuous development of the electronic information industry, the number of electronic products has increased dramatically. Due to its good electrical conductivity, thermal conductivity and corrosion resistance, copper is widely used in printed circuit boards and various wires, and its demand is increasing. However, it is affected by the reserves in nature and cannot meet the needs of social development. The massive consumption of non-renewable resources such as metal copper makes people strongly aware that resources must be used rationally and effectively. In consideration of resource utilization and material cost, it has been proposed that the development of certain products (such as copper wires) should be replaced by aluminum ...

Claims

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Application Information

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IPC IPC(8): B23K35/26B23K103/18
Inventor 张宇航戴贤斌罗时中李楚宏孙福林高承仲
Owner GUANGZHOU RES INST OF NON FERROUS METALS
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